V 200V I 27.4A R 0.100: Features

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IRFM

MECHANICAL DATA
Dimensions in mm (inches) N–CHANNEL
POWER MOSFET
VDSS 200V
1 .2 7 (.0 5 0 ) 1 3 .8 4 (.5 4 5 )
ID(cont) 27.4A
0.100W
1 .0 2 (.0 4 0 ) 1 3 .5 9 (.5 3 5 )

6 .6 0 (.2 6 0 )
6 .3 2 (.2 4 9 )
6 .9 1 (.2 7 2 )
6 .8 1 (.2 6 8 )
RDS(on)
3 .7 8 (.1 4 9 )
3 .5 3 (.1 3 9 )
D IA
FEATURES
2 0 .3 2 (.8 0 0 ) 1 7 .4 0 (.6 8 5 )
2 0 .0 6 (.7 9 0 )
1 3 .8 4 (.5 4 5 )
1 3 .5 9 (.5 3 5 )
1 6 .8 9 (.6 6 5 )
• N–CHANNEL MOSFET
R 1 .0 1 (.0 4 0 ) M IN
G a te
• HIGH VOLTAGE
S o u rc e
4 .9 5 (.1 9 5 )
4 .1 9 (.1 6 5 ) D r a in
• INTEGRAL PROTECTION DIODE
1 .1 4 (.0 4 5 ) D ia T y p
3 .8 1 (.1 5 0 ) B S C
0 .8 9 (0 .3 5 ) 3 L e a d s • HERMETIC ISOLATED TO-254 PAC
9 .5 2 (.3 7 5 )
3 .8 1 (.1 5 0 ) B S C
8 .7 6 (.3 4 5 )
• CERAMIC SURFACE MOUNT PACK
OPTION

TO–254 Metal Package


Pin 1 – Drain Pin 2 – Source Pin 3 – Gate

ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise stated)


VGS Gate – Source Voltage ±20V
ID Continuous Drain Current @ VGS = 10V , TC = 25°C 27.4A
@ VGS = 10V , TC = 100°C 17A
IDM Pulsed Drain Current 110A
PD Max. Power Dissipation @ TC = 25°C 150W
Linear Derating Factor 1.2W / °C
IL Avalanche Current , Clamped 1 27.4A
dv / dt Peak Diode Recovery 2 5.5V / ns
RqJC Thermal Resistance Junction – Case 0.83°C / W
RqJA Thermal Resistance Junction – Ambient 48°C / W
RqCS Thermal Resistance Case – Sink 0.21°C / W typ.
TJ , TSTG Operating Junction and Storage Temperature Range –55 to 150°C
TL Lead Temperature (1.6mm from case for 10s) 300°C
IRFM

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise stated)


Parameter Test Conditions Min. Typ. Max
STATIC ELECTRICAL RATINGS
BVDSS Drain – Source Breakdown Voltage VGS = 0 ID = 1mA 200
DBVDSS Temperature Coefficient of Reference to 25°C
0.28
DTJ Breakdown Voltage ID = 1mA
Static Drain – Source On–State VGS = 10V ID = 17A 0.100
RDS(on)
Resistance 2 VGS = 10V ID = 27.4A 0.105
VGS(th) Gate Threshold Voltage VDS = VGS ID = 250mA 2 4
gfs Forward Transconductance 2 VDS ³ 15V IDS = 27.4A 9
VGS = 0 VDS = 0.8BVDSS 25
IDSS Zero Gate Voltage Drain Current
TJ = 125°C 250
IGSS Forward Gate – Source Leakage VGS = 20V 100
IGSS Reverse Gate – Source Leakage VGS = –20V –100
DYNAMIC CHARACTERISTICS
Ciss Input Capacitance 3500
VGS = 0
Coss Output Capacitance 700
VDS = 25V
Crss Reverse Transfer Capacitance 110
f = 1MHz
CDC Drain – Case Capacitance 12
Qg Total Gate Charge VGS = 10V 55 115
Qgs Gate – Source Charge ID = 27.4A 8 22
Qgd Gate – Drain (“Miller”) Charge VDS = 0.5BVDSS 30 60
td(on) Turn– On Delay Time 35
VDD = 100V
tr Rise Time 190
ID = 27.4A
td(off) Turn–Off Delay Time 170
RG = 2.35W
tf Fall Time 130
SOURCE – DRAIN DIODE CHARACTERISTICS
IS Continuous Source Current 27.4
ISM Pulse Source Current 1 110
IS = 27.4A TJ = 25°C
VSD Diode Forward Voltage 2 1.9
VGS = 0
trr Reverse Recovery Time 2 IF = 27.4A TJ = 25°C 950
Qrr Reverse Recovery Charge 2 di / dt £ 100A/ms VDD £ 50V 9.0
ton Forward Turn–On Time Negligible
PACKAGE CHARACTERISTICS
LD Internal Drain Inductance Measured from 6mm down drain lead to centre of die 8.7
LS Internal Source Inductance Measured from 6mm down source lead to source bond pad 8.7

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