This document provides specifications for an N-channel enhancement mode MOSFET. Key specifications include:
- Maximum drain-source voltage of 25V
- On-resistance of 5mΩ at a gate-source voltage of 10V
- Continuous drain current rating of 75A at 25°C, falling to 50A at 100°C
- Power dissipation rating of 54W at 25°C, falling to 32.75W at 100°C
- Operating junction temperature range of -55°C to 150°C
This document provides specifications for an N-channel enhancement mode MOSFET. Key specifications include:
- Maximum drain-source voltage of 25V
- On-resistance of 5mΩ at a gate-source voltage of 10V
- Continuous drain current rating of 75A at 25°C, falling to 50A at 100°C
- Power dissipation rating of 54W at 25°C, falling to 32.75W at 100°C
- Operating junction temperature range of -55°C to 150°C
This document provides specifications for an N-channel enhancement mode MOSFET. Key specifications include:
- Maximum drain-source voltage of 25V
- On-resistance of 5mΩ at a gate-source voltage of 10V
- Continuous drain current rating of 75A at 25°C, falling to 50A at 100°C
- Power dissipation rating of 54W at 25°C, falling to 32.75W at 100°C
- Operating junction temperature range of -55°C to 150°C
This document provides specifications for an N-channel enhancement mode MOSFET. Key specifications include:
- Maximum drain-source voltage of 25V
- On-resistance of 5mΩ at a gate-source voltage of 10V
- Continuous drain current rating of 75A at 25°C, falling to 50A at 100°C
- Power dissipation rating of 54W at 25°C, falling to 32.75W at 100°C
- Operating junction temperature range of -55°C to 150°C
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Gate-Source Voltage VGS ±20 V TC = 25 °C 75 Continuous Drain Current ID TC = 100 °C 50 1 A Pulsed Drain Current IDM 170 Avalanche Current IAS 45 Avalanche Energy L = 0.1mH EAS 100 mJ TC = 25 °C 54 Power Dissipation PD W TC = 100 °C 32.75 Operating Junction & Storage Temperature Range TJ, TSTG -55 to 150 1 °C Lead Temperature ( /16" from case for 10 sec.) TL 275
THERMAL RESISTANCE RATINGS
THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Case RqJC 2.3 Junction-to-Ambient RqJA 62.5 °C / W Case-to-Heatsink RqCS 0.6 1 Pulse width limited by maximum junction temperature.
Ver 1.1 1 2013-3-13
P75N02LDG N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS (TC = 25 °C Unless Otherwise Noted)
LIMITS PARAMETER SYMBOL TEST CONDITIONS UNIT MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250mA 25 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250mA 1 1.5 3 Gate-Body Leakage IGSS VDS = 0V, VGS = ±20V ±250 nA VDS = 20V, VGS = 0V 25 Zero Gate Voltage Drain Current IDSS mA VDS = 20V, VGS = 0V , TJ = 125 °C 250 On-State Drain Current1 ID(ON) VDS = 10V, VGS = 10V 75 A Drain-Source On-State VGS = 10V, ID = 30A 5 7 RDS(ON) mΩ Resistance1 VGS = 4.5V, ID = 24A 6.6 10 Forward Transconductance1 gfs VDS = 15V, ID = 30A 55 S DYNAMIC Input Capacitance Ciss 1840 Output Capacitance Coss VGS = 0V, VDS = 15V, f = 1MHz 712 pF Reverse Transfer Capacitance Crss 559 Gate Resistance Rg VDS = 0V, VGS = 15mV,f=1MHz 1.25 Ω Qg(10V) 55 Total Gate Charge2 Qg(4.5V) 30 Qgs(10V) 9.5 Gate-Source Charge2 VDD = 15V, ID = 25A nC Qgs(4.5V) 8.8 Qgd(10V) 19.5 Gate-Drain Charge2 Qgd(4.5V) 19 2 td(on) Turn-On Delay Time 11.5 2 tr Rise Time VDS = 15V, 17 nS Turn-Off Delay Time 2 td(off) ID @ 30A, VGS = 10V, RG= 2.5Ω 32 Fall Time2 tf 7.5 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TC = 25 °C) Continuous Current IS 40 A 1 VSD IF = IS, VGS = 0V Forward Voltage 1.3 V Reverse Recovery Time trr 37 nS Peak Reverse Recovery Current IRM(REC) IF = IS, dlF/dt = 100A / mS 200 A Reverse Recovery Charge Qrr 0.043 mC 1 Pulse test : Pulse Width 300 msec, Duty Cycle 2%. 2 Independent of operating temperature.