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PCA82C250
CAN controller interface
Product specification 2000 Jan 13
Supersedes data of 1997 Oct 21
File under Integrated Circuits, IC18
Philips Semiconductors Product specification

CAN controller interface PCA82C250

FEATURES APPLICATIONS
• Fully compatible with the “ISO 11898” standard • High-speed applications (up to 1 Mbaud) in cars.
• High speed (up to 1 Mbaud)
• Bus lines protected against transients in an automotive GENERAL DESCRIPTION
environment
The PCA82C250 is the interface between the CAN
• Slope control to reduce Radio Frequency Interference protocol controller and the physical bus. The device
(RFI) provides differential transmit capability to the bus and
• Differential receiver with wide common-mode range for differential receive capability to the CAN controller.
high immunity against ElectroMagnetic Interference
(EMI)
• Thermally protected
• Short-circuit proof to battery and ground
• Low-current standby mode
• An unpowered node does not disturb the bus lines
• At least 110 nodes can be connected.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage 4.5 5.5 V
ICC supply current standby mode − 170 µA
1/tbit maximum transmission speed non-return-to-zero 1 − Mbaud
VCAN CANH, CANL input/output voltage −8 +18 V
Vdiff differential bus voltage 1.5 3.0 V
tPD propagation delay high-speed mode − 50 ns
Tamb ambient temperature −40 +125 °C

ORDERING INFORMATION

TYPE PACKAGE
NUMBER NAME DESCRIPTION CODE
PCA82C250 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
PCA82C250T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
PCA82C250U − bare die; 2790 × 1780 × 380 µm −

2000 Jan 13 2
Philips Semiconductors Product specification

CAN controller interface PCA82C250

BLOCK DIAGRAM

handbook, full pagewidth VCC

1 PROTECTION
TXD

8 DRIVER
SLOPE/
Rs
STANDBY HS

7
CANH
4
RXD RECEIVER
6
CANL

5 REFERENCE
Vref
VOLTAGE PCA82C250

2
GND MKA669

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

TXD 1 transmit data input
handbook, halfpage
GND 2 ground TXD 1 8 Rs

VCC 3 supply voltage GND 2 7 CANH

RXD 4 receive data output PCA82C250
VCC 3 6 CANL
Vref 5 reference voltage output
RXD 4 5 Vref
CANL 6 LOW-level CAN voltage
input/output MKA670

CANH 7 HIGH-level CAN voltage

input/output Fig.2 Pin configuration.
Rs 8 slope resistor input

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Philips Semiconductors Product specification

CAN controller interface PCA82C250

FUNCTIONAL DESCRIPTION Pin 8 (Rs) allows three different modes of operation to be

selected: high-speed, slope control or standby.
The PCA82C250 is the interface between the CAN
protocol controller and the physical bus. It is primarily For high-speed operation, the transmitter output
intended for high-speed applications (up to 1 Mbaud) in transistors are simply switched on and off as fast as
cars. The device provides differential transmit capability to possible. In this mode, no measures are taken to limit the
the bus and differential receive capability to the CAN rise and fall slope. Use of a shielded cable is
controller. It is fully compatible with the “ISO 11898” recommended to avoid RFI problems. The high-speed
standard. mode is selected by connecting pin 8 to ground.
A current limiting circuit protects the transmitter output For lower speeds or shorter bus length, an unshielded
stage against short-circuit to positive and negative battery twisted pair or a parallel pair of wires can be used for the
voltage. Although the power dissipation is increased bus. To reduce RFI, the rise and fall slope should be
during this fault condition, this feature will prevent limited. The rise and fall slope can be programmed with a
destruction of the transmitter output stage. resistor connected from pin 8 to ground. The slope is
proportional to the current output at pin 8.
If the junction temperature exceeds a value of
approximately 160 °C, the limiting current of both If a HIGH level is applied to pin 8, the circuit enters a low
transmitter outputs is decreased. Because the transmitter current standby mode. In this mode, the transmitter is
is responsible for the major part of the power dissipation, switched off and the receiver is switched to a low current.
this will result in a reduced power dissipation and hence a If dominant bits are detected (differential bus voltage
lower chip temperature. All other parts of the IC will remain >0.9 V), RXD will be switched to a LOW level.
in operation. The thermal protection is particularly needed The microcontroller should react to this condition by
when a bus line is short-circuited. switching the transceiver back to normal operation (via
pin 8). Because the receiver is slow in standby mode, the
The CANH and CANL lines are also protected against
first message will be lost.
electrical transients which may occur in an automotive
environment.

Table 1 Truth table of the CAN transceiver

SUPPLY TXD CANH CANL BUS STATE RXD

4.5 to 5.5 V 0 HIGH LOW dominant 0
4.5 to 5.5 V 1 (or floating) floating floating recessive 1
<2 V (not powered) X(1) floating floating recessive X(1)
2 V < VCC < 4.5 V >0.75VCC floating floating recessive X(1)
2 V < VCC < 4.5 V X(1) floating if floating if recessive X(1)
VRs > 0.75VCC VRs > 0.75VCC

Note
1. X = don’t care.

Table 2 Pin Rs summary

CONDITION FORCED AT PIN Rs MODE RESULTING VOLTAGE OR CURRENT AT PIN Rs
VRs > 0.75VCC standby IRs < 10 µA
−10 µA < IRs < −200 µA slope control 0.4VCC < VRs < 0.6VCC
VRs < 0.3VCC high-speed IRs < −500 µA

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Philips Semiconductors Product specification

CAN controller interface PCA82C250

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2;
positive input current.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC supply voltage −0.3 +9.0 V
Vn DC voltage at pins 1, 4, 5 and 8 −0.3 VCC + 0.3 V
V6, 7 DC voltage at pins 6 and 7 0 V < VCC < 5.5 V; −8.0 +18.0 V
no time limit
Vtrt transient voltage at pins 6 and 7 see Fig.8 −150 +100 V
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −40 +125 °C
Tvj virtual junction temperature note 1 −40 +150 °C
Vesd electrostatic discharge voltage note 2 −2000 +2000 V
note 3 −200 +200 V

Notes
1. In accordance with “IEC 60747-1”. An alternative definition of virtual junction temperature is:
Tvj = Tamb + Pd × Rth(vj-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits
the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb).
2. Classification A: human body model; C = 100 pF; R = 1500 Ω; V = ±2000 V.
3. Classification B: machine model; C = 200 pF; R = 25 Ω; V = ±200 V.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient in free air
PCA82C250 100 K/W
PCA82C250T 160 K/W

QUALITY SPECIFICATION
According to “SNW-FQ-611 part E”.

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Philips Semiconductors Product specification

CAN controller interface PCA82C250

CHARACTERISTICS
VCC = 4.5 to 5.5 V; Tamb = −40 to +125 °C; RL = 60 Ω; I8 > −10 µA; unless otherwise specified; all voltages referenced
to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design,
but only 100% tested at +25 °C.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
I3 supply current dominant; V1 = 1 V − − 70 mA
recessive; V1 = 4 V; − − 14 mA
R8 = 47 kΩ
recessive; V1 = 4 V; − − 18 mA
V8 = 1 V
standby; Tamb < 90 °C; − 100 170 µA
note 1
DC bus transmitter
VIH HIGH-level input voltage output recessive 0.7VCC − VCC + 0.3 V
VIL LOW-level input voltage output dominant −0.3 − 0.3VCC V
IIH HIGH-level input current V1 = 4 V −200 − +30 µA
IIL LOW-level input current V1 = 1 V −100 − −600 µA
V6,7 recessive bus voltage V1 = 4 V; no load 2.0 − 3.0 V
ILO off-state output leakage current −2 V < (V6,V7) < 7 V −2 − +1 mA
−5 V < (V6,V7) < 18 V −5 − +12 mA
V7 CANH output voltage V1 = 1 V 2.75 − 4.5 V
V6 CANL output voltage V1 = 1 V 0.5 − 2.25 V
∆V6, 7 difference between output V1 = 1 V 1.5 − 3.0 V
voltage at pins 6 and 7 V1 = 1 V; RL = 45 Ω; 1.5 − − V
VCC ≥ 4.9 V
V1 = 4 V; no load −500 − +50 mV
Isc7 short-circuit CANH current V7 = −5 V; VCC ≤ 5 V − − −105 mA
V7 = −5 V; VCC = 5.5 V − − −120 mA
Isc6 short-circuit CANL current V6 = 18 V − − 160 mA
DC bus receiver: V1 = 4 V; pins 6 and 7 externally driven; −2 V < (V6, V7) < 7 V; unless otherwise specified
Vdiff(r) differential input voltage −1.0 − +0.5 V
(recessive) −7 V < (V6, V7) < 12 V; −1.0 − +0.4 V
not standby mode
Vdiff(d) differential input voltage 0.9 − 5.0 V
(dominant) −7 V < (V6, V7) < 12 V; 1.0 − 5.0 V
not standby mode
Vdiff(hys) differential input hysteresis see Fig.5 − 150 − mV
VOH HIGH-level output voltage I4 = −100 µA 0.8VCC − VCC V
(pin 4)
VOL LOW-level output voltage (pin 4) I4 = 1 mA 0 − 0.2VCC V
I4 = 10 mA 0 − 1.5 V
Ri CANH, CANL input resistance 5 − 25 kΩ

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Philips Semiconductors Product specification

CAN controller interface PCA82C250

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Rdiff differential input resistance 20 − 100 kΩ
Ci CANH, CANL input capacitance − − 20 pF
Cdiff differential input capacitance − − 10 pF
Reference output
Vref reference output voltage V8 = 1 V; 0.45VCC − 0.55VCC V
−50 µA < I5 < 50 µA
V8 = 4 V; 0.4VCC − 0.6VCC V
−5 µA < I5 < 5 µA
Timing (see Figs 4, 6 and 7)
tbit minimum bit time V8 = 1 V − − 1 µs
tonTXD delay TXD to bus active V8 = 1 V − − 50 ns
toffTXD delay TXD to bus inactive V8 = 1 V − 40 80 ns
tonRXD delay TXD to receiver active V8 = 1 V − 55 120 ns
toffRXD delay TXD to receiver inactive V8 = 1 V; VCC < 5.1 V; − 82 150 ns
Tamb < +85 °C
V8 = 1 V; VCC < 5.1 V; − 82 170 ns
Tamb < +125 °C
V8 = 1 V; VCC < 5.5 V; − 90 170 ns
Tamb < +85 °C
V8 = 1 V; VCC < 5.5 V; − 90 190 ns
Tamb < +125 °C
tonRXD delay TXD to receiver active R8 = 47 kΩ − 390 520 ns
R8 = 24 kΩ − 260 320 ns
toffRXD delay TXD to receiver inactive R8 = 47 kΩ − 260 450 ns
R8 = 24 kΩ − 210 320 ns
SR differential output voltage slew R8 = 47 kΩ − 14 − V/µs
rate
tWAKE wake-up time from standby − − 20 µs
(via pin 8)
tdRXDL bus dominant to RXD LOW V8 = 4 V; standby mode − − 3 µs
Standby/slope control (pin 8)
V8 input voltage for high-speed − − 0.3VCC V
I8 input current for high-speed V8 = 0 V − − −500 µA
Vstb input voltage for standby mode 0.75VCC − − V
Islope slope control mode current −10 − −200 µA
Vslope slope control mode voltage 0.4VCC − 0.6VCC V
Note
1. I1 = I4 = I5 = 0 mA; 0 V < V6 < VCC; 0 V < V7 < VCC; V8 = VCC.

2000 Jan 13 7
Philips Semiconductors Product specification

CAN controller interface PCA82C250

handbook, halfpage +5 V
100 pF

VCC
TXD
CANH

PCA82C250
Vref 62 Ω 100 pF

CANL
RXD
GND Rs

30 pF Rext

MKA671

Fig.3 Test circuit for dynamic characteristics.

handbook, full pagewidth VCC

VTXD

0V

0.9 V
Vdiff
0.5 V

0.7VCC
VRXD
0.3VCC

tonTXD toffTXD

tonRXD toffRXD MKA672

Fig.4 Timing diagram for dynamic characteristics.

2000 Jan 13 8
Philips Semiconductors Product specification

CAN controller interface PCA82C250

handbook, full pagewidth VRXD

HIGH

LOW

hysteresis

0.5 V 0.9 V Vdiff MKA673

Fig.5 Hysteresis.

handbook, full pagewidth VCC

VRs

0V

VRXD

tWAKE MKA674

V1 = 1 V.

Fig.6 Timing diagram for wake-up from standby.

2000 Jan 13 9
Philips Semiconductors Product specification

CAN controller interface PCA82C250

handbook, full pagewidth 1.5 V

Vdiff

0V

VRXD

tdRXDL MKA675

V1 = 4 V; V8 = 4 V.

Fig.7 Timing diagram for bus dominant to RXD LOW.

handbook, full pagewidth +5 V

VCC
1 nF
TXD
CANH

PCA82C250
SCHAFFNER
RXD 62 Ω
GENERATOR
1 nF
CANL
Vref
MKA676
GND Rs

Rext

The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b.

Fig.8 Test circuit for automotive transients.

2000 Jan 13 10
Philips Semiconductors Product specification

CAN controller interface PCA82C250

APPLICATION INFORMATION

handbook, halfpage
P8xC592/P8xCE598
CAN-CONTROLLER

CTX0 CRX0 CRX1 PX,Y

Rext

+5 V
TXD RXD Vref Rs
VCC
PCA82C250T
100 nF
CAN-TRANSCEIVER
GND
CANH CANL

124 Ω CAN BUS 124 Ω

LINE
MKA677

Fig.9 Application of the CAN transceiver.

2000 Jan 13 11
Philips Semiconductors Product specification

CAN controller interface PCA82C250

handbook, full pagewidth

SJA1000
CAN-CONTROLLER

TX0 TX1 RX0 RX1

6.8 kΩ 3.6 kΩ
+5 V
390 Ω
390 Ω 100 nF
VDD

VSS
6N137

0V 6N137

100 nF +5 V 390 Ω
390 Ω
+5 V

TXD RXD Vref Rs +5 V

VCC
PCA82C250 Rext
100 nF
CAN-TRANSCEIVER
GND
CANH CANL

124 Ω CAN BUS LINE 124 Ω

MKA678

Fig.10 Application with galvanic isolation.

2000 Jan 13 12
Philips Semiconductors Product specification

CAN controller interface PCA82C250

INTERNAL PIN CONFIGURATION

handbook, full pagewidth VCC

1
TXD

8
Rs

4
RXD

7
CANH
PCA82C250
CANL
5 6
Vref

2
GND MKA679

Fig.11 Internal pin configuration.

2000 Jan 13 13
Philips Semiconductors Product specification

CAN controller interface PCA82C250

BONDING PAD LOCATIONS

COORDINATES(1)
SYMBOL PAD
x y
TXD 1 196 135
GND 2 1280 135
VCC 3 1767 135
RXD 4 2588 135
Vref 5 2594 1640
CANL 6 1689 1640
CANH 7 948 1640
Rs 8 196 1640

Note
1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of
the die (x/y = 0).
CANH

CANL

handbook, full pagewidth

Vref
Rs

8 7 6 5

1.78
mm
PCA82C250U

1 2 3 4

x 0
TXD

GND

RXD
VCC

y
2.79 mm MGL945

Fig.12 Bonding pad locations.

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Philips Semiconductors Product specification

CAN controller interface PCA82C250

PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

D ME
seating plane

A2 A

L A1

c
Z w M
b1
e (e 1)

MH
b b2
8 5

pin 1 index
E

1 4

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 1.07 0.36 9.8 6.48 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 1.15
1.14 0.38 0.89 0.23 9.2 6.20 3.05 7.80 8.3

inches 0.068 0.021 0.042 0.014 0.39 0.26 0.14 0.32 0.39
0.17 0.020 0.13 0.10 0.30 0.01 0.045
0.045 0.015 0.035 0.009 0.36 0.24 0.12 0.31 0.33

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

95-02-04
SOT97-1 050G01 MO-001 SC-504-8
99-12-27

2000 Jan 13 15
Philips Semiconductors Product specification

CAN controller interface PCA82C250

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

D E A
X

y HE v M A

8 5

Q
A2
(A 3) A
A1
pin 1 index
θ
Lp

1 4 L

e w M detail X
bp

0 2.5 5 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ

0.25 1.45 0.49 0.25 5.0 4.0 6.2 1.0 0.7 0.7
mm 1.75 0.25 1.27 1.05 0.25 0.25 0.1 o
0.10 1.25 0.36 0.19 4.8 3.8 5.8 0.4 0.6 0.3 8
0.010 0.057 0.019 0.0100 0.20 0.16 0.244 0.039 0.028 0.028 0o
inches 0.069 0.01 0.050 0.041 0.01 0.01 0.004
0.004 0.049 0.014 0.0075 0.19 0.15 0.228 0.016 0.024 0.012

Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

97-05-22
SOT96-1 076E03 MS-012
99-12-27

2000 Jan 13 16
Philips Semiconductors Product specification

CAN controller interface PCA82C250

SOLDERING Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the
Introduction
packages should preferable be kept below 230 °C.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in WAVE SOLDERING
our “Data Handbook IC26; Integrated Circuit Packages”
Conventional single wave soldering is not recommended
(document order number 9398 652 90011).
for surface mount devices (SMDs) or printed-circuit boards
There is no soldering method that is ideal for all IC with a high component density, as solder bridging and
packages. Wave soldering is often preferred when non-wetting can present major problems.
through-hole and surface mount components are mixed on
To overcome these problems the double-wave soldering
one printed-circuit board. However, wave soldering is not
method was specifically developed.
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations If wave soldering is used the following conditions must be
reflow soldering is often used. observed for optimal results:
• Use a double-wave soldering method comprising a
Through-hole mount packages turbulent wave with high upward pressure followed by a
SOLDERING BY DIPPING OR BY SOLDER WAVE smooth laminar wave.

The maximum permissible temperature of the solder is • For packages with leads on two sides and a pitch (e):
260 °C; solder at this temperature must not be in contact – larger than or equal to 1.27 mm, the footprint
with the joints for more than 5 seconds. The total contact longitudinal axis is preferred to be parallel to the
time of successive solder waves must not exceed transport direction of the printed-circuit board;
5 seconds. – smaller than 1.27 mm, the footprint longitudinal axis
The device may be mounted up to the seating plane, but must be parallel to the transport direction of the
the temperature of the plastic body must not exceed the printed-circuit board.
specified maximum storage temperature (Tstg(max)). If the The footprint must incorporate solder thieves at the
printed-circuit board has been pre-heated, forced cooling downstream end.
may be necessary immediately after soldering to keep the • For packages with leads on four sides, the footprint must
temperature within the permissible limit. be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
MANUAL SOLDERING solder thieves downstream and at the side corners.
Apply the soldering iron (24 V or less) to the lead(s) of the During placement and before soldering, the package must
package, either below the seating plane or not more than be fixed with a droplet of adhesive. The adhesive can be
2 mm above it. If the temperature of the soldering iron bit applied by screen printing, pin transfer or syringe
is less than 300 °C it may remain in contact for up to dispensing. The package can be soldered after the
10 seconds. If the bit temperature is between adhesive is cured.
300 and 400 °C, contact may be up to 5 seconds.
Typical dwell time is 4 seconds at 250 °C.
Surface mount packages A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of MANUAL SOLDERING
fine solder particles, flux and binding agent) to be applied Fix the component by first soldering two
to the printed-circuit board by screen printing, stencilling or diagonally-opposite end leads. Use a low voltage (24 V or
pressure-syringe dispensing before package placement. less) soldering iron applied to the flat part of the lead.
Several methods exist for reflowing; for example, Contact time must be limited to 10 seconds at up to
infrared/convection heating in a conveyor type oven. 300 °C.
Throughput times (preheating, soldering and cooling) vary When using a dedicated tool, all other leads can be
between 100 and 200 seconds depending on heating soldered in one operation within 2 to 5 seconds between
method. 270 and 320 °C.

2000 Jan 13 17
Philips Semiconductors Product specification

CAN controller interface PCA82C250

Suitability of IC packages for wave, reflow and dipping soldering methods

SOLDERING METHOD
MOUNTING PACKAGE
WAVE REFLOW(1) DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) − suitable
Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable −
HBCC, HLQFP, HSQFP, HSOP, HTQFP, not suitable(3) suitable −
HTSSOP, SMS
PLCC(4), SO, SOJ suitable suitable −
LQFP, QFP, TQFP not recommended(4)(5) suitable −
SSOP, TSSOP, VSO not recommended(6) suitable −

Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2000 Jan 13 18
Philips Semiconductors Product specification

CAN controller interface PCA82C250

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips’ delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors
has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing,
handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in
which the die is used.

2000 Jan 13 19
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Belgium: see The Netherlands Philippines: Philips Semiconductors Philippines Inc.,
Brazil: see South America 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA, Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +359 2 68 9211, Fax. +359 2 68 9102 Tel. +48 22 5710 000, Fax. +48 22 5710 001
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Portugal: see Spain
Tel. +1 800 234 7381, Fax. +1 800 943 0087 Romania: see Italy
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +7 095 755 6918, Fax. +7 095 755 6919
Tel. +852 2319 7888, Fax. +852 2319 7700 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Colombia: see South America Tel. +65 350 2538, Fax. +65 251 6500
Czech Republic: see Austria Slovakia: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Slovenia: see Italy
Tel. +45 33 29 3333, Fax. +45 33 29 3905 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
Finland: Sinikalliontie 3, FIN-02630 ESPOO, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +358 9 615 800, Fax. +358 9 6158 0920 Tel. +27 11 471 5401, Fax. +27 11 471 5398
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, South America: Al. Vicente Pinzon, 173, 6th floor,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 04547-130 SÃO PAULO, SP, Brazil,
Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +55 11 821 2333, Fax. +55 11 821 2382
Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Spain: Balmes 22, 08007 BARCELONA,
Hungary: see Austria Tel. +34 93 301 6312, Fax. +34 93 301 4107
India: Philips INDIA Ltd, Band Box Building, 2nd floor, Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Tel. +91 22 493 8541, Fax. +91 22 493 0966 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Indonesia: PT Philips Development Corporation, Semiconductors Division, Tel. +41 1 488 2741 Fax. +41 1 488 3263
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Ireland: Newstead, Clonskeagh, DUBLIN 14, Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
Tel. +353 1 7640 000, Fax. +353 1 7640 200 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, Tel. +66 2 745 4090, Fax. +66 2 398 0793
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Tel. +39 039 203 6838, Fax +39 039 203 6800 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
Tel. +82 2 709 1412, Fax. +82 2 709 1415 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +1 800 234 7381, Fax. +1 800 943 0087
Tel. +60 3 750 5214, Fax. +60 3 757 4880 Uruguay: see South America
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Vietnam: see Singapore
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy Tel. +381 11 3341 299, Fax.+381 11 3342 553

For all other countries apply to: Philips Semiconductors, Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

© Philips Electronics N.V. 2000 SCA 69

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Printed in The Netherlands 285002/05/pp20 Date of release: 2000 Jan 13 Document order number: 9397 750 06609