25-W Stereo Class-D Audio Power Amplifier: Features Description
25-W Stereo Class-D Audio Power Amplifier: Features Description
25-W Stereo Class-D Audio Power Amplifier: Features Description
PGNDL 0.68 mF
1 mF
BYPASS LOUT
22 mH 470 mF
AGND BSL
0.22 mF
PVCCL 10 V to 30 V
10 V to 30 V AVCC
PVCCR
VCLAMP
Shutdown
SD 1 mF
Control
GAIN1
} 4-Step Gain
Control
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPA3120D2
www.ti.com
SLOS507B – MARCH 2007 – REVISED MAY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PVCCL 1 24 PGNDL
SD 2 23 PGNDL
PVCCL 3 22 LOUT
MUTE 4 21 BSL
LIN 5 20 AVCC
RIN 6 19 AVCC
BYPASS 7 18 GAIN0
AGND 8 17 GAIN1
AGND 9 16 BSR
PVCCR 10 15 ROUT
VCLAMP 11 14 PGNDR
PVCCR 12 13 PGNDR
TERMINAL FUNCTIONS
TERMINAL
24-PIN I/O/P DESCRIPTION
NAME
(PWP)
Shutdown signal for IC (low = disabled, high = operational). TTL logic levels with compliance to
SD 2 I
AVCC.
RIN 6 I Audio input for right channel.
LIN 5 I Audio input for left channel.
GAIN0 18 I Gain select least significant bit. TTL logic levels with compliance to AVCC.
GAIN1 17 I Gain select most significant bit. TTL logic levels with compliance to AVCC.
Mute signal for quick disable/enable of outputs (high = outputs switch at 50% duty cycle, low =
MUTE 4 I
outputs enabled). TTL logic levels with compliance to AVCC.
BSL 21 I/O Bootstrap I/O for left channel.
PVCCL 1, 3 P Power supply for left channel H-bridge, not internally connected to PVCCR or AVCC.
LOUT 22 O Class-D 1/2-H-bridge positive output for left channel.
PGNDL 23, 24 P Power ground for left channel H-bridge.
VCLAMP 11 P Internally generated voltage supply for bootstrap capacitors.
BSR 16 I/O Bootstrap I/O for right channel.
ROUT 15 O Class-D 1/2-H-bridge negative output for right channel.
PGNDR 13, 14 P Power ground for right channel H-bridge.
PVCCR 10, 12 P Power supply for right channel H-bridge, not connected to PVCCL or AVCC.
AGND 9 P Analog ground for digital/analog cells in core.
AGND 8 P Analog Ground for analog cells in core.
Reference for pre-amplifier inputs. Nominally equal to AVCC/8. Also controls start-up time via
BYPASS 7 O
external capacitor sizing.
AVCC 19, 20 P High-voltage analog power supply. Not internally connected to PVCCR or PVCCL
Connect to ground. Thermal Pad should be soldered down on all applications to properly
Thermal Pad Die Pad P
secure device to printed wiring board.
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
PACKAGE (1) (2) TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C
24-pin TSSOP 4.16 W 33.3 mW/°C 2.67 W 2.16 W
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) The PowerPAD must be soldered to a thermal land on the printed circuit board. See the PowerPAD Thermally Enhanced Package
application note (SLMA002).
DC CHARACTERISTICS
TA = 25°C, VCC = 24 V, RL = 4 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Class-D output offset voltage
| VOS | (measured differentially in BTL VI = 0 V, AV = 36 dB 7.5 50 mV
mode as shown in Fig 30)
V(BYPASS) Bypass output voltage No load AVCC/8 V
ICC(q) Quiescent supply current SD = 2 V, MUTE = 0 V, No load 23 37 mA
ICC(q) Quiescent supply current in
MUTE = 0.8 V, No load 23 mA
mute mode
ICC(q) Quiescent supply current in
SD = 0.8 V , No load 0.39 1 mA
shutdown mode
rDS(on) Drain-source on-state
200 mΩ
resistance
GAIN0 = 0.8 V 18 20 22
GAIN1 = 0.8 V
GAIN0 = 2 V 24 26 28
G Gain dB
GAIN0 = 0.8 V 30 32 34
GAIN = 2 V
GAIN0 = 2 V 34 36 38
Mute Attenuation VI = 1Vrms -82 dB
AC CHARACTERISTICS
TA = 25°C, VCC = 24 V, RL = 4Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC = 24, Vripple = 200 mVPP 100 Hz -48
ksvr Supply ripple rejection Gain = 20 dB dB
1 kHz -52
VCC = 24 V, RL = 4 Ω, f = 1 kHz 16
Output Power at 1% THD+N
VCC = 24 V, RL = 8 Ω, f = 1 kHz 8
PO W
VCC = 24 V, RL = 4 Ω, f = 1 kHz 20
Output Power at 10% THD+N
VCC = 24 V, RL = 8 Ω, f = 1 kHz 10
Total harmonic distortion + RL = 4 Ω, f = 1 kHz, PO = 10 W 0.08%
THD+N
noise RL = 8 Ω, f = 1 kHz, PO = 5 W 0.08%
20 Hz to 22 kHz, A-weighted filter, 85 µV
Vn Output integrated noise floor
Gain = 20 dB -80 dBV
Crosstalk PO = 1 W, f = 1kHz; Gain = 20 dB -60 dB
Max Output at THD+N < 1%, f = 1 kHz,
SNR Signal-to-noise ratio 99 dB
Gain = 20 dB
Thermal trip point 150 °C
Thermal hysteresis 30 °C
fOSC Oscillator frequency 230 250 270 kHz
BSL
AVCC AVDD PVCCL
REGULATOR
HS
+ LOUT
- VCLAMP
LS
AVDD AVDD PGNDL
LIN
SC
AVDD/2 DETECT
AGND
CONTROL
SD
BIAS
VCLAMP
THERMAL
MUTE
MUTE CONTROL
OSC/RAMP
BYPASS BYPASS
GAIN1 AV
CONTROL
GAIN0
SC
DETECT
BSR
PVCCR
HS
ROUT
-
VCLAMP
+
LS
PGNDR
AVDD
AVDD
RIN
AVDD/2
TYPICAL CHARACTERISTICS
All tests are made at frequency = 1 kHz unless otherwise noted.
1 1
PO = 10 W
PO = 5 W
PO = 1 W PO = 1 W
0.1 0.1
PO = 2.5 W PO = 5 W
0.01 0.01
20 100 1k 10k 20k 20 100 1k 10k 20k
f − Frequency − Hz f − Frequency − Hz
Figure 1. Figure 2.
RL = 4 W (SE)
VCC = 24 V
Gain = 20 dB
RL = 8 W (SE)
Gain = 20 dB VCC = 24 V
1 1 VCC = 18 V
PO = 2.5 W
VCC = 12 V
PO = 5 W
0.1 0.1
PO = 1 W
0.01
0.01
20 100 1k 10k 20k 10 m 100 m 1 10 40
f − Frequency − Hz PO − Output Power − W
Figure 3. Figure 4.
VCC = 18 V
Gain = 20 dB -10 VO = 1 Vrms
RL = 4 W (SE)
VCC = 24 V -20
Gain = 20 dB
-30
1 VCC = 18 V
Crosstalk - dB
-40
VCC = 12 V -50
L to R
-60
0.1
-70
-80
R to L
-90
0.01 -100
10 m 100 m 1 10 40 20 100 1k 10k 20k
PO − Output Power − W f − Frequency − Hz
Figure 5. Figure 6.
CROSSTALK GAIN/PHASE
vs vs
FREQUENCY FREQUENCY
0 200
VCC = 18 V,
-10 VO = 1 V, Gain
20
-20 R L = 8 W, 100
Gain = 20 dB
-30
15
Crosstalk - dB
0
Gain - dB
Phase - o
-40
Phase
-50 L to R 10
VCC = 24 V -100
-60
RL = 4 W (SE)
-70 5 Gain = 20 dB
Lfilt = 33 mF
R to L -200
-80 Cfilt = 1 mF
Cdc = 470 mF
-90 0
-300
-100 20 100 200 1k 2k 10k 20k 100k
20 100 1k 10k 20k
f − Frequency − Hz
f − Frequency − Hz
Figure 7. Figure 8.
PO - Output Power - W
17.5 50 22
THD = 10%
Gain - dB
Phase - o
20
15 0
18
Phase
12.5 -50 16
VCC = 24 V
14
RL = 8 W (SE) -100
10 12 THD = 1%
Gain = 20 dB
Lfilt = 47 mF -150 10
7.5 Cfilt = 0.22 mF 8
Cdc = 470 mF -200 6
5 4
-250
20 100 200 1k 2k 10k 20k 100k 2
10 12 14 16 18 20 22 24 26 28 30
f − Frequency − Hz
VSS − Supply Voltage − V
12 THD = 10% 70
18 V 24 V
Efficiency - %
11 60
10 12 V
9 50
8
40
7
6 THD = 1%
30
5
4 20
RL = 4 W (SE)
3 10 Gain = 20 dB
2
1 0
10 12 14 16 18 20 22 24 26 28 30 0 2 4 6 8 10 12 14 16 18 20
90 1.8 RL = 4 W (SE)
Gain = 20 dB
80 1.6
60 12 V 1.2
50 1
24 V
40 0.8
30 0.6 18 V
20 0.4
12 V
RL = 8 W (SE)
10 0.2
Gain = 20 dB
0 0
0 4 8 12 16 20 24 28 32 36 40 0 4 8 12 16 20 24 28 32 36 40
0.7 Gain = 20 dB
-30
ICC - Supply Current - A
0.6 18 V
-40
-50
0.5
-60
12 V
0.4
-70
0.3 -80
-90
0.2
-100
0.1
-110
0 -120
0 2.5 5 7.5 10 12.5 15 17.5 20 22.5 25 20 100 1k 10k 20k
PO - Output Power - W f − Frequency − Hz
VCC = 24 V RL = 8 W (BTL)
RL = 8 W (BTL) Gain = 20 dB
PO = 20 W
Gain = 20 dB
1 VCC = 24 V
1
VCC = 18 V
0.1
PO = 5 W VCC = 12 V
0.1
PO = 1 W
0.01
0.001 0.01
20 100 1k 10k 20k 10 m 100 m 1 10 40
f − Frequency − Hz PO − Output Power − W
10 45
Phase
200 40 THD = 10%
Gain - dB
Phase - °
35
0
100 30
25 THD = 1%
-10 VCC = 24 V,
0 20
RL = 8 W (BTL),
Gain = 20 dB, 15
-20 Lfilt = 33 mF, -100 10
Cfilt = 1 mF
5
-30 -200
0
20 100 1k 10k 200k 10 12 14 16 18 20 22 24 26 28 30
f - Frequency - Hz
VSS − Supply Voltage − V
60 12 V
-60
50
40
-80
30 -100
20
RL = 8 W (BTL) -120
10 Gain = 20 dB
0 -140
0 4 8 12 16 20 24 28 32 36 40 20 100 1k 10k 20k
PO − Output Power − W f − Frequency − Hz
APPLICATION INFORMATION
CLASS-D OPERATION
This section focuses on the class-D operation of the TPA3120D2.
+VCC
0V
Output Current
+VCC
0V
+VCC
0V
+VCC
Differential Voltage 0V
Across Speaker
-VCC
Output Current
Supply Pumping
One issue encountered in single ended (SE) class D amplifier designs is supply pumping. Power supply
pumping is a rise in the local supply voltage due to energy being driven back to the supply by operation of the
Class D amplifier. This phenomenon is most evident at low audio frequencies and when both channels are
operating at the same frequency and phase. At low levels, power supply pumping results in distortion in the
audio output due to fluctuations in supply voltage. At higher levels, pumping can cause the overvoltage
protection to operate, which temporarily shuts down the audio output.
INPUT RESISTANCE
Changing the gain setting can vary the input resistance of the amplifier from its smallest value, 10 kΩ± 20%, to
the largest value, 60 kΩ± 20%. As a result, if a single capacitor is used in the input high-pass filter, the -3 dB or
cutoff frequency may change when changing gain steps.
Zf
Ci
Zi
Input IN
Signal
The -3-dB frequency can be calculated using Equation 1. Use the ZI values given in Table 1.
1
f =
2p Zi Ci (1)
INPUT CAPACITOR, CI
In the typical application, an input capacitor (CI) is required to allow the amplifier to bias the input signal to the
proper dc level for optimum operation. In this case, CI and the input impedance of the amplifier (ZI) form a
high-pass filter with the corner frequency determined in Equation 2.
-3 dB
1
fc =
2p Zi Ci
fc (2)
The value of CI is important, as it directly affects the bass (low-frequency) performance of the circuit. Consider
the example where ZI is 20 kΩ and the specification calls for a flat bass response down to 20 Hz. Equation 2 is
reconfigured as Equation 3.
1
Ci =
2p Zi fc (3)
In this example, CI is 0.4 µF; so, one would likely choose a value of 0.47 µF as this value is commonly used. If
the gain is known and is constant, use ZI from Table 1 to calculate CI. A further consideration for this capacitor is
the leakage path from the input source through the input network (CI) and the feedback network to the load. This
leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, especially
in high gain applications. For this reason, a low-leakage tantalum or ceramic capacitor is the best choice. When
polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most
applications as the dc level there is held at 2 V, which is likely higher than the source dc level. Note that it is
important to confirm the capacitor polarity in the application. Additionally, lead-free solder can create dc offset
voltages and it is important to ensure that boards are cleaned properly.
Cfilter Cfilter
ROUT Lfilter
Cfilter
VCLAMP Capacitor
To ensure that the maximum gate-to-source voltage for the NMOS output transistors is not exceeded, one
internal regulator clamps the gate voltage. One 1-µF capacitor must be connected from VCLAMP (pin 11) to
ground and must be rated for at least 16 V. The voltages at the VCLAMP terminal may vary with VCC and may
not be used for powering any other circuitry.
SHUTDOWN OPERATION
The TPA3120D2 employs a shutdown mode of operation designed to reduce supply current (ICC) to the absolute
minimum level during periods of nonuse for power conservation. The SHUTDOWN input terminal should be held
high (see specification table for trip point) during normal operation when the amplifier is in use. Pulling
SHUTDOWN low causes the outputs to mute and the amplifier to enter a low-current state. Never leave
SHUTDOWN unconnected, because amplifier operation would be unpredictable.
For the best power-up pop performance, place the amplifier in the shutdown or mute mode prior to applying the
power supply voltage.
MUTE Operation
The MUTE pin is an input for controlling the output state of the TPA3120D2. A logic high on this terminal causes
the outputs to run at a constant 50% duty cycle. A logic low on this pin enables the outputs. This terminal may
be used as a quick disable/enable of outputs when changing channels on a television or transitioning between
different audio sources.
The MUTE terminal should never be left floating. For power conservation, the SHUTDOWN terminal should be
used to reduce the quiescent current to the absolute minimum level.
SHORT-CIRCUIT PROTECTION
The TPA3120D2 has short-circuit protection circuitry on the outputs that prevents damage to the device during
output-to-output shorts and output-to-GND shorts after the filter and output capacitor (at the speaker terminal.)
Directly at the device terminals, the protection circuitry prevents damage to device during output-to-output,
output-to-ground, and output-to-supply. When a short circuit is detected on the outputs, the part immediately
disables the output drive. This is an unlatched fault. Normal operation is restored when the fault is removed.
THERMAL PROTECTION
Thermal protection on the TPA3120D2 prevents damage to the device when the internal die temperature
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal set point, the device enters into the shutdown state and the outputs are disabled. This is
not a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 30°C. The device
begins normal operation at this point with no external system interaction.
VCC
22 mH
470 mF 470 mF +LOUT
1.0 mF
470 mF
1.0 mF 1 24
PVCCL PGNDL 0.68 mF
Left In 2 SD PGNDL 23
3 PVCCL LOUT 22
4 MUTE BSL 21 -LOUT
5 20 0.22 mF
LIN TPA3120 AVCC VCC
6 RIN AVCC 19
7 BYPASS GAIN0 18 -ROUT
8 AGND GAIN1 17
Right In 0.22 mF
THERMAL
9 AGND BSR 16
10 PVCCR ROUT 15
1.0 mF 1.0 mF 11 14
VCLAMP PGNDR
12 PVCCR PGNDR 13
0.68 mF
25
Shutdown 22 mH
Control +ROUT
Mute 470 mF
Control
1.0 mF
1.0 mF
0.1 mF 10 mF
VCC
22 mH
470 mF 470 mF +OUT
1.0 mF
1.0 mF 1 24
PVCCL PGNDL 0.68 mF
+ In 2 SD PGNDL 23
3 PVCCL LOUT 22
4 MUTE BSL 21
5 20 0.22 mF
LIN TPA3120 AVCC VCC
6 RIN AVCC 19
7 BYPASS GAIN0 18
8 AGND GAIN1 17
0.22 mF
THERMAL
- In 9 AGND BSR 16
10 PVCCR ROUT 15
1.0 mF 1.0 mF 11 14
VCLAMP PGNDR
12 PVCCR PGNDR 13
0.68 mF
25
Shutdown 22 mH
Control -OUT
Mute
Control
1.0 mF
1.0 mF
0.1 mF 10 mF
Power Supply
Power Supply
Lfilt
Evaluation Module
Audio Power
Generator Analyzer
Amplifier
CIN
Lfilt
RGEN RIN CL
VGEN
RANA CANA
Cfilt RL
RANA CANA
The following general rules should be followed when connecting to APAs with SE inputs and outputs:
• Use an unbalanced source to supply the input signal.
• Use an analyzer with balanced inputs.
• Use twisted pair wire for all connections.
• Use shielding when the system environment is noisy.
• Ensure the cables from the power supply to the APA, and from the APA to the load, can handle the large
currents (see Table 4)
Evaluation Module
Audio Power
Generator Analyzer
Amplifier
CIN Lfilt
The generator should have balanced outputs, and the signal should be balanced for best results. An unbalanced
output can be used, but it may create a ground loop that affects the measurement accuracy. The analyzer must
also have balanced inputs for the system to be fully balanced, thereby cancelling out any common-mode noise
in the circuit and providing the most accurate measurement.
The following general rules should be followed when connecting to APAs with differential inputs and BTL
outputs:
• Use a balanced source to supply the input signal.
• Use an analyzer with balanced inputs.
• Use twisted-pair wire for all connections.
• Use shielding when the system environment is noisy.
• Ensure that the cables from the power supply to the APA, and from the APA to the load, can handle the large
currents (see Table 4).
Table 4 shows the recommended wire size for the power supply and load cables of the APA system. The real
concern is the dc or ac power loss that occurs as the current flows through the cable. These recommendations
are based on 12-inch long wire with a 20-kHz sine-wave signal at 25°C.
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Low Power www.ti.com/lpw Telephony www.ti.com/telephony
Wireless
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Low Power www.ti.com/lpw Telephony www.ti.com/telephony
Wireless
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com 29-Mar-2007
PACKAGING INFORMATION
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
TPA3120D2PWP ACTIVE HTSSOP PWP 24 60 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
TPA3120D2PWPR ACTIVE HTSSOP PWP 24 2000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Low Power www.ti.com/lpw Telephony www.ti.com/telephony
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