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    Profile Soldering Vishay

    Uploaded by

    Rafael Palhas Domingos
    This document provides recommendations for soldering surface mount multilayer ceramic chip capacitors and designing the footprints on circuit boards. It recommends lead-free soldering conditions and profiles for reflow and wave soldering processes. Typical footprint dimensions are provided for various capacitor sizes for both reflow and wave soldering, along with placement accuracy guidelines. It also shows a footprint design for capacitor chip arrays.

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    © All Rights Reserved
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    Profile Soldering Vishay

    Uploaded by

    Rafael Palhas Domingos
    116 views2 pages
    This document provides recommendations for soldering surface mount multilayer ceramic chip capacitors and designing the footprints on circuit boards. It recommends lead-free soldering conditions and profiles for reflow and wave soldering processes. Typical footprint dimensions are provided for various capacitor sizes for both reflow and wave soldering, along with placement accuracy guidelines. It also shows a footprint design for capacitor chip arrays.

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    This document provides recommendations for soldering surface mount multilayer ceramic chip capacitors and designing the footprints on circuit boards. It recommends lead-free soldering conditions and profiles for reflow and wave soldering processes. Typical footprint dimensions are provided for various capacitor sizes for both reflow and wave soldering, along with placement accuracy guidelines. It also shows a footprint design for capacitor chip arrays.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    116 views2 pages

    Profile Soldering Vishay

    Uploaded by

    Rafael Palhas Domingos
    This document provides recommendations for soldering surface mount multilayer ceramic chip capacitors and designing the footprints on circuit boards. It recommends lead-free soldering conditions and profiles for reflow and wave soldering processes. Typical footprint dimensions are provided for various capacitor sizes for both reflow and wave soldering, along with placement accuracy guidelines. It also shows a footprint design for capacitor chip arrays.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
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    VJ....

    W1BC Soldering and Footprint Design


    Vishay

    Surface Mount Multilayer Ceramic Chip Capacitors


    for Commodity Applications
    RECOMMENDED SOLDERING CONDITIONS
    Lead (Pb)-free terminated MLCCs are not only used on SMT with lead (Pb)-free solder paste, but also suitable to be used with
    lead-containing solder paste. In case the optimized solder joint is requested, increasing soldering time, temperature and
    concentration of N2 within the oven are recommended.

    SOLDERING PROFILES

    Recommended IR reflow soldering profile for SMT process with SnAgCu series solder paste

    280 Max. temp.


    260
    240 4 °C/s 4 °C/s
    220
    Temperature in °C

    200 SnAgCu solder paste


    180
    160
    140 3 °C/s
    120 Min. temp.
    100
    80
    60 Peak temperature: 280 °C max.
    40 Duration time: > 260 °C,10 s max.
    20 > 215 °C, 60 s to 90 s
    Time
    60 s to 90 s
    120 s 120 s 120 s

    Recommended wave soldering profile for SMT process with SnAgCu series solder

    260 °C
    250

    200
    Temperature in °C

    150 °C/s max.


    4 °C/s max.
    150
    120 °C
    100

    50

    0
    Time
    3 s to Total contact
    < 100 s 5s time
    Over 60 s at least
    by natural cooling

    www.vishay.com For technical questions, contact: mlcc@vishay.com Document Number: 45017


    1 Revision: 01-Apr-11
    This document is subject to change without notice.
    THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
    VJ....W1BC Soldering and Footprint Design
    Vishay Surface Mount Multilayer Ceramic Chip Capacitors
    for Commodity Applications

    FOOTPRINT DESIGN
    Circuit board design first steps are to consider how the surface mount board will be manufactured. The manufacturing process
    determines the necessary dimensions of the solder land, the minimum spacing between components, the area underneath the
    SMD where tracks may be laid down and the required component orientation during wave soldering. Therefore a footprint
    related to the manufacturing process with all this information is an essential tool for SMD circuit board design.
    Footprint details depend on following parameters:
    • Component dimensions and tolerance as given in the component data
    • Board dimensional accuracy
    • Placement accuracy of the component with respect to the solder lands on the board
    • Solder paste position tolerances with respect to the solder lands (for reflow soldering only)
    • The soldering parameters
    • Solder resist position tolerances with respect to the solder lands
    • Solder joint parameters for reliable joints

    TYPICAL SMD FOOTPRINT


    E
    Occupied area

    Solder land/Solder paste pattern


    G
    D

    Solder resist pattern

    C B
    A Tracks or Dummy tracks
    F (for wave soldering only)

    REFLOW SOLDERING
    FOOTPRINT DIMENSIONS IN mm PROCESSING PLACEMENT
    SIZE
    A B C D E F G REMARKS ACCURACY
    0201 0.65 0.23 0.21 0.30 n/a 0.90 0.60 ± 0.05
    0402 1.50 0.50 0.50 0.50 0.10 1.75 0.95 ± 0.15
    0603 2.30 0.70 0.80 0.80 0.20 2.55 1.40 Reflow or hot plate ± 0.25
    0805 2.80 1.00 0.90 1.30 0.40 3.05 1.85 soldering ± 0.25
    1206 4.00 2.20 0.90 1.60 1.60 4.25 2.25 ± 0.25
    1210 4.00 2.20 0.90 2.50 1.60 4.25 3.15 ± 0.25

    WAVE SOLDERING
    FOOTPRINT DIMENSIONS IN mm PROPOSED NUMBER
    PLACEMENT
    SIZE AND DIMENSIONS OF
    A B C D E F G ACCURACY
    DUMMY TRACKS
    0603 2.40 1.00 0.70 0.80 0.20 3.10 1.90 1 x (0.20 x 0.80) ± 0.10
    0805 3.20 1.40 0.90 1.30 0.36 4.10 2.50 1 x (0.30 x 1.30) ± 0.15
    1206 4.80 2.30 1.25 1.70 1.25 5.90 3.20 3 x (0.25 x 1.70) ± 0.25
    1210 5.30 2.30 1.50 2.60 1.25 6.30 4.20 3 x (0.25 x 2.60) ± 0.25

    FOOTPRINT FOR MLCC CHIP ARRAY


    SIZE DIMENSIONS IN mm
    A 2.85 + 0.10/- 0.05
    D
    F

    B 0.45 ± 0.05 P

    D 0.80 ± 0.10
    P 0.80 B
    A
    F 3.10 ± 0.30

    www.vishay.com For technical questions, contact: mlcc@vishay.com Document Number: 45017


    2 Revision: 01-Apr-11
    This document is subject to change without notice.
    THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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