Recovery, Recrystallization and Grain Growth

MM 205
Lecture 4
Recovery, recrystallization and grain growth

Cold work
▪ Plastic deformation in the temperature range (0.3 – 0.5) Tm → COLD WORK
▪ During cold work the point defect density (vacancies, self interstitials…) and dislocation
density increase. Typical cold working techniques are rolling, forging, extrusion etc.
▪ Cold working is typically done on ductile metals (e.g. Al, Cu, Ni)
↑ point defect density

Cold work
↑ dislocation density
❑ Point defects and dislocations have strain energy associated with them.
❑ (1 -10) % of the energy expended in plastic deformation typically is stored in the form of
strain energy (in these defects) → The material becomes battery of energy!
❑ The cold worked material is in a microstructurally metastable state.
❑ Depending on the severity of the cold work the dislocation density can increase 4-6 orders
of magnitude or more. The material becomes stronger, but less ductile.
▪ The cold worked material is stronger (harder), but is brittle.
▪ Heating the material (typically below 0.5 Tm) and holding for sufficient time is a heat treatment
process called annealing.
▪ Depending on the temperature of annealing, processes like Recovery (at lower temperatures) or
Recrystallization (at higher temperatures) may take place. During these processes the material tends
to go from a microstructurally metastable state to a lower energy state (towards a stable state).
▪ Further ‘annealing’ of the recrystallized material can lead to grain growth.
↑ point defect density

Cold work Material tends to lose
↑ dislocation density Anneal the stored strain energy
Increase in strength Softening of the material

of the material
Low T
Recovery
Cold work Anneal
Recrystallization
High T
Overview of processes taking place during annealing of cold worked material and the driving
force for these processes
Driving force is free energy stored in

point defects and dislocations
Cold work Anneal Recovery
Driving force is free energy stored in dislocations Recrystallization
Driving force is free energy stored in grain boundaries Grain growth

Recovery
❑ Recovery takes place at low temperatures of annealing

❑ Excess point defects created during Cold work are absorbed:
► at surface or grain boundaries
► by dislocation climb
❑ Random dislocations of opposite sign come together and annihilate each other
❑ Dislocations of same sign arrange into low energy configurations:
► Edge → Tilt boundaries
► Screw → Twist boundaries
➔ POLYGONIZATION
❑ Overall reduction in dislocation density is small
Polygonization
• Dislocations of like sign assemble into boundaries
• Localizes lattice curvature into polygonal regions
• Thus low angle grain boundaries or subgrains are

formed
Recrystallization
❑ Trecrystallization  (0.4 – 0.5) Tm

❑ “Nucleation” and growth of new, strain free crystals
❑ Nucleation of new grains in the usual sense may not be present and grain boundary migrates
into a region of higher dislocation density
❑ G (recrystallization) = G (deformed material) – G (undeformed material)
❑ TRecrystallization is the temperature at which 50 % of the material recrystallizes in 1 hour
Region of lower
Region of higher dislocation density
dislocation density
Direction of grain
boundary migration
Recrystallization
• New grains are formed that:
-- have a small dislocation density
-- are small and equiaxed
-- consume cold-worked grains.
0.6 mm 0.6 mm 0.6 mm 0.6 mm
33% cold New crystals

worked nucleate after After 4 After 8
brass 3 sec. at 580C. seconds seconds
Recrystallization during annealing in cold worked brass

(Adapted from Fig. 7.19 (c),(d), Callister 6e)
Recrystallization
❑ Increased deformation (cold work) leads to a decrease in recrystallization temperature (Trecrystallization).

❑ If the initial grain size is smaller then the recrystallization temperature is lower.
❑ Higher amount of cold work + low initial grain size leads to finer recrystallized grains.
❑ Higher temperature of working, lower strain energy stored, which will lead to a higher recrystallization
temperature
❑ The rate of recrystallization is an exponential function of temperature. But, as the recrystallization
process is a complex one (combination of many processes), the activation energy cannot be treated as a
fundamental constant.
❑ The Trecrystallization is a strong function of the purity of the material.
➢ For very pure materials Trecrystallization is about 0.3 Tm
[Trecrystallization (99.999% pure Al) ~ 75oC ]
➢ For impure materials Trecrystallization ~ (0.4 – 0.5) Tm
[Trecrystallization (commercial purity) ~ 275oC].
Hot work and cold work
❑ Hot Work  Plastic deformation above TRecrystallization
❑ Cold Work  Plastic deformation below TRecrystallization
Often the range is further subdivided into Hot, Cold and Warm working as in the figure
Hot Work 0.9 Tm
0.8 Tm ▪ When a metal is hot worked, the conditions of deformation are such that the
sample is soft and ductile. The effects of strain hardening are negated by dynamic
0.7 Tm and static processes (which keep the sample ductile).
0.6 Tm ▪ The lower limit of temperature for hot working is taken as 0.6 Tm.
Warm 0.5 Tm
working 0.4 Tm Recrystallization temperature (~ 0.4 Tm)
0.3 Tm
0.2 Tm
▪ The effects of strain hardening is not negated. Recovery mechanisms
Cold Work
0.1 Tm involve mainly motion of point defects.

▪ Upper limit ➢ 0.3 Tm.
Grain growth
❑ The growth of larger grains at the expense of smaller ones, leading to the increase in the average grain size is
termed as grain growth.
❑ Grain growth is Globally driven by reduction in grain boundary energy (per unit volume).
❑ Locally grain growth is driven by bond maximization (coordination number maximization). The smaller grains have
a larger curvature.
❑ Let us assume that a small grain G1 is in contact with a larger grain G2. Due to higher curvature an atom at the
grain boundary (from G1 side) is bonded to less number of atoms (3 in the schematic), while a similar atom on the
G2 side is bonded to more number of atoms (4 in the schematic). The system can lower its energy by the jump of an
atom from G1 to G2. Such jumps lead to the shift (migration) in the GB towards the smaller grain (G1 in the current
example).
JUMP
Bonded to
4 atoms
Bonded to Direction of grain

3 atoms boundary migration
G1 G2
Grain growth
0.6 mm 0.6 mm
• Empirical Relation
grain diameter at time t is given by :
dn − dno = Kt
After 8 s, After 15 min, grain growth parameters ‘n’ and K
580C 580C constant for material
Grain growth in cold worked brass
Adapted from Fig. 7.19
(d),(e), Callister 6e.
Electrical conductivity
Internal stress
Tensile strength
Ductility
Cold work Recovery Recrystallization Grain growth

Recovery, Recrystallization and Grain Growth

Uploaded by

Copyright:

Available Formats

Recovery, Recrystallization and Grain Growth

Uploaded by

Document Information

Original Description:

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Recovery, Recrystallization and Grain Growth

Uploaded by

Copyright:

Available Formats

MM 205

Recovery, recrystallization and grain growth

↑ point defect density

↑ point defect density

Increase in strength Softening of the material

Driving force is free energy stored in

Cold work Anneal Recovery

Driving force is free energy stored in dislocations Recrystallization

Driving force is free energy stored in grain boundaries Grain growth

❑ Recovery takes place at low temperatures of annealing

• Dislocations of like sign assemble into boundaries

• Localizes lattice curvature into polygonal regions

• Thus low angle grain boundaries or subgrains are

❑ Trecrystallization  (0.4 – 0.5) Tm

0.6 mm 0.6 mm 0.6 mm 0.6 mm

33% cold New crystals

Recrystallization during annealing in cold worked brass

❑ Increased deformation (cold work) leads to a decrease in recrystallization temperature (Trecrystallization).

0.1 Tm involve mainly motion of point defects.

Bonded to Direction of grain

Cold work Recovery Recrystallization Grain growth

You might also like

Pfad - The Proxy pFad of © 2024 Garber Painting. All rights reserved.