Dream of a Rich Future is Now Reality

Corporate Profile
Hynix Semiconductor is a leading supplier of advanced semiconductor memory and Image Sensor products. We design, develop, manufacture and market a wide variety of DRAM and NAND Flash memories, and CMOS Image Sensors (CIS). Memory components are an essential part of leading-edge Computing, Consumer, Communication and Wireless applications. Image Sensors are used in a wide range of wireless communications and handheld consumer applications
DRAM and NAND Flash memories are focus products CMOS Image Sensors will diversify product portfolio 2008 Revenues of USD$6.2bn Market capitalization of USD$2.4bn as of December 2008 Global presence with 4 manufacturing sites and 26 sales offices worldwide 21,400 employees worldwide

Recent Accomplishments

2009~2008
2009 03 Developed and acquired Intel validation for 2-Rank 8GB DDR3 RDIMM 02 Developed the Worlds First 44nm DDR3 DRAM 2008 12 Developed the Worlds First 2Gb Mobile DRAM 11 Introduced Industry's Fastest 7Gbps, 1Gb GDDR5 Graphics DRAM 08 Completed Construction of 300mm Fabrication Plant of 3rd Factory in Cheongju Demonstrated Worlds First 16GB 2-Rank R-DIMM Using MetaRAMTM Technology 04 Developed the world's fastest Mobile LPDDR2 02 Introduced 2-Rank 8GB DDR2 RDIMM 01 Signed an agreement for joint R&D for next-generation non-volatile memory technology with Numonyx Announced 800MHz, 1GB / 2GB UDIMM Intel Validation

2007
2007 11 Signed a partnership agreement with Siliconfile Technologies Inc. to cooperate on CMOS Image Sensor business Acquired Intel validation for 1Gb DDR2 DRAM Developed industrys first 1Gb GDDR5 DRAM 10 Signed PRAM technology and licensing agreement with Ovonyx 09 Developed worlds first 24 stack NAND Flash multi-chip package 08 Signed ZRAM technology and licensing agreement with Innovative Silicon Developed industrys fastest, smallest 1Gb Mobile DRAM

Main Memory _ Graphics Memory _ Consumer Memory _ Mobile Memory _ NAND Flash Memory_
p_4 p_8 p_10 p_12 p_14

CIS
p_17

2007
05 Acquired the industrys first validation on DDR3 DRAM from Intel 03 Signed cross licensing agreement with Sandisk and signed MOU for joint development of x4 NAND Flash technology Developed the worlds fastest ECC Mobile DRAM 01 Founded sales subsidiary in India (HSIS) Developed worlds fastest memory module based on wafer level package technology

2006~2004
2006 12 Announced industrys first 60nm 1Gb DDR2 800MHz based modules Developed the worlds fastest 200MHz 512Mb Mobile DRAM 09 Opened 300mm R&D (3R) fab in Icheon 04 Founded manufacturing company in China (HSMC) 2005 04 Established JV with ST Micro in China (HSSL) 01 Signed strategic alliance with ProMOS 2004 10 Transferred non-memory product lines to MagnaChip Semiconductor Ltd. 08 Signed cooperative agreement with Wuxi City, China to build chip plant

2003~1983
2003 06 Established Environment / Safety / Health Lab 04 Established strategic joint development alliance with STMicro for NAND Flash 2001 03 Changed corporate name to Hynix Semiconductor Inc. 1999 10 Merged with LG Semicon 1983 02 Established Hyundai Electronics Industries Co., Ltd.

Main Memory
DDR3
General Description
The next generation main memory standard, DDR3 SDRAM, can transfer data twice as fast as the current generation DDR2 DRAMs. DDR3 SDRAM boasts high performance and low power consumption. It supports data transfer rate up to 1.6Gb/s and operates at a lower power supply voltage of 1.5V compared to DDR2. The DDR3 SDRAM is eco-friendly for it can operate at even lower voltage of 1.35V contributing to lower power dissipation and extended battery life in mobile systems. The low-power operation is also of benefit to high-density memory systems such as servers and data centers. Hynix plans to offer DDR3 densities from 1Gb to 4Gb, and is currently supporting up to 2Gb DDR3. Hynixs DDR3 modules exploit functions such as ZQ calibration, fly-by topology, dynamic on-die-termination, and levelization to ensure better signal integrity which guarantees higher performance.

DDR3

DDR2 VS. DDR3 Performance / Watt Comparison

DDR2 VS. DDR3

Subject
Data Rate VDD / VDDQ Support Density Bank Data Pre-fetch Package Type Interface DQS Signaling Driver Calibration DQS-CLK De-skewing On Die Termination Reset pin

DDR2
400, 533, 667, 800 Mbps 1.8V 0.1V 256Mb ~ 4Gb 512Mb : 4 Bank / 1Gb : 8 Bank 4 bit 60FBGA for x4 / x8, 84FBGA for x16 SSTL-18 Single / Differential Off-Chip Driver Calibration No Yes No

DDR3
800, 1066, 1333, 1600 Mbps 1.5V 0.075V 512Mb ~ 4Gb 8 Bank 8 bit 78FBGA for x4 / x8, 96FBGA for x16 SSTL-15 Differential Only Self calibration with ZQ pin Yes (Write Leveling) Yes / Dynamic ODT Yes (Soft power-up)

Key Features of High Speed Interface

Experience High Speeds!

Hynix Semiconductor Inc.

Main Memory
PC memory & Server Memory
General Description
It is well known that demand for Notebook PCs has exceeded Desktop PCs. Users now demand a powerful, full-featured mobile system, with low power consumption, extended battery life and connectivity. New portable form factors such as Netbook have emerged in the PC market. Relatively low price point is the primary driving factor, especially in light of the current global economic conditions. Mobility and weight are other features that make this product attractive to consumers. Servers are now consolidating and adopting Virtualization technology to lower TCO (Total Cost of Ownership), with lower hardware costs and efficiencies. Higher speeds and higher density memory would be key requirements in a Virtualized server environment.

DDR2 / DDR3 Speed Migration

Hynix has always been at the leading edge of memory innovation. Hynix is currently supplying 66nm 1Gb DDR2/DDR3 and has started ramping 54nm 1Gb DDR2/DDR3 production. Hynix offers DDR3 Registered DIMMs which provide higher memory density, speed and memory bandwidth, and reliability for high performance servers. Hynix is also developing 1.35V DDR3 RDIMMs for lower power consumption in server platforms.

SODIMM

Your notebook just got a little lighter and faster Portable computing applications can benefit from Hynixs proprietary packaging technology used in high density SODIMMs.

RDIMM

Improve reliability of your server systems with Hynix Registered DIMMs.

SODIMM Features
- 512MB ~ 4GB DDR3 SODIMMs in volume production - Industry standard thickness allows easy installation - Applications include Notebooks in all form factors, Slim PCs, All-in-One PCs and UMPCs - Speeds up to 800MHz DDR2 - Speeds up to 1600MHz DDR3

RDIMM Features
- 1GB ~ 16GB DDR3 RDIMMs in volume production - Industry standard thickness allows easy installation - Low-power operation for servers and datacenters - Speeds up to 800MHz DDR2 - Speeds up to 1333MHz DDR3

High Density in small packages!

Most reliable memory!

Hynix Semiconductor Inc.

Main Memory Product Line-up

DDR2 SDRAM MODULE (240pin-UDIMM)
VDD
DENSITY

MODULE

ORG.

BASED COM.
256Mx8 256Mx8 128Mx8 128Mx8 128Mx8 128Mx8 64Mx8 64Mx8

SPEED
DDR2 800-666 DDR2 667-555 DDR2 800-666 DDR2 667-555 DDR2 800-555 DDR2 800-555 DDR2 800-555 DDR2 800-555 DDR2 800-555 DDR2 800-555

PART NUMBER
HMP351U6AFR8C-S6 HMP351U6AFR8C-Y5 HMP351U7AFR8C-S6 HMP351U7AFR8C-Y5 HYMP125U64CP8-S5 HMP125U6EFR8C-S5 HYMP125U72CP8-S5 HMP125U7EFR8C-S5 HYMP112U64CP8-S5 HMP112U6EFR8C-S5 HYMP112U72CP8-S5 HMP112U7EFR8C-S5 HMP512U6FFP8C-S5 HMP512U7FFP8C-S5

COMPONENT PKG.
FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball)

#OF RANK
2 2 2 2 2 2 2 2 1 1 1 1 2 2

HEIGHT
30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm

AVAIL.
Now Now Now Now Now Now Now Now Now Now Now Now Now Now

512Mx64 4GB 512Mx72 256Mx64 2GB 1.8V 256Mx72 128Mx64 1GB 128Mx72 128Mx64 128Mx72

DDR2 SDRAM MODULE (240pin-RDIMM)

VDD
DENSITY

MODULE

ORG.

BASED COM.
512Mx4 512Mx4 (DDP) 256Mx4 128MX8

SPEED
DDR2 800-555 DDR2 800-555 DDR2 667-555 DDR2 800-555 DDR2 800-555 DDR2 800-555 DDR2 667-555

PART NUMBER
HMP31GP7AFR4C-S5 HMP31GP7EMR4C-S5 HYMP31GP72CMP4-Y5 HMP31G7EMR4C-Y5 HYMP151P72CP4-S5 HMP151P7EFR4C-S5 HYMP125P72CP8-S5 HMP125P7EFR8C-S5 HYMP125P72CP4-S5 HMP125P7EFR4C-S5 HMP525P7FFP4C-Y5

COMPONENT PKG.
FBGA (60ball) FBGA (63ball) FBGA (63ball) FBGA (63ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball)

#OF RANK
2 4 4 4 2 2 2 2 1 1 2

HEIGHT
30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm

AVAIL.
Now Now Now Now Now Now Now Now Now Now Now

8GB 1.8V

1Gx72 512Mx72

4GB

2GB

256Mx72

256MX4 128Mx4

DDR2 SDRAM MODULE (240pin-VLP RDIMM)

VDD
DENSITY

MODULE

ORG.

BASED COM.
1Gx4 (QDP) 1Gx4 (DDP) 512Mx4 (DDP) 256MX4

SPEED
DDR2 667-555 DDR2 533-444 DDR2 800-555 DDR2 667-555 DDR2 800-555 DDR2 800-555

PART NUMBER
HYMP41GP72CNP4L-Y5 HYMP41GP72CNP4L-C4 HMP41GV7AMR4C-S5 HMP41GV7AMR4C-Y5 HYMP351P72CMP4L-S5 HMP351V7EMR4C-S5 HYMP125P72CP4L-S5 HMP125V7EFR4C-S5

COMPONENT PKG.
FBGA (65ball) FBGA (65ball) FBGA (63ball) FBGA (63ball) FBGA (63ball) FBGA (63ball) FBGA (60ball) FBGA (60ball)

#OF RANK
4 4 4 4 2 2 2 2

HEIGHT
18.3mm 18.3mm 18.3mm 18.3mm 18.3mm 18.3mm 18.3mm 18.3mm

AVAIL.
Now Now Now Now Now Now Now Now

8GB 1.8V 4GB 2GB

1Gx72

512Mx72 256Mx72

DDR2 SDRAM MODULE (240pin-FBDIMM)

VDD
DENSITY

MODULE

ORG.

BASED COM.
512Mx4 (DDP) 512Mx4 256Mx4

SPEED
DDR2 800-555 DDR2 800-666 DDR2 800-555 DDR2 800-555 DDR2 800-555 DDR2 800-555 DDR2 667-555 DDR2 667-555 DDR2 667-555

PART NUMBER
HMP31GF7EMR4C-S5xx HYMP31GF72CMP4xx-S5 HMP31GF7AFR4C-S6xx HMP151F7EFR4C-S5xx HYMP151F72CP4xx-S5 HMP151F7EFR8C-S5xx HYMP151F72CP8xx-S5 HMP125F7EFR8C-S5xx HYMP125F72CP8xx-S5 HMP525F7FFP4C-S5xx HYMP525F72CP4xx-S5 HMP31GL7AFR4C-Y5xx HMP151L7EFR4C-Y5xx HYMP151L72CP4xx-Y5 HMP125L7EFR8C-Y5xx HYMP125L72CP8xx-Y5

COMPONENT PKG.
FBGA (63ball) FBGA (63ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball)

#OF RANK
4 4 2 2 2 4 4 2 2 2 2 2 2 2 2 2

HEIGHT
30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm

AVAIL.
Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now

8GB

1Gx72

1.8V

4GB

512Mx72 128Mx8 128MX8

2GB 8GB 1.55V 4GB 2GB

256Mx72 128MX4 1Gx72 512Mx72 256Mx72 512Mx4 256Mx4 128MX8

DDR2 SDRAM MODULE (240pin-SODIMM)

VDD
DENSITY

FBD P/N xx : (AMB vender)(Revison)

AMB vender N: intel, D: IDT, E NEC

MODULE

ORG.

BASED COM.
256Mx8 128Mx8 64Mx16 128Mx8

SPEED
DDR2 800-666 DDR2 800-555 DDR2 800-555 DDR2 667-555

PART NUMBER
HMP351S6AFR8C-S6 HYMP125S64CP8-S5 HMP125S6EFR8-S5 HYMP112S64CP6-S5 HMP112S6EFR6-S5 HYMP512S64CP8-Y5

COMPONENT PKG.
FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball)

#OF RANK
2 2 2 2 2 2

HEIGHT
30mm 30mm 30mm 30mm 30mm 30mm

AVAIL.
Now Now Now Now Now Now

4GB 2GB 1.8V 1GB

512Mx64 256Mx64 128Mx64

Not all products are listed here. Please contact local sales administrator for the complete list of products.
6 Hynix Semiconductor Inc.

Main Memory Product Line-up

DDR3 SDRAM MODULE (240pin-UDIMM)
VDD
DENSITY

MODULE

ORG.

BASED COM.
256Mx8 256Mx8 128Mx8 128Mx8 128Mx8 128Mx8

SPEED
1333-999 1333-999 1333-999 1333-999 1333-999 1333-999

PART NUMBER
HMT351U6MFR8C-H9 HMT351U6AFR8C-H9 HMT351U7MFR8C-H9 HMT351U7AFR8C-H9 HMT125U6AFP8C-H9 HMT125U6BFR8C-H9 HMT125U7AFP8C-H9 HMT125U7BFR8C-H9 HMT112U6AFP8C-H9 HMT112U6BFR8C-H9 HMT112U7AFP8C-H9 HMT112U7BFR8C-H9

COMPONENT PKG.
FBGA (82ball) FBGA (82ball) FBGA (82ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (78ball)

#OF RANK
2 2 2 2 2 2 2 2 1 1 1 1

HEIGHT
30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm

AVAIL.
Now Now Now Now Now Now Now Now Now Now Now Now

512Mx64 4GB 512Mx72 256Mx64 2GB 256Mx72 128Mx64 1GB 128Mx72

1.5V

DDR3 SDRAM MODULE (240pin-RDIMM)

VDD
DENSITY

MODULE

ORG.

BASED COM.
1Gx4 (DDP) 512Mx8 (MetaRAM DDP) 512Mx4 (Planar) 256Mx8

SPEED
1066-777 1333 1066 1333-999 1066-777 1066-777 1333 1066 1333-999 1066-777 1333-999 1333-999 1333-999 1333-999 1066-777 1066-777

PART NUMBER
HMT42GR7AMR4C-G7 HMT42GR7AUP4C-HE HMT42GR7AUP4C-GC HMT31GR7AFR4C-H9 HMT31GR7AFR8C-G7 HMT31GR7AMP4C-G7 HMT31GR7BMR4C-G7 HMT31GR7AUP4C-HF HMT31GR7AUP4C-GC HMT351R7AFR8C-H9 HMT151R7AFP8C-G7 HMT151R7BFR8C-G7 HMT151R7AFP4C-H9 HMT151R7BFR4C-H9 HMT125R7AFP4C-H9 HMT125R7BFR4C-H9 HMT325R7AFR8C-H9 HMT125R7AFP8C-H9 HMT125R7BFR8C-H9 HMT325R7AFR8C-G7 HMT125R7AFP8C-G7 HMT125R7BFR8C-G7

COMPONENT PKG.
FBGA (82ball) FBGA (82ball) FBGA (82ball) FBGA (82ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) FBGA (78ball)

#OF RANK
4 2 2 2 4 4 4 2 2 2 4 4 2 2 1 1 1 1 1 1 1 1

HEIGHT
30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm

AVAIL.
Q3 '09 Q3 '09 Q3 '09 June '09 June '09 Now April '09 May '09 Now June '09 Now Now Now Now Now Now June '09 Now Now June '09 Now Now

16GB

2Gx72

8GB

1Gx72

512Mx4 (DDP) 256Mx8 (MetaRAM DDP) 256Mx8

1.5V 4GB 512Mx72

128Mx8 256Mx4 256Mx4 256Mx8

2GB

256Mx72

128Mx8 256Mx8 128Mx8

DDR3 SDRAM MODULE (240pin-VLP RDIMM)

VDD
DENSITY

MODULE

ORG.

BASED COM.
1Gx4 (DDP) 512Mx4 (DDP)

SPEED
1066-777 1333-999 1066-777 1333-999 1333-999 1333-999

PART NUMBER
HMT41GV7AMR4C-G7 HMT351V7AMP4C-H9 HMT351V7BMR4C-H9 HMT351V7AMR8C-G7 HMT351V7BMR8C-G7 HMT351V7AFR8C-H9 HMT125V7AFP4C-H9 HMT125V7BFR4C-H9 HMT125V7AFP8C-H9 HMT125V7BFR8C-H9

COMPONENT PKG.
FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (78ball)

#OF RANK
4 2 2 4 4 2 1 1 2 2

HEIGHT
18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm

AVAIL.
Q3 '09 Now Apr '09 Now Apr '09 Q3 '09 Now Now Now Now

8GB

1Gx72

4GB 1.5V 2GB 2GB

512Mx72

256Mx8 (DDP) 512Mx4 (Planar)

256Mx72 256Mx72

256Mx4 128Mx8

DDR3 SDRAM MODULE (240pin-SODIMM)

VDD
DENSITY

MODULE

ORG.

BASED COM.
256Mx8 128Mx8 64Mx16

SPEED
1333-999 1333-999 1333-999

PART NUMBER
HMT351S6AFR8C-H9 HMT125S6AFP8C-H9 HMT125S6BFR8C-H9 HMT112S6AFP6C-H9 HMT112S6BFR6C-H9

COMPONENT PKG.
FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (96ball) FBGA (96ball)

#OF RANK
2 2 2 2 2

HEIGHT
30mm 30mm 30mm 30mm 30mm

AVAIL.
Q3 '09 Now Now Now Now

4GB 1.5V 2GB 1GB

512Mx64 256Mx64 128Mx64

Not all products are listed here. Please contact local sales administrator for the complete list of products.
The information in this product brochure is subject to change. Up to date information on our products and technologies may be obtained from our website. www.hynix.com

Hynix Semiconductor Inc.

Graphics Memory
54nm 1Gb GDDR5 General Information
Product Bit Organization Op. Frequency Power Supply Package Interface Function 1Gb GDDR5 (54nm Tech) 16Bank 2Mbit 32 I/O 16Bank 4Mbit 16 I/O Up to 7Gbps VDD(Q) = 1.5V FBGA 170 ball (12mm 14mm) POD_15 Refresh : 8192 cycle / 32ms CL = 5 ~ 20, BL = 8 Burst Type : Sequential Data Mask @ Write

Experience the Richness of Entertainment

General Description
Since the introduction of the worlds first Graphics DDR SDRAM in 1999, Hynix has played a leadership role in the Graphics memory market by offering cost effective and high performance products. Last November Hynix introduced the worlds fastest 1Gb GDDR5 Graphics DRAM. The newly introduced 1Gb GDDR5 is built on the companys leading edge 54 nm process technology. It operates at 7Gbps which is 40% improvement compared to 66nm 5Gbps GDDR5, and processes up to 28GB/s (Gigabyte per seconds). It is also designed to minimize power consumption at 1.35V power supply. This product is ideal in high-end applications including high-end PC and next generation game consoles which require higher graphic performance and quality to deliver a rich entertainment experience to the end user. Hynix also supports GDDR3, DDR3 and DDR2 products for performance and mainstream markets. Hynix will contribute more values for our customers success with the higher performance, quality and technology leadership.

Picture 1. Graphic Memory Bandwidth Trend

Applications

Graphics Product Spec. Comparison

Hynix Semiconductor Inc.

Graphics Memory Product Line-up

GRAPHICS DDR2 SDRAM
DENSITY
1Gb

ORG.
64M 16

SPEED
500MHz (2.0ns) 400MHz (2.5ns) 400MHz (2.5ns) 600MHz (1.6ns) 500MHz (2.0ns) 500MHz (2.0ns) 400MHz (2.5ns) 500MHz (2.0ns) 450Mhz (2.2ns) 400MHz (2.5ns) 350Mhz (2.8ns) 300Mhz (3.3ns) 600MHz (1.6ns) 500MHz (2.0ns) 500MHz (2.0ns) 450MHz (2.2ns) 400MHz (2.5ns) 350MHz (2.8ns)

PART NUMBER
H5PS1G63EFR-20L H5PS1G63EFR-25C HY5PS1G1631CFR-25C H5PS5162FFR-16C H5PS5162FFR-20C H5PS5162FFR-20L H5PS5162FFR-25C HY5PS121621CFP-2 HY5PS121621CFP-22 HY5PS121621CFP-25 HY5PS121621CFP-28 HY5PS121621CFP-33 HY5PS561621BFP-16 HY5PS561621BFP-2 HY5PS561621BFP-2L HY5PS561621BFP-22 HY5PS561621BFP-25 HY5PS561621BFP-28

PKG.
FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball)

FEATURE
8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 4Bank, 2.0V / 2.0V 4Bank, 2.0V / 2.0V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 2.0V / 2.0V 4Bank, 2.0V / 2.0V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 2.0V / 2.0V 4Bank, 2.0V / 2.0V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V

AVAIL.
Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now

512Mb

32M 16

256Mb

16M 16

GRAPHICS DDR3 SDRAM

DENSITY ORG. SPEED
900MHz (1.1ns) 800MHz (1.2ns) 800MHz (1.2ns) 700Mhz (1.4ns) 800MHz (1.2ns) 700Mhz (1.4ns) 600MHz (1.6ns) 700MHz(1.4ns) 600MHz (1.6ns) 500MHz (2.0ns) 1,000MHz (1.0ns) 900MHz (1.1ns) 800MHz (1.2ns) 700Mhz (1.4ns) 800MHz (1.2ns) 700Mhz (1.4ns) 600MHz (1.6ns) 500MHz (2.0ns)

PART NUMBER
H5TS1G63BFR-11C H5TS1G63BFR-12C H5TQ1G63BFR-12C H5TQ1G63BFR-14C H5TS1G63AFR-12C H5TS1G63AFR-14C H5TS1G63AFR-16C H5TQ1G63AFR-14C H5TQ1G63AFR-16C H5TQ1G63AFR-20C H5TS5163MFR-N0C H5TS5163MFR-11C H5TS5163MFR-12C H5TS5163MFR-14C H5TQ5163MFR-12C H5TQ5163MFR-14C H5TQ5163MFR-16C H5TQ5163MFR-20C

PKG.
FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball)

FEATURE
8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.5V / 1.5V 4Bank, 1.5V / 1.5V 4Bank, 1.5V / 1.5V 4Bank, 1.5V / 1.5V

AVAIL.
Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now

1Gb

64M 16

512Mb

32M 16

GRAPHICS GDDR3 SDRAM

DENSITY ORG. SPEED
1,300MHz (0.77ns) 1,200MHz (0.8ns) 1,000MHz (1.0ns) 900MHz (1.1ns) 700MHz (1.4ns) 1,300MHz (0.77ns) 1,200MHz (0.8ns) 1,000MHz (1.0ns) 900MHz (1.1ns) 700MHz (1.4ns) 500MHz (2.0ns) 700MHz (1.4ns) 550MHz (1.8ns)

PART NUMBER
H5RS1H23MFR-N3C H5RS1H23MFR-N2C H5RS1H23MFR-N0C H5RS1H23MFR-11C H5RS1H23MFR-14C H5RS5223CFR-N3C H5RS5223CFR-N2C H5RS5223CFR-N0C H5RS5223CFR-11C H5RS5223CFR-14C H5RS5223CFR-20C H5RS5223CFR-14L H5RS5223CFR-18C

PKG.
FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball)

FEATURE
8banks, 1.9V / 1.9V 8banks, 1.9V / 1.9V 8banks, 1.9V / 1.9V 8banks, 1.8V /1 .8V 8banks, 1.8V / 1.8V 8Bank, 2.05V / 2.05V 8Bank, 2.05V / 2.05V 8Bank, 2.05V / 2.05V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V

AVAIL.
Now Now Now Now Now Now Now Now Now Now Now Now Now

1Gb

32M 32

512Mb

16M 32

GRAPHICS GDDR5 SDRAM

DENSITY ORG. SPEED
6.0Gbps 5.5Gbps 5.0Gbps 4.5Gbps 4.0Gbps 4.5Gbps 4.0Gbps 3.6Gbps 3.2Gbps 4.5Gbps 4.0Gbps 3.6Gbps 3.2Gbps

PART NUMBER
H5GQ1H24AFR-R0C H5GQ1H24AFR-T3C H5GQ1H24AFR-T2C H5GQ1H24AFR-T1C H5GQ1H24AFR-T0C H5GQ1H24MJ(F)R-T1C H5GQ1H24MJ(F)R-T0C H5GQ1H24MJ(F)R-N8C H5GQ1H24MJ(F)R-N6C H5GQ5223MFR-T1C H5GQ5223MFR-T0C H5GQ5223MFR-N8C H5GQ5223MFR-N6C

PKG.
FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball)

FEATURE
16Bank, TBD 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V

AVAIL.
Q2 '09 Q2 '09 Q2 '09 Q2 '09 Q2 '09 Now Now Now Now Now Now Now Now

1Gb

32M 32

512Mb

16M 32

The information in this product brochure is subject to change. Up to date information on our products and technologies may be obtained from our website. www.hynix.com

Hynix Semiconductor Inc.

Consumer Memory
General Description
We now live in the Digital Era. Digital televisions, DVD and Set-Top Box give us rich entertainment, while Car navigation systems provide comfort and convenience. All of these digital consumer appliances need semiconductor memory for performance improvement, power savings and size reduction. Hynix has full line-up of DRAM (Dynamic RAM) to meet the needs of a wide range of consumer applications. Hynix offers a family of SDRAM (Synchronous DRAM) in 64Mb~256Mb densities, packaged in TSOP-II & FBGA offered at industrial range temperature range of -40C to 85C and featuring very low power consumption. DDR & DDR2 SDRAMs (Double Data Rate SDRAMs) are available for high-end consumer applications requiring higher data transfer rates. In many applications, such as Digital Television and Set-Top-Box, SDRAM has been replaced by DDR & DDR2 SDRAM technologies. Sometimes, the most important things may not be visible Although hidden from view, Hynix Consumer Memories have been used in a variety of applications offered by a number of companies to realize a multitude of miracles.

Consumer DRAM Usage Map

Consumer DRAM Readiness

Good things come in small packages!

10 Hynix Semiconductor Inc.

Consumer Memory Product Line-up

SDR SDRAM
DENSITY ORG.
x16 x16 64Mb x16 x16 x16 x16 128Mb x16 x16 x16 x8 x16 x16 256Mb x32 x8 x16 x16

PART NUMBER
HY57V641620FTP HY57V66FFP HY5V66FF6P H57V6462GTR H57V6462GFR HY57V281620FTP HY5V26FFP H57V1262GTR H57V1262GFR HY57V56820FTP HY57V561620FTP HY5V56FFP HY5V52AFP H57V2582GTR H57V2562GTR H57V2562GFR

SPEED
5/6/7/H 5/6/7/H 5/6/7/H 50 / 60 / 75 / A3 50 / 60 / 75 / A3 5/6/7/H 5/6/7/H 50 / 60 / 75 / A3 50 / 60 / 75 / A3 6/H 6/H 6/H 6/H 50 / 60 / 75 / A3 50 / 60 / 75 / A3 50 / 60 / 75 / A3

POWER
Normal / Low Normal / Low Normal Power Normal Power Normal Power Normal / Low Normal / Low Normal Power Normal Power Normal / Low Normal / Low Normal / Low Normal / Low Normal Power Normal Power Normal Power

PKG.
TSOP FBGA FBGA TSOP FBGA TSOP FBGA TSOP FBGA TSOP TSOP FBGA FBGA TSOP FBGA FBGA

VOL.
3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V

AVAIL.
Now Now Now Q3 '09 Q3 '09 Now Now Q3 '09 Q3 '09 Now Now Now Now Q3 '09 Q3 '09 Q3 '09

DDR SDRAM
DENSITY
64Mb

ORG.
x16 x16 x16 x16 x16 x8 x16 x16

PART NUMBER
H5DU6462CTR H5DU6462CFR HY5DU281622FTP H5DU1262GTR H5DU1262GFR HY5DU568822FTP HY5DU561622FTP HY5DU561622FFP H5DU2582GTR H5DU2562GFR H5DU2582GTR H5DU2562GFR HY5DU128822DTP HY5DU12822DFP HY5DU121622DTP HY5DU121622DFP H5DU5182ETR H5DU5182EFR H5DU5162ETR H5DU5162EFR

SPEED
J / D43 / D5 J / D43 / D5 4 / 5 / D43 / D4 / J / H F4 / E3 / E4 / J3 / K2 / K3 F4 / E3 / E4 / J3 / K2 / K3 4 / D43 / J 4 / D43 / J 4 / D43 / J F4 / E3 / E4 / J3 / K2 / K3 F4 / E3 / E4 / J3 / K2 / K3 F4 / E3 / E4 / J3 / K2 / K3 F4 / E3 / E4 / J3 / K2 / K3 D43 / J / K / H / L D43 / J / K / H / L D43 / J / K / H / L D43 / J / K / H / L F4 / E3 / E4 / J3 / K2 / K3 F4 / E3 / E4 / J3 / K2 / K3 F4 / E3 / E4 / J3 / K2 / K3 F4 / E3 / E4 / J3 / K2 / K3

POWER
Normal / Low Normal / Low Normal / Low Normal / Low Normal / Low Normal / Low Normal / Low Normal / Low Normal Power Normal Power Normal Power Normal Power Normal Power Normal Power Normal Power Normal Power Normal Power Normal Power Normal Power Normal Power

PKG.
TSOP FBGA TSOP TSOP FBGA TSOP TSOP FBGA TSOP FBGA TSOP FBGA TSOP FBGA TSOP FBGA TSOP FBGA TSOP FBGA

VOL.
2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V 2.5V

AVAIL.
Now Now Now Q2 '09 Q2 '09 Now Now Now Q3 '09 Q3 '09 Q3 '09 Q3 '09 Now Now Now Now Q4 '09 Q4 '09 Q4 '09 Q4 '09

128Mb

256Mb

x8 x16 x8 x16 x8 x8 x16 x16 x8 x8 x16 x16

512Mb

DDR2 SDRAM
DENSITY
256Mb

ORG.
x16 x16 x8 x8 x16 x16 x8 x8 x16 x16 x16

PART NUMBER
HY5P5561621BFP HY5P5561621BFR HY5PS12821CFP H5PS5182FFR HY5PS121621CFP H5PS5162FFR HY5PS1G831CFP H5PS1G83EFR HY5PS1G1631CFP H5PS1G63EFR H5PS2G63EMR

SPEED
E3 / C4 / Y5 / S5 E3 / C4 / Y5 / S5 E3 / C4 / Y4 / Y5 / S5 E3 / C4 / Y4 / Y5 / S5 E3 / C4 / Y4 / Y5 / S5 E3 / C4 / Y4 / Y5 / S5 / G7 E3 / C4 / Y5 / S5 E3 / C4 / Y5 / S5 E3 / C4 / Y5 / S5 E3 / C4 / Y5 / S5 / G7 Y5 / S5

POWER
Normal / Low Normal / Low Normal / Low Normal / Low Normal / Low Normal / Low Normal / Low Normal / Low Normal / Low Normal / Low Normal / Low

PKG.
FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA

VOL.
1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V

AVAIL.
Now Now Now Now Now Now Now Now Now Now Q3 '09

512Mb

1Gb

2Gb

The information in this product brochure is subject to change. Up to date information on our products and technologies may be obtained from our website. www.hynix.com

Hynix Semiconductor Inc. 11

Mobile Memory
General Description
Hynix Mobile Memory technology unleashes the best mobile experience on the go. As mobile devices get smaller, sleeker, and lighter than ever, consumers will be able to choose from a wide range of mobile devices to keep them connected, entertained, informed, and productive. As consumers life styles become more mobile, there is ever increasing demand for connectivity. Mobile devices will require high performance memories, with very low power consumption for extended battery life. Devices that use Hynix Mobile Memory enables everything you love on-the-go. Hynix Mobile Memory products offered in small footprint packages have superior power saving features useful in all handheld devices such as cellular phones, PDAs, MP3 players, etc. Hynix Mobile Memories are ideal for portable applications which require very low power consumption. Hynixs Mobile Business Group offers a broad variety of products enabling our customers to deliver next-generation devices in time to market.

Mobile DRAM
Broad Product Line: SDR / DDR, x16 / x32 organizations, 128Mb to 2Gb densities Diverse Packaging Options: Discrete, KGD (Known Good Die), MCP (Multi Chip Package), PoP (Package on Package), Ci-MCP (Card Interface MCP) Small Form Factor Packages: For use in the most space-constrained handheld applications Low Power Features: Programmable Drive strength, Partial Array Self Refresh, Auto Temperature Compensated Self Refresh mode Major Applications: Mobile Phone, PDA, MP3 Player, Digital Still Camera, MID(Mobile Internet Device), PND(Portable Navigation Device), Personal Media Player (PMP), Handheld Game Console

MCP Line-up

MCP
Small Form Factor package saves space in Handheld Devices High Capacity Data Storage, High Speed, with Low Power Consumption In-house manufacturing provides cost efficient solutions in a timely manner Major Application - Mobile Phone, Smartphone, PDA Phone, Digital Still Camera, MID(Mobile Internet Device), Wireless LAN Card, Handheld Game Console

e-NAND Introduction & Concept

e-NAND
e-NAND : Combination of NAND Flash and the Flash Controller with MMC interface, in a single package Simple read/write memory using standard MMC 4.2 protocol interface. No additional firmware for NAND management required Controller includes NAND software such as FTL, ECC, FAT-16/32

Enhanced Mobility with Small Components!

12 Hynix Semiconductor Inc.

Mobile Memory Product Line-up

MOBILE SDR
DENSITY
128M 16 2G 64M 32 64M 32 (reduced page) 64M 16 1G 32M 32 32M 32 (reduced page) 32M 16 16M 32 512Mb 32M 16 16M 32 16M 32 (reduced page) 16M 16 8M 32 256Mb 16M 16 8M 32 8M 32 (reduced page) 128Mb 8M 16 4M 32

ORG.

PART NUMBER
H55S2G62MFR-60M H55S2G22MFR-60M H55S2G32MFR-60M H55S1G62MFP-60M H55S1G22MFP-60M H55S1G32MFP-60M HY5S7B6ALFP-6E HY5S7B2ALFP-6E H55S5162DFR-60M H55S5122DFR-60M H55S5132DFR-60M HY5S5B6HLFP-6E HY5S5B2CLFP-6E H55S2562JFR-60M H55S2622JFR-60M H55S2532JFR-60M H55S1262EFP-60M H55S1222EFP-60M

SPEED
166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns) 166MHz (6.0ns)

VOL.
1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V

PKG.
FBGA(54ball) / KGD FBGA(90ball) / KGD FBGA(90ball) / KGD FBGA(54ball) / KGD FBGA(90ball) / KGD FBGA(90ball) / KGD FBGA(54ball) / KGD FBGA(90ball) / KGD FBGA(54ball) / KGD FBGA(90ball) / KGD FBGA(90ball) / KGD FBGA(54ball) / KGD FBGA(90ball) / KGD FBGA(54ball) / KGD FBGA(90ball) / KGD FBGA(90ball) / KGD FBGA(54ball) / KGD FBGA(90ball) / KGD

AVAIL.
Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now

MOBILE DDR
DENSITY
128M 16 2Gb 64M 32 64M 32 (reduced page) 64M 16 1Gb 32M 32 32M 32 (reduced page) 32M 16 16M 32 512Mb 32M 16 16M 32 16M 32 (reduced page) 16M 16 8M 32 256Mb 16M 16 8M 32 8M 32 (reduced page) 128Mb 8M 16 4M 32

ORG.

PART NUMBER
H5MS2G62MFR-J3M / E3M H5MS2G22MFR-J3M / E3M H5MS2G32MFR-J3M / E3M H5MS1G62MFP-J3M / E3M H5MS1G22MFP-J3M / E3M H5MS1G32MFP-J3M / E3M HY5MS7B6BLFP-6E HY5MS7B2BLFP-6E H5MS5162DFR-J3M / E3M H5MS5122DFR-J3M / E3M H5MS5132DFR-J3M / E3M HY5MS5B6BLFP-6E HY5MS5B2ALFP-6E H5MS2562JFR-J3M / E3M H5MS2622JFR-J3M / E3M H5MS2532JFR-J3M / E3M H5MS1262EFP-J3M / E3M H5MS1222EFP-J3M / E3M

SPEED
DDR333 / DDR400 DDR333 / DDR400 DDR333 / DDR400 DDR333 / DDR400 DDR333 / DDR400 DDR333 / DDR400 DDR333 DDR333 DDR333 / DDR400 DDR333 / DDR400 DDR333 / DDR400 DDR333 DDR333 DDR333 / DDR400 DDR333 / DDR400 DDR333 / DDR400 DDR333 / DDR400 DDR333 / DDR400

VOL.
1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V

PKG.
FBGA(60ball) / KGD FBGA(90ball) / KGD FBGA(90ball) / KGD FBGA(60ball) / KGD FBGA(90ball) / KGD FBGA(90ball) / KGD FBGA(60ball) / KGD FBGA(90ball) / KGD FBGA(60ball) / KGD FBGA(90ball) / KGD FBGA(90ball) / KGD FBGA(60ball) / KGD FBGA(90ball) / KGD FBGA(60ball) / KGD FBGA(90ball) / KGD FBGA(90ball) / KGD FBGA(60ball) / KGD FBGA(90ball) / KGD

AVAIL.
Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now

The information in this product brochure is subject to change. Up to date information on our products and technologies may be obtained from our website. www.hynix.com

Hynix Semiconductor Inc. 13

NAND Flash Memory

General Description
Hynix provides a broad range of NAND Flash products density from 128Mb to 256Gb with various types of packaging. (TSOP, ULGA and FBGA) Due to the proliferation of digital content, NAND Flash memory products are used in a wide variety of applications such as MP3, PMP, Digital camera, Camcorder, Memory card, USB flash drive and other consumer electronics such as Game console, Navigation. Currently, Hynix NAND Flash Memory is being widely adopted in the mobile handset application and we are also developing PC storage solutions based on the NAND Flash chips. To meet the growing demand for high capacity and improved performance in mobile applications, Hynix is offering HiFFS(Flash File System) software with eHiFFS system that enhances NAND chip performance and reliability.

NAND Flash Key Features

Product Voltage Organization Page & Block size (byte) tRC (min.) / tWC (min.) 25ns tR (max) Program time (typ) Erase time (typ) MONO / DDP Operating Current (ICC) QDP / DSP Copy-back Cache program Function Cache Read 2 plane Op. Extended Data Out Special Function OTP Unique ID 48nm 16Gb MLC 3.3V 8 4KB + 128B / 512KB 25ns 60us < 800us 2.5ms 15(typ.) ~ 30mA(max) 20(typ.) ~ 40mA(max) O with Data out Write, Read & Erase O O O 41nm 32Gb MLC 3.3V 8 4KB + 224B / 512KB 25ns 60us 1000us(TBD) 2.5ms 20(typ.) ~ 40mA(max) 20(typ.) ~ 40mA(max)(TBD) O with Data out O O Write, Read & Erase O O O 3xnm 32Gb MLC 3.3V 8 8KB + 436B / 1MB 30ns 400us(max) 1600us(TBD) 1.5ms 30(typ.) ~ 50mA(max) 30(typ.) ~ 50mA(max) O with Data out O O Write, Read & Erase O O O

Endurance / PKG
E/W Cycles / Retention NOP PKG 5K / 10years 1 TSOP / ULGA / DSP 5K / 10years 1 VLGA TBD TBD VLGA(TBD)

NAND Flash Application

14 Hynix Semiconductor Inc.

Software Support
HiFFS Software
The management of data on NAND Flash memory is complicated due to limitations of NAND Flash memory. One of the most important limitations of NAND Flash memory is the inability to rewrite data without block erase. HiFFS Software solution is required to compensate for erase cycle limitations. Additionally, it extends the life of Hynix NAND Flash with wear-leveling algorithms. eHiFFS is the software solution for mobile embedded systems. It is an essential system software for consumer applications including Smart phones, PDAs, MP3 player, PMPs, Digital TVs and Digital Camcoders.

eHiFFS Software
eHiFFS software supports partition manager, logical to physical mapping, wear-leveling, bad block management and prevents read disturbance. High Performance / High Reliability / Ease of Portability

Host Interface - Supports various host interfaces ( ONFI BA, LBA, eMMC etc...) - Option for additional features Robust Flash Management with Hynix proprietary Software (eHiFFS) High performance interface optimized for Hynix NAND Flash

NAND Flash Storage for Fun and Excitement!

Hynix Semiconductor Inc. 15

NAND Flash Product Line-up

SLC
PRODUCT
HY27US08281A HY27US08561A HY27US08121B H27U518S2C HY27US081G1M HY27US081G1A HY27UF081G2A HY27US081G2A H27U1G8F2B HY27UF082G2B HY27UF084G2B HY27UG088G5(D)B HY27UH08AG5B H27UAG8F2M H27UBG8G2M H27UCG8H2M

TECH
90nm 90nm 70nm 57nm 70nm 57nm 70nm 70nm 48nm 57nm 57nm 57nm 57nm 41nm 41nm 41nm

CELL

DENSITY
128Mb 256Mb 512Mb 512Mb 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 4Gb 8Gb 16Gb 16Gb 32Gb 64Gb

BLOCK SIZE
16KB 16KB 16KB 16KB 16KB 16KB 128KB 128KB 128KB 128KB 128KB 128KB 128KB 256KB (4KB Page) 256KB (4KB Page) 256KB (4KB Page)

STACK
Mono Mono Mono Mono Mono Mono Mono Mono Mono Mono Mono DDP QDP Mono DDP QDP

VCC/ORG
3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 1.8V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8

PACKAGE
TSOP / USOP TSOP / USOP / FBGA TSOP / USOP / FBGA TSOP USOP TSOP TSOP / USOP / FBGA FBGA TSOP TSOP / FBGA TSOP TSOP / LGA TSOP ULGA ULGA ULGA

AVAILABILITY
NOW NOW NOW Dec 08 NOW NOW NOW NOW Dec 08 NOW NOW NOW NOW May 09 Jun 09 Jun 09

REMARK
EOL DEC 10 EOL DEC 10 EOL DEC 09 EOL DEC 10 EOL DEC 09 EOL DEC 10 EOL DEC 09 EOL DEC 09 EOL DEC 11 EOL Jun 10 EOL Jun 10 2CE / Dual CH. 2CE 2CE 2CE

SLC

MLC / TLC
PRODUCT
HY27UT084G2A HY27UT088G2A H27U8G8T2B HY27UU08AG5A H27UAG8T2M H27UAG8T2A HY27UV08BG5A H27UBG8U5M H27UBG8T2M HY27UW08CGFA H27UCG8V5M H27UCG8UDM H27UDG8WFM H27UDG8WFMTR-BC H27UDG8YFMXR-BC H27UDG8VEM H27UEG8YEM H2EUCG8N11YR-C H2EUDG8P11XR-C H27UCG8H2M

TECH
57nm 57nm 48nm 57nm 48nm 41nm 57nm 48nm 41nm 57nm 48nm 41nm 48nm 48nm 48nm 41nm 41nm 48nm 48nm 41nm

CELL

DENSITY
4Gb 8Gb 8Gb 16Gb 16Gb 16Gb 32Gb 32Gb 32Gb 64Gb 64Gb 64Gb 128Gb 128Gb 128Gb 128Gb 256Gb 64Gb 128Gb 64Gb

BLOCK SIZE
256KB 256KB 512KB 256KB 512KB (4KB Page) 512KB (4KB Page) 256KB 512KB (4KB Page) 512KB (4KB Page) 256KB 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 768KB (192 Block) 768KB (192 Block) 256KB (4KB Page)

STACK
Mono Mono Mono DDP Mono Mono QDP DDP Mono DSP QDP DDP ODP DSP ODP QDP ODP DDP QDP QDP

VCC/ORG
3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8

PACKAGE
TSOP TSOP TSOP TSOP TSOP / VLGA TSOP / ULGA TSOP TSOP VLGA TSOP DSP TSOP / VLGA VLGA LSOP TSOP DSP LLGA VLGA LLGA VLGA LLGA ULGA

AVAILABILITY
NOW NOW NOW NOW NOW Apr 09 NOW NOW NOW NOW NOW Now NOW NOW NOW Now Apr 09 Mar 09 Mar 09 Jun 09

REMARK

2CE

2CE 2CE 4CE 2CE Dual CH. 4CE 4CE 4CE 4CE, Dual CH. 4CE, Dual CH. Emulated NAND Emulated NAND 2CE

MLC

TLC

uSD
PRODUCT
H24U51TM2ARH H24U51TM3BRH H24U1GTM1MRQ H24U1GTM3ARH H24U2GUM1MRQ H24U2GUM3ARH H24U2GTM3BRH H24U4GVM3MRH H24U4GUM3ARH H24U8GVM3MRH H24YAGVM3MRH

DENSITY
512MB 1GB 2GB 4GB 8GB 16GB

TECH.

NAND COMPONENT
DENSITY

STACK

SPEC.
SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0

uSD CLASS
Class-2 Class-4 Class-2 Class-4 Class-2 Class-6 Class-6 (TBD) Class-6 Class-6 (TBD) Class-6 (TBD) Class-6 (TBD)

AVAILABILITY
Aug 09 TBD Jun 09 TBD Jun 09 TBD TBD TBD TBD TBD TBD

EOL
Aug 09 TBD Jun 09 TBD Jun 09 TBD TBD TBD TBD TBD TBD

57nm 48nm 57nm 48nm 57nm 48nm 41nm 48nm 41nm 41nm 41nm

4Gb 4Gb 8Gb 8Gb 8Gb 8Gb 16Gb 8Gb 16Gb 16Gb 16Gb

Mono Mono Mono Mono DDP DDP Mono QDP DDP QDP ODP

e-NAND
PRODUCT
H26M01002MAR H26M11002MAR H26M11002AAR H26M11001BAR H26M22002AAR H26M21002BAR H26M21001CAR H26M34002MAR H26M34002AAR H26M32002BAR H26M32001CAR H26M48002MAR H26M44002AAR H26M42001BAR H26M54001AJR H26M68001MJR

DENSITY
512MB 1GB 1GB 1GB 2GB 2GB 2GB 4GB 4GB 4GB 4GB 8GB 8GB 8GB 16GB 32GB

TECH.

NAND COMPONENT
DENSITY

STACK

SPEC.
MMC4.2 MMC4.2 MMC4.2 MMC4.3 MMC4.2 MMC4.2 MMC4.3 MMC4.2 MMC4.2 MMC4.2 MMC4.3 MMC4.2 MMC4.2 MMC4.3 MMC4.3 MMC4.3

AVAILABILITY
NOW NOW NOW Q2 NOW Q2 End of Q2 NOW NOW Q2 Q2 NOW Q2. End of Q2 End of Q2 End of Q2

57nm 60nm 57nm 48nm 57nm 48nm 41nm 60nm 57nm 48nm 41nm 57nm 48nm 41nm 41nm 41nm

4Gb 8Gb 8Gb 8Gb 8Gb 16Gb 16Gb 8Gb 8Gb 16Gb 16Gb 8Gb 16Gb 32Gb 32Gb 32Gb

Mono Mono Mono Mono DDP Mono Mono QDP QDP DDP DDP ODP QDP DDP QDP ODP

16 Hynix Semiconductor Inc.

The information in this product brochure is subject to change. Up to date information on our products and technologies may be obtained from our website. www.hynix.com

CIS
(CMOS Image Sensor)
General Description
Hynix entered the CMOS Image Sensor business in 2007, to continue with its long term growth strategy. Through close cooperation with industryleading business partners and with its expertise in the memory business, Hynix successfully introduced competitive and cost effective image sensors in the following year. Hynix aims to diversify its product portfolio by developing a wide range of higher resolution application-specific products to meet market demand.

Applications

CMOS Image Sensor

CMOS Image Sensor is a device that converts an optical image to an electrical signal using a CMOS manufacturing technology. CMOS technology allows the integration of the image sensor and digital signal processor on the same chip, resulting in faster, smaller, cost effective and lower power image sensing devices. CMOS Image Sensor market has high growth potential, with demand expected to rise by 10 percent annually through 2011. Its main applications are camera phones, digital still cameras, and video conferencing systems, but the market for CMOS Image Sensor is rapidly diversifying into various applications including surveillance systems, automotive cameras, and medical system.

Camera Attachment Ratio of Mobile Phones

Camera Phone Resolution Trend (Main Camera)

Hynix CMOS Image Sensor

Hynix is now offering CMOS Image Sensors for various consumer applications, delivering outstanding performance and providing innovative and cost-effective solutions. Hynix is continuously enhancing its technological excellence accelerating technology development to provide quality products and meet customers needs.

Hynix CMOS Image Sensor Pixel Technology Migration

Experience Clear and Vivid Images with Hynix CMOS Image Sensors

Hynix Semiconductor Inc. 17

CIS(CMOS Image Sensor) Product Line-up

CMOS Image Sensor Product Lineup and Key Features
VGA (YACBAA0S)
Pixel Size Array Format (Active) Optical Format Imaging Area Color Filter Array Scan Mode Frame Rate Shutter Automatic Function 2.25um 2.25um 640H 480V 1/10-inch 1.44mm 1.08mm RGB Bayer color filters Progressive 30-fps @ 24MHz Electronic rolling Shutter (ERS) Exposure, white balance, black level calibration, anti-flicker, color saturation, defect correction, aperture correction Programmable (including VGA, QVGA, CIF, QCIF) Xenon and LED Sensitivity SNR Dynamic Range ADC Data Rate Programmable 0.750V / LuxSec 35dB 60dB on-chip, 10-bit 12 megapixels per second (master clock, 24MHz) Exposure, white balance, blanking, vertical blanking, color, sharpness, gamma correction, lens shading correction, X-Y image flip, zoom, windowing Digital I/O: 1.7V ~ 3.0V Digital Core: 1.7V ~ 1.9V Analog & Pixel: 2.6V ~ 3.0V 100mW (Typical) -20 to 70

Supply Voltage

Window size Flash Support

Power Consumption Operating Temp. Range

2M (YACD5B1S)
Pixel Size Optical Format Array Format (Active) Imaging Area Color Filter Array Scan Mode Frame Rate Shutter Automatic Function 1.75um 1.75um 1/5-inch 1600H 1200V 2.80mm 2.10mm RGB Bayer color filters Progressive Max 15-fps @ full resolution Electronic rolling Shutter (ERS) Exposure, white balance, black level calibration, anti-flicker, color saturation, defect correction, aperture correction Programmable (including UXGA, SVGA, QSVGA) Xenon and LED Sensitivity SNR ADC Data Rate Programmable TBD 32dB (est.) on-chip, 10-bit 36 megapixels per second (Internal PLL clock = 72MHz) Exposure, white balance, blanking, vertical blanking, color, sharpness, gamma correction, lens shading correction, X-Y image flip, zoom, windowing Digital I/O: 1.7V ~ 3.0V Digital Core: 1.7V ~ 1.9V Analog & Pixel: 2.6V ~ 3.0V TBD -20 to 70

Supply Voltage

Window size Flash Support

Power Consumption Operating Temp. Range

3M (YACE4A1S)
Pixel Size Optical Format Array Format (Active) Imaging Area Color Filter Array Scan Mode Flash Support Automatic Function 1.75um 1.75um 1/4-inch 2048H 1356V TBD RGB Bayer color filters Progressive Xenon and LED Exposure, white balance, black level calibration, anti-flicker, color saturation, defect correction, aperture correction, Anti-Shaking, Auto Focus Control Programmable 1/2, 1/4 0.475V / lux-sec @ 550nm (est.) SNR ADC Programmable 32dB (est.) On-chip, 10-bit Exposure, white balance, blanking, vertical blanking, color, sharpness, gamma correction, lens shading correction, X-Y image flip, zoom, windowing 15-fps @ QXGA / 30-fps @ XGA Electronic rolling Shutter (ERS) Digital I/O: 1.7V ~ 3.0V Digital Core: 1.7V ~ 1.9V Analog & Pixel: 2.6V ~ 3.0V 80mW (Active) 7 A (Standby) -20 to 60

Frame Rate Shutter Supply Voltage

Window size Sub-Sampling Sensitivity

Power Consumption Operating Temp. Range

5M (YACF3A1C)
Pixel Size Optical Format Array Format (Active) Imaging Area Color Filter Array Flash Support Scan Mode Frame Rate Sub Sampling Operating Temp. Range Data Interface Format Sensitivity SNR 1.75um 1.75um 1/3.2 inch 2624H 1984V 4.59mm 3.47mm RGB Bayer color filters Xenon and LED Progressive 15-fps @ QSXGA (Full Resolution) -10 to 70 Bayer (10-bit), MIPI TBD TBD ADC Dynamic Range Feature On-chip, 10-bit TBD DPC, Programmable BLC, LCS, Analog / Digital Gain Control, X-Y Flip, Windowing, Sub-sampling, Scaling, Slew Rate control, Exposure Control, Xenon / LED Support Electronic rolling Shutter (ERS) With Global Reset Release Digital I/O: 1.6V ~ 3.1V Digital Core: 1.8V 10% Analog & Pixel: 2.6V ~ 3.1V <350mW Yes

Shutter Supply Voltage

Power Consumption Serial Interface

18 Hynix Semiconductor Inc.

Global Sales Network

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