SA604A

SA604A
High-performance low-power FM IF system

Rev. 4.3 — 13 July 2016 Product data sheet
1. General description
The SA604A is an improved monolithic low-power FM IF system incorporating two limiting
intermediate frequency amplifiers, quadrature detector, muting, logarithmic received
signal strength indicator, and voltage regulator. The SA604A features higher IF bandwidth
(25 MHz) and temperature compensated RSSI and limiters providing wide RSSI dynamic
range, high IF/limiter gain and overall stability. The SA604A is available in an SO16
(surface-mounted miniature) and HXQFN16 package.
2. Features and benefits

 Low power consumption: 3.3 mA typical
 Temperature compensated logarithmic Received Signal Strength Indicator (RSSI) with
a dynamic range in excess of 90 dB
 Two audio outputs — muted and un-muted
 Low external component count; suitable for crystal/ceramic filters
 Excellent sensitivity: 1.5 V across input pins (0.22 V into 50  matching network) for
12 dB SINAD (Signal-to-Noise and Distortion ratio) at 455 kHz
 SA604A meets cellular radio specifications
3. Applications
 Cellular radio FM IF
 High-performance communications receivers
 Intermediate frequency amplification and detection up to 25 MHz
 RF level meter
 Spectrum analyzer
 Instrumentation
 FSK and ASK data receivers
NXP Semiconductors SA604A
4. Ordering information
Table 1. Ordering information
Type number Topside Package
marking Name Description Version
SA604AD/01 SA604AD SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
SA604AD/02 SA604AD SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
SA604AHR 04A HXQFN16 plastic thermal enhanced extremely thin quad flat package; SOT1039-2
no leads; 16 terminals; body 3  3  0.5 mm
4.1 Ordering options

Table 2. Ordering options
Type number Orderable Package Packing method Minimum Temperature
part number order
quantity
SA604AD/01 SA604AD/01,112 SO16 Standard marking 1000 Tamb = 40 C to +85 C
* IC’s tube - DSC bulk pack
SA604AD/01,118 SO16 Reel 13” Q1/T1 2500 Tamb = 40 C to +85 C
*Standard mark SMD
SA604AD/02 SA604AD/02J SO16 Reel 13” Q1/T1 2500 Tamb = 40 C to +85 C
*Standard mark SMD
SA604AHR SA604AHRZ HXQFN16 Reel 7” Q2/T3 1500 Tamb = 40 C to +85 C
*Standard mark SMD
SA604A All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 4.3 — 13 July 2016 2 of 31

5. Block diagram
LIMITER_DECOUPL
LIMITER_DECOUPL
IF_AMP_DECOUPL
LIMITER_OUTPUT
IF_AMP_OUTPUT
LIMITER_INPUT
IF_AMP_INPUT
GND
16(13) 15(12) 14(11) 13(10) 12(9) 11(8) 10(7) 9(6)
IF amp limiter
SIGNAL
STRENGTH quadrature
INDICATOR detector
VOLTAGE
REGULATOR mute
1(14) 2(15) 3(16) 4(1) 5(2) 6(3) 7(4) 8(5)

IF_AMP_DECOUPL
MUTE_INPUT
RSSI_OUTPUT
MUTE_AUD_OUTP
UNMUTE_AUD_OUTP
QUADRATURE_INPUT
GND
VCC
aaa-012738
Pin numbers for SO16; HXQFN16 pins shown in parentheses

Fig 1. Block diagram of SA604A

6. Pinning information
6.1 Pinning
IF_AMP_DECOUPL 1 16 IF_AMP_INPUT
GND 2 15 IF_AMP_DECOUPL
MUTE_INPUT 3 14 IF_AMP_OUTPUT
VCC 4 13 GND
SA604AD/0x
RSSI_OUTPUT 5 12 LIMITER_INPUT
MUTE_AUD_OUTP 6 11 LIMITER_DECOUPL
UNMUTE_AUD_OUTP 7 10 LIMITER_DECOUPL
QUADRATURE_INPUT 8 9 LIMITER_OUTPUT
aaa-012737
Fig 2. Pin configuration for SO16 14 IF_AMP_DECOUPL
13 IF_AMP_INPUT
16 MUTE_INPUT
15 GND
terminal 1
index area
VCC 1 12 IF_AMP_DECOUPL
RSSI_OUTP 2 11 IF_AMP_OUTPUT
SA604AHR
MUTE_AUD_OUTP 3 10 GND
(1)
UNMUTE_AUD_OUTP 4 9 LIMITER_INPUT
7
5
8
QUADRATURE_INPUT
LIMITER_OUTPUT
LIMITER_DECOUPL
LIMITER_DECOUPL
aaa-016798
Transparent top view
(1) Die Attach Paddle (DAP).

Fig 3. Pin configuration for HXQFN16

6.2 Pin description

Table 3. Pin description
Symbol Pin Description
SO16 HXQFN16
IF_AMP_DECOUPL 1 14 IF amplifier decoupling
GND 2 15 ground
MUTE_INPUT 3 16 mute input
VCC 4 1 supply voltage
RSSI_OUTPUT 5 2 RSSI output
MUTE_AUD_OUTP 6 3 mute audio output
UNMUTE_AUD_OUTP 7 4 unmute audio output
QUADRATURE_INPUT 8 5 quadrature input
LIMITER_OUTPUT 9 6 limiter output
LIMITER_DECOUPL 10 7 limiter decoupling
LIMITER_DECOUPL 11 8 limiter decoupling
LIMITER_INPUT 12 9 limiter input
GND 13 10[1] ground
IF_AMP_OUTPUT 14 11 IF amplifier output
IF_AMP_DECOUPL 15 12 IF amplifier decoupling
IF_AMP_INPUT 16 13 IF amplifier input
- - DAP exposed Die Attach Paddle
[1] HXQFN16 package supply ground is connected to both GND pin and exposed center pad. GND pin must
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad must be soldered to the board using a corresponding thermal pad on
the board. For proper heat conduction through the board, thermal vias must be incorporated in the PCB in
the thermal pad region.

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Product data sheet
SA604A
7. Functional description
NXP Semiconductors
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All information provided in this document is subject to legal disclaimers.

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Rev. 4.3 — 13 July 2016
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© NXP Semiconductors N.V. 2016. All rights reserved.

SA604A
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6 of 31
Fig 4. Equivalent circuit

8. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage - 9 V
Tstg storage temperature 65 +150 C
Tamb ambient temperature operating 40 +85 C
9. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Zth(j-a) transient thermal impedance SO16 package 90 K/W
from junction to ambient HXQFN16 package 75 K/W
10. Static characteristics

Table 6. Static characteristics
VCC = 6 V; Tamb = 25 C; unless specified otherwise.
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage 4.5 - 8.0 V
ICC supply current 2.5 3.3 4.0 mA
Vth threshold voltage mute switch-on 1.7 - - V
mute switch-off - - 1.0 V

11. Dynamic characteristics

Table 7. Dynamic characteristics
Typical reading at Tamb = 25 C; VCC = 6 V, unless specified otherwise. IF frequency = 455 kHz; IF level = 47 dBm;
FM modulation = 1 kHz with 8 kHz peak deviation. Audio output with C-message weighted filter and de-emphasis capacitor.
Test circuit Figure 14. The parameters listed below are tested using automatic test equipment to assure consistent electrical
characteristics. The limits do not represent the ultimate performance limits of the device. Use of an optimized RF layout will
improve many of the listed parameters.
Symbol Parameter Conditions Min Typ Max Unit
input limiting 3 dB test at pin IF_AMP_INPUT; per 50  - 92 - dBm
AM AM rejection 80 % AM 1 kHz 30 34 - dB
recovered audio level 15 nF de-emphasis; RMS value 80 175 260 mV
150 pF de-emphasis; RMS value - 530 - mV
THD total harmonic distortion 34 42 - dB
S/N signal-to-noise ratio no modulation for noise - 73 - dB
Vo(RSSI) RSSI output voltage IF level = 118 dBm [1] 0 160 650 mV
IF level = 68 dBm (SA604AD/01, [1] 1.9 2.65 3.1 V
SA604AHR)
IF level = 68 dBm (SA604AD/02) [1] 2.1 2.65 3.1 V
IF level = 18 dBm [1] 4.0 4.85 5.6 V
RSSI(range) RSSI range R4 = 100 k (pin RSSI_OUTPUT) - 90 - dB
RSSI accuracy R4 = 100 k (pin RSSI_OUTPUT) - 1.5 - dB
Zi(IF) IF input impedance 1.4 1.6 - k
Zo(IF) IF output impedance 0.85 1.0 - k
Zi(lim) limiter input impedance 1.4 1.6 - k
Ro output resistance unmuted audio - 58 - k
muted audio - 58 - k
[1] IF level is referenced to level at IF pin which is at 1.5 k input impedance.

12. Performance curves
DDD

 
Normalized IF frequency: ------ = 1 + --------
1 1
(1) Q = 10
(2) Q = 20
(3) Q = 40
(4) Q = 60
(5) Q = 80
(6) Q = 100
Fig 5. Phase as a function of normalized IF frequency

13. Application information
0.5 μH 455 kHz

to ceramic filter
1.3 μH SA604A
1 nF 22 pF
test circuit
44.545 0.1 μF 0.1 μF

3rd overture 455 kHz
5.5 μH 5.6 XTAL Q = 20
455 kHz
pF ceramic filter 0.1 10
+6 V
μF pF
6.8 μF 100 nF 10 nF
16
15
14
13
12
10
11
9
8
0.1 μF
SA602A 0.1 μF SA604A
8
1
47 pF 0.21 μH 0.1
RF input to μF +6 V DATA
0.28 μH OUT
45 MHz 220 pF
100
kΩ
100 nF C-MSG
FILTER
MUTE
RSSI AUDIO
OUT
aaa-012739
Fig 6. Typical application cellular radio (45 MHz RF input and 455 kHz IF)

SA604A IF INPUT (μV) (1500 Ω)
10 100 1k 10 k 100 k
AUDIO
0
RSSI
THD + NOISE
(V)
AM (80 % MOD)
4
NOISE
RSSI (VOLTS)
(dB)
−20
3
THD + NOISE
−40
AM (80 % MOD)
−60
−80 NOISE
−120 −100 −80 −60 −40 −20

SA602A RF INPUT (dBm) (50 Ω) aaa-012849
Audio output: C message weighted; 0 dB reference = recovered audio for 8 kHz peak deviation (dB)
Fig 7. Performance of the typical cellular radio application
13.1 Circuit description

The SA604A is a very high gain, high frequency device. Correct operation is not possible
if good RF layout and gain stage practices are not used. The SA604A cannot be
evaluated independent of circuit, components, and board layout. A physical layout which
correlates to the electrical limits is shown in Figure 17. This configuration can be used as
the basis for production layout.
The SA604A is an IF signal processing system suitable for IF frequencies as high as

21.4 MHz. The device consists of two limiting amplifiers, quadrature detector, direct audio
output, muted audio output, and signal strength indicator (with log output characteristic).
The equivalent circuit is shown in Figure 4.
Figure 7 is the performance of the typical cellular radio application shown in Figure 6 with
45 MHz RF input and 455 kHz IF.

13.2 IF amplifiers
The IF amplifier section consists of two log-limiting stages. The first consists of two
differential amplifiers with 39 dB of gain and a small signal bandwidth of 41 MHz (when
driven from a 50  source). The output of the first limiter is a low-impedance emitter
follower with 1 k of equivalent series resistance. The second limiting stage consists of
three differential amplifiers with a gain of 62 dB and a small signal AC bandwidth of
28 MHz. The outputs of the final differential stage are buffered to the internal quadrature
detector. One of the outputs is available at pin LIMITER_OUTPUT to drive an external
quadrature capacitor and L/C quadrature tank.
Both of the limiting amplifier stages are DC biased using feedback. The buffered output of
the final differential amplifier is fed back to the input through 42 kresistors. As shown in
Figure 4, the input impedance is established for each stage by tapping one of the
feedback resistors 1.6 k from the input. It requires one additional decoupling capacitor
from the tap point to ground.
Because of the very high gain, bandwidth and input impedance of the limiters, there is a
very real potential for instability at IF frequencies above 455 kHz. The basic phenomenon
is shown in Figure 10. Distributed feedback (capacitance, inductance and radiated fields)
forms a divider from the output of the limiters back to the inputs (including RF input). If this
feedback divider does not cause attenuation greater than the gain of the forward path,
then oscillation or low-level regeneration is likely. If regeneration occurs, two symptoms
may be present:
1. The RSSI output is high with no signal input (should nominally be 250 mV or lower).
2. The demodulated output demonstrates a threshold. Above a certain input level, the
limited signal begins to dominate the regeneration, and the demodulator begins to
operate in a normal manner.
There are three primary ways to deal with regeneration:
1. Minimize the feedback by gain stage isolation.

2. Lower the stage input impedances, thus increasing the feedback attenuation factor.
3. Reduce the gain. Gain reduction can effectively be accomplished by adding
attenuation between stages, which can also lower the input impedance. Examples of
impedance/gain adjustment are shown in Figure 11. Reduced gain results in reduced
limiting sensitivity.
A feature of the SA604A IF amplifiers, which is not specified, is low phase shift. The
SA604A is fabricated with a 10 GHz process with very small collector capacitance. It is
advantageous in some applications that the phase shift changes only a few degrees over
a wide range of signal input amplitudes.

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DDD DDD
Fig 8. First limiter bias Fig 9. Second limiter and quadrature detector
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DDD
Fig 10. Feedback paths
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ORZLPSHGDQFH
DDD
a. Terminating HIGH impedance filters with transformation to LOW impedance
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b. LOW impedance termination and gain reduction

Fig 11. Practical termination

13.3 Stability considerations

The high gain and bandwidth of the SA604A in combination with its very low currents
permit circuit implementation with superior performance. However, stability must be
maintained and, to do that, every possible feedback mechanism must be addressed.
These mechanisms are:
• supply lines and ground

• stray layout inductances and capacitances
• radiated fields
• phase shift
As the system IF increases, so must the attention to fields and strays. However, ground
and supply loops cannot be overlooked, especially at lower frequencies. Even at 455 kHz,
if the supply line is not decoupled, using the test layout in Figure 17, instability occurs. To
decouple, use two high-quality RF capacitors, a 0.1 F monolithic on the VCC pin, and a
6.8 F tantalum on the supply line. An electrolytic is not an adequate substitute. At
10.7 MHz, a 1 F tantalum has proven acceptable with this layout. Every layout must be
evaluated on its own merit, but do not underestimate the importance of good supply
bypass.
At 455 kHz, if the layout of Figure 17 or one substantially similar is used, ceramic filters
can be connected directly to the input and between limiter stages with no special
consideration. At frequencies above 2 MHz, some input impedance reduction is usually
necessary. Figure 11 demonstrates a practical means.
As illustrated in Figure 12, 430  external resistors are applied in parallel to the internal
1.6 k load resistors, thus presenting approximately 330  to the filters. The input filter is
a crystal type for narrowband selectivity. The filter is terminated with a tank which
transforms to 330 . The interstage filter is a ceramic type which does not contribute to
system selectivity, but does suppress wideband noise and stray signal pickup. In
wideband 10.7 MHz IFs the input filter can also be ceramic, directly connected to pin
IF_AMP_INPUT.
430 Ω
16 15 14 13 12 11 10 9
430 Ω SA604A
1 2 3 4 5 6 7 8
aaa-012850
Fig 12. Crystal input filter with ceramic interstage filter

In some products, it may be impractical to utilize shielding, but this mechanism may be
appropriate to 10.7 MHz and 21.4 MHz IF. One of the benefits of low current is lower
radiated field strength, but lower does not mean non-existent. A spectrum analyzer with
an active probe clearly shows IF energy with the probe held in the proximity of the second
limiter output or quadrature coil. No specific recommendations are provided, but
mechanical shielding should be considered if layout, bypass, and input impedance
reduction do not solve a stubborn instability.
The final stability consideration is phase shift. The phase shift of the limiters is very low,
but there is phase shift contribution from the quadrature tank and the filters. Most filters
demonstrate a large phase shift across their passband (especially at the edges). If the
quadrature detector is tuned to the edge of the filter passband, the combined filter and
quadrature phase shift can aggravate stability. It is not usually a problem, but should be
kept in mind.
13.4 Quadrature detector

Figure 9 shows an equivalent circuit of the SA604A quadrature detector. It is a multiplier
cell similar to a mixer stage. Instead of mixing two different frequencies, it mixes two
signals of common frequency but different phase. Internal to the device, a constant
amplitude (limited) signal is differentially applied to the lower port of the multiplier. The
same signal is applied single-ended to an external capacitor at pin LIMITER_OUTPUT.
There is a 90 phase shift across the plates of this capacitor. The phase shifted signal
applied to the upper port of the multiplier is at pin QUADRATURE_INPUT. A quadrature tank
(parallel L/C network) permits frequency selective phase shifting at the IF frequency. This
quadrature tank must be returned to ground through a DC blocking capacitor.
The loaded Q of the quadrature tank impacts three fundamental aspects of the detector:
distortion, maximum modulated peak deviation, and audio output amplitude. Typical
quadrature curves are illustrated in Figure 5. The phase angle translates to a shift in the
multiplier output voltage.
Thus a small deviation gives a large output with a high Q tank. However, as the deviation
from resonance increases, the non-linearity of the curve increases (distortion). With too
much deviation, the signal is outside the quadrature region (limiting the peak deviation
which can be demodulated). If the same peak deviation is applied to a lower Q tank, the
deviation remains in a region of the curve which is more linear (less distortion). However,
it creates a smaller phase angle (smaller output amplitude). Thus the Q of the quadrature
tank must be tailored to the design. Basic equations and an example for determining Q
are shown in Section 13.5. This explanation includes first-order effects only.

13.5 Frequency discriminator design equations
9RXW
DDD
Fig 13. Frequency discriminator
CS 1
V O = -------------------  ----------------------------------------2  V IN (1)
CP + CS  1   1
1 + ---------- + ------
Q1 S  S 
1
where:  1 = -------------------------------- and Q 1 = R  C P + C S  1
L  CP + CS 
From Equation 1, the phase shift between nodes 1 and 2, or the phase across CS will be:
1
-----------
–1 Q1 
 = <V O – <V IN =  t g   ----------------------2- (2)
1
1 –  ------
 
1
Figure 5 is the plot of  as a function of  ------ . It is notable that at  =  1 , the phase shift
 
  2Q 1
is --- and the response is close to a straight line with a slope of -------- = ---------- .
2  1
 2Q 1
The signal VO would have a phase shift of --- – ----------  with respect to the VIN.
2 1
If VIN = A sin(t) =>
 2Q 1
V O = A sin t + --- – ----------   (3)
2 1
Multiplying the two signals in the mixer, and low pass filtering yields:
2  2Q 1
V IN  V O = A sin  t  sin t + --- – ----------   (4)
2 1
After low pass filtering =>
1 2  2Q 1 1 2 2Q 1
V O = --- A cos --- – ----------   = --- A sin ----------   (5)
2 2 1 2 1

  1 + 
V O  2Q 1 ------ = 2Q 1  --------------------- (6)
1  1 
 
For 2Q 1 ------ << --- which is discriminated FM output. Note that  is the deviation
1 2
frequency from the carrier  1 1. Example: at 455 kHz IF, with 5 kHz FM deviation, the
maximum normalized frequency is (455  5)/455 kHz = 1.010 or 0.990.
Go to the frequency as a function of normalized frequency curves (Figure 5) and draw a


vertical straight line at ------ = 1.01.
1
The curves with Q = 100, Q = 40 are not linear, but Q = 20 and less shows better linearity
for this application. Too small Q decreases the amplitude of the discriminated FM signal.
Equation 6 => Choose a Q = 20.
The internal resistance of the SA604A is 40 k From Q 1 = R  C P + C S  1 , and then

1
 1 = -------------------------------- , it results that CP + CS = 174 pF and L = 0.7 mH.
L  CP + CS 
A more exact analysis including the source resistance of the previous stage shows a
series and a parallel resonance in the phase detector tank. To make the parallel and
series resonances close, and to get maximum attenuation of higher harmonics at
455 kHz IF, a CS = 10 pF and CP = 164 pF provided the best results. For commercial
purposes, values of 150 pF or 180 pF may be practical. A variable inductor which can be
adjusted around 0.7 mH should be chosen and optimized for minimum distortion. (For
10.7 MHz, a value of CS = 1 pF is recommended.)
13.6 Audio outputs

Two audio outputs are provided. Both are PNP current-to-voltage converters with 55 k
nominal internal loads. The unmuted output is always active to permit the use of signaling
tones in systems such as cellular radio. The other output can be muted with 70 dB typical
attenuation. The two outputs have an internal 180 phase difference.
The nominal frequency response of the audio outputs is 300 kHz. This response can be
increased with the addition of external resistors between the output pins and ground. The
resistors are placed in parallel with the internal 55 k resistors and they lower the output
time constant. The output structure is a current-to-voltage converter where current is
driven into the resistance, creating a voltage drop. By adding external parallel resistance,
it also lowers the output audio amplitude and DC level.
This technique of audio bandwidth expansion can be effective in many applications such
as SCA receivers and data transceivers. Because the two outputs have a 180 phase
relationship, FSK demodulation can be accomplished by applying the two outputs
differentially across the inputs of an op amp or comparator. Once the threshold of the
reference frequency (or no-signal condition) has been established, the two outputs shift in
opposite directions (higher or lower output voltage) as the input frequency shifts. The
1. Ref. Krauss, Raab, Bastian: Solid-State radio Eng.; Wiley, 1980, p.311.

output of the comparator is logic output. The choice of op amp or comparator depends on
the data rate. With high IF frequency (10 MHz and above), and wide IF bandwidth (L/C
filters) data rates in excess of 4 MBd are possible.
13.7 RSSI
The Received Signal Strength Indicator (RSSI), of the SA604A demonstrates monotonic
logarithmic output over a range of 90 dB. The signal strength output is derived from the
summed stage currents in the limiting amplifiers. It is independent of the IF frequency.
Thus, unfiltered signals at the limiter inputs, spurious products, or regenerated signals
manifest themselves as RSSI outputs. An RSSI output of greater than 250 mV with no
signal (or a very small signal) applied, is an indication of possible regeneration or
oscillation.
To achieve optimum RSSI linearity, there must be a 12 dB insertion loss between the first
and second limiting amplifiers. With a typical 455 kHz ceramic filter, there is a nominal
4 dB insertion loss in the filter. An additional 6 dB is lost in the interface between the filter
and the input of the second limiter. A small amount of additional loss must be introduced
with a typical ceramic filter. In the test circuit used for cellular radio applications (Figure 6),
the optimum linearity was achieved with a 5.1 k resistor. The resistor was placed
between the output of the first limiter (pin IF_AMP_OUTPUT) and the input of the
interstage filter. With this resistor from pin IF_AMP_OUTPUT to the filter, sensitivity of
0.25 V for 12 dB SINAD was achieved. With the 3.6 k resistor, sensitivity was
optimized at 0.22 V for 12 dB SINAD with minor change in the RSSI linearity.
Any application requiring optimized RSSI linearity, such as spectrum analyzers, cellular
radio, and certain types of telemetry, requires careful attention to limiter interstage
component selection. This is especially true with high IF frequencies which require
insertion loss or impedance reduction for stability.
At low frequencies, the RSSI makes an excellent logarithmic AC voltmeter.
For data applications, the RSSI is effective as an Amplitude Shift Keyed (ASK) data slicer.
If a comparator is applied to the RSSI and the threshold set slightly above the no signal
level, when an in-band signal is received the comparator is sliced. Unlike FSK
demodulation, the maximum data rate is limited. An internal capacitor limits the RSSI
frequency response to approximately 100 kHz. At high data rates, the rise and fall times
are not symmetrical.
The RSSI output is a current-to-voltage converter similar to the audio outputs. However,
an external resistor is required. With a 91 k resistor, the output characteristic is 0.5 V for
a 10 dB change in the input amplitude.
13.8 Additional circuitry

Internal to the SA604A are voltage and current regulators which have been temperature
compensated to maintain the performance of the device over a wide temperature range.
These regulators are not accessible to the user.

14. Test information
F1
C4
Q = 20 loaded
C1 R2 C5
input C2 C6
R3
F2
R1
16
15
14
13
12
10
11
9
C7
C3 SA604A
1
8
C8
S1
R4 C9 C10
C12
C11
VCC AUDIO DATA
output output
MUTE RSSI
input output aaa-012851
Fig 14. SA604A test circuit
Table 8. SA604AD/01 demo board component list

Component Value Description
C1 100 nF, +80 %, 20 %,63 V K10000-25V ceramic
C2 100 nF, +10 %, 50 V -
C3 100 nF, 10 %, 50 V -
C4 100 nF, +10 %, 50 V -
C5 100 nF, 10 %, 50 V -
C6 10 pF, 2 %, 100 V NPO ceramic
C7 100 nF, 10 %, 50 V -
C8 100 nF, 10 %, 50 V -
C9 15 nF, 10 %, 50 V -
C10 150 pF 2 %, 100 V N1500 ceramic
C11 1 nF, 10 %, 100 V K2000-Y5P ceramic
C12 6.8 F 20 %, 25 V tantalum
F1 455 kHz ceramic filter Murata SFG455A3
F2 455 kHz, Ce = 180 pF Toko RMC 2A6597H
R1 51 , 1 %, 1/4 W metal film
R2 1500 , 1 %, 1/4 W metal film
R3 1500 , 5 %, 1/8 W carbon composition
R4 100 k, 1 %, 1/4 W metal film

SIGNETICS SIGNETICS
IF
IF
SA604A TEST CKT SA604A TEST CKT
OFF
OFF
ON
ON
INPUT
INPUT
GND
GND
MUTE MUTE
VCC
VCC
RSSI
RSSI
GND
GND
AUDIO
AUDIO
GND
GND
DATA
DATA
aaa-012852 aaa-012853
Fig 15. Components layout Fig 16. Bottom layout

(viewed from the top) (viewed from the top)
aaa-012854
Fig 17. Print layout (viewed from the top)

15. Package outline
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$
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PD[

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287/,1( 5()(5(1&(6 (8523($1

,668('$7(
9(56,21 ,(& -('(& -(,7$ 352-(&7,21

627 ( 06

Fig 18. Package outline SOT109-1 (SO16)


HXQFN16: plastic thermal enhanced extremely thin quad flat package; no leads;
16 terminals; body 3 x 3 x 0.5 mm SOT1039-2
D B A
terminal 1
index area
E A
A1
c
detail X
e1
1/2 e
C
e v C A B
b
w C y1 C y
5 8
L
4 9
e
Eh e2
1/2 e
1 12
X
terminal 1 16 13
index area Dh
0 1 2 mm
Dimensions scale
Unit A A1 b c D Dh E Eh e e1 e2 L v w y y1
max 0.5 0.05 0.35 3.1 1.95 3.1 1.95 0.40

mm nom 0.30 0.127 3.0 1.85 3.0 1.85 0.5 1.5 1.5 0.35 0.1 0.05 0.05 0.1
min 0.00 0.25 2.9 1.75 2.9 1.75 0.30
sot1039-2_po
Outline References European

Issue date
version IEC JEDEC JEITA projection
10-07-29
SOT1039-2 --- ---
11-03-30
Fig 19. Package outline SOT1039-2 (HXQFN16)

16. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
16.3 Wave soldering

Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities

16.4 Reflow soldering

Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 20) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Table 9. SnPb eutectic process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350  350
< 2.5 235 220
 2.5 220 220
Table 10. Lead-free process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 20.

maximum peak temperature

temperature = MSL limit, damage level
minimum peak temperature

= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level

Fig 20. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

17. Soldering: PCB footprints
)RRWSULQWLQIRUPDWLRQIRUUHIORZVROGHULQJRI62SDFNDJH 627
+[
*[
3

+\ *\ %\ $\
&
'î 3 '
*HQHULFIRRWSULQWSDWWHUQ
5HIHUWRWKHSDFNDJHRXWOLQHGUDZLQJIRUDFWXDOOD\RXW
VROGHUODQG
RFFXSLHGDUHD
',0(16,216LQPP
3 3 $\ %\ & ' ' *[ *\ +[ +\

Fig 21. PCB footprint for SOT109-1 (SO16); reflow soldering

Footprint information for reflow soldering of HXQFN16 package SOT1039-2
4.250
3.300 pa + oa
2.000
1.500
0.500 0.500
0.240 0.0125
0.0125
0.500 0.240 0.350
3.300
4.250 2.000 1.500
pa + oa 0.800 1.800 2.300 4.000
0.500
0.800 0.350
1.500
1.800
2.300
4.000
placement area solder land plus solder paste
solder land solder resist, 0.0625 around copper
solder paste deposit, -0.02 around copper,

clearance, 0.125 around occupied area
stencil thickness 0.1
occupied area
13-03-25
13-04-22 Dimensions in mm sot1039-2_fr
Fig 22. PCB footprint for SOT1039-2 (HXQFN16); reflow soldering

18. Abbreviations
Table 11. Abbreviations
Acronym Description
AM Amplitude Modulation
ASK Amplitude Shift Keying
BPF Band-Pass Filter
FM Frequency Modulation
FSK Frequency Shift Keying
IF Intermediate Frequency
PCB Printed-Circuit Board
RF Radio Frequency
RSSI Received Signal Strength Indicator
SCA Subsidiary Communications Authorization
SINAD Signal-to-Noise-And-Distortion ratio
19. Revision history

Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
SA604A v.4.3 20160713 Product data sheet - SA604A v.4.2
Modifications: • Table 2 “Ordering options”: Changed orderable part number from SA604AD/02,118 to
SA604AD/02J.
• Table 7 “Dynamic characteristics”, Vo(RSSI): removed SA604AD/01 from 118 dBm and 18 dBm;
added SA604AHR to IF level = 68 dBm for 1.9 V min.
SA604A v.4.2 20160513 Product data sheet - SA604A v.4.1
Modifications: • Added SA604AD/02
• Table 7 “Dynamic characteristics”, Vo(RSSI): added row for SA604AD/02; changed “RF” to “IF”;
updated Table note 1.
• Deleted Table 8 “SA604 versus SA604A RSSI output voltage”.
SA604A v.4.1 20150330 Product data sheet - SA604A v.4
Modifications: • Table 2, SA604AHR: Changed orderable part number from “SA604AHRX” to “SA604AHRZ”;
corrected packing method from “Q1/T1” to “Q2/T3”.
SA604A v.4 20150220 Product data sheet - SA604A v.3
SA604A v.3 20140418 Product data sheet - SA604A v.2
SA604A v.2 19971107 Product specification ECN 853-1431 18663 SA604A v.1
SA604A v.1 19941215 Product specification - -

20. Legal information
20.1 Data sheet status

Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
20.2 Definitions Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Draft — The document is a draft version only. The content is still under
malfunction of an NXP Semiconductors product can reasonably be expected
internal review and subject to formal approval, which may result in
to result in personal injury, death or severe property or environmental
modifications or additions. NXP Semiconductors does not give any
damage. NXP Semiconductors and its suppliers accept no liability for
representations or warranties as to the accuracy or completeness of
inclusion and/or use of NXP Semiconductors products in such equipment or
information included herein and shall have no liability for the consequences of
applications and therefore such inclusion and/or use is at the customer’s own
use of such information.
risk.
Short data sheet — A short data sheet is an extract from a full data sheet
Applications — Applications that are described herein for any of these
with the same product type number(s) and title. A short data sheet is intended
products are for illustrative purposes only. NXP Semiconductors makes no
for quick reference only and should not be relied upon to contain detailed and
representation or warranty that such applications will be suitable for the
full information. For detailed and full information see the relevant full data
specified use without further testing or modification.
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the Customers are responsible for the design and operation of their applications
full data sheet shall prevail. and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
Product specification — The information and data provided in a Product design. It is customer’s sole responsibility to determine whether the NXP
data sheet shall define the specification of the product as agreed between Semiconductors product is suitable and fit for the customer’s applications and
NXP Semiconductors and its customer, unless NXP Semiconductors and products planned, as well as for the planned application and use of
customer have explicitly agreed otherwise in writing. In no event however, customer’s third party customer(s). Customers should provide appropriate
shall an agreement be valid in which the NXP Semiconductors product is design and operating safeguards to minimize the risks associated with their
deemed to offer functions and qualities beyond those described in the applications and products.
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
20.3 Disclaimers customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Limited warranty and liability — Information in this document is believed to
Semiconductors products in order to avoid a default of the applications and
be accurate and reliable. However, NXP Semiconductors does not give any
the products or of the application or use by customer’s third party
representations or warranties, expressed or implied, as to the accuracy or
customer(s). NXP does not accept any liability in this respect.
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no Limiting values — Stress above one or more limiting values (as defined in
responsibility for the content in this document if provided by an information the Absolute Maximum Ratings System of IEC 60134) will cause permanent
source outside of NXP Semiconductors. damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
In no event shall NXP Semiconductors be liable for any indirect, incidental,
the Recommended operating conditions section (if present) or the
punitive, special or consequential damages (including - without limitation - lost
Characteristics sections of this document is not warranted. Constant or
profits, lost savings, business interruption, costs related to the removal or
repeated exposure to limiting values will permanently and irreversibly affect
replacement of any products or rework charges) whether or not such
the quality and reliability of the device.
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory. Terms and conditions of commercial sale — NXP Semiconductors
Notwithstanding any damages that customer might incur for any reason products are sold subject to the general terms and conditions of commercial
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards sale, as published at http://www.nxp.com/profile/terms, unless otherwise
customer for the products described herein shall be limited in accordance agreed in a valid written individual agreement. In case an individual
with the Terms and conditions of commercial sale of NXP Semiconductors. agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
Right to make changes — NXP Semiconductors reserves the right to make applying the customer’s general terms and conditions with regard to the
changes to information published in this document, including without purchase of NXP Semiconductors products by customer.
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior No offer to sell or license — Nothing in this document may be interpreted or
to the publication hereof. construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein NXP Semiconductors’ specifications such use shall be solely at customer’s
may be subject to export control regulations. Export might require a prior own risk, and (c) customer fully indemnifies NXP Semiconductors for any
authorization from competent authorities. liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
Non-automotive qualified products — Unless this data sheet expressly
standard warranty and NXP Semiconductors’ product specifications.
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested Translations — A non-English (translated) version of a document is for
in accordance with automotive testing or application requirements. NXP reference only. The English version shall prevail in case of any discrepancy
Semiconductors accepts no liability for inclusion and/or use of between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer 20.4 Trademarks
(a) shall use the product without NXP Semiconductors’ warranty of the
Notice: All referenced brands, product names, service names and trademarks
product for such automotive applications, use and specifications, and (b)
are the property of their respective owners.
whenever customer uses the product for automotive applications beyond
21. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com

22. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Functional description . . . . . . . . . . . . . . . . . . . 6
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
9 Thermal characteristics . . . . . . . . . . . . . . . . . . 7
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
12 Performance curves . . . . . . . . . . . . . . . . . . . . . 9
13 Application information. . . . . . . . . . . . . . . . . . 10
13.1 Circuit description . . . . . . . . . . . . . . . . . . . . . . 11
13.2 IF amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.3 Stability considerations . . . . . . . . . . . . . . . . . 14
13.4 Quadrature detector . . . . . . . . . . . . . . . . . . . . 15
13.5 Frequency discriminator design equations . . . 16
13.6 Audio outputs . . . . . . . . . . . . . . . . . . . . . . . . . 17
13.7 RSSI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
13.8 Additional circuitry . . . . . . . . . . . . . . . . . . . . . 18
14 Test information . . . . . . . . . . . . . . . . . . . . . . . . 19
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21
16 Soldering of SMD packages . . . . . . . . . . . . . . 23
16.1 Introduction to soldering . . . . . . . . . . . . . . . . . 23
16.2 Wave and reflow soldering . . . . . . . . . . . . . . . 23
16.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23
16.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24
17 Soldering: PCB footprints. . . . . . . . . . . . . . . . 26
18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 28
19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 28
20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 29
20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 29
20.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
20.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 30
21 Contact information. . . . . . . . . . . . . . . . . . . . . 30
22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 July 2016
Document identifier: SA604A

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SA604A

High-performance low-power FM IF system

2. Features and benefits

4.1 Ordering options

Product data sheet Rev. 4.3 — 13 July 2016 2 of 31

1(14) 2(15) 3(16) 4(1) 5(2) 6(3) 7(4) 8(5)

Pin numbers for SO16; HXQFN16 pins shown in parentheses

Product data sheet Rev. 4.3 — 13 July 2016 3 of 31

Fig 2. Pin configuration for SO16 14 IF_AMP_DECOUPL

Transparent top view

(1) Die Attach Paddle (DAP).

Product data sheet Rev. 4.3 — 13 July 2016 4 of 31

6.2 Pin description

Product data sheet Rev. 4.3 — 13 July 2016 5 of 31

High-performance low-power FM IF system

Fig 4. Equivalent circuit

10. Static characteristics

Product data sheet Rev. 4.3 — 13 July 2016 7 of 31

11. Dynamic characteristics

[1] IF level is referenced to level at IF pin which is at 1.5 k input impedance.

Product data sheet Rev. 4.3 — 13 July 2016 8 of 31

12. Performance curves

Product data sheet Rev. 4.3 — 13 July 2016 9 of 31

13. Application information

0.5 μH 455 kHz

44.545 0.1 μF 0.1 μF

Product data sheet Rev. 4.3 — 13 July 2016 10 of 31

SA604A IF INPUT (μV) (1500 Ω)

−120 −100 −80 −60 −40 −20

13.1 Circuit description

The SA604A is an IF signal processing system suitable for IF frequencies as high as

Product data sheet Rev. 4.3 — 13 July 2016 11 of 31

There are three primary ways to deal with regeneration:

1. Minimize the feedback by gain stage isolation.

Product data sheet Rev. 4.3 — 13 July 2016 12 of 31

Fig 10. Feedback paths

a. Terminating HIGH impedance filters with transformation to LOW impedance

b. LOW impedance termination and gain reduction

Product data sheet Rev. 4.3 — 13 July 2016 13 of 31

13.3 Stability considerations

• supply lines and ground

Fig 12. Crystal input filter with ceramic interstage filter

Product data sheet Rev. 4.3 — 13 July 2016 14 of 31

13.4 Quadrature detector

Product data sheet Rev. 4.3 — 13 July 2016 15 of 31

13.5 Frequency discriminator design equations

Fig 13. Frequency discriminator

After low pass filtering =>

Product data sheet Rev. 4.3 — 13 July 2016 16 of 31

Go to the frequency as a function of normalized frequency curves (Figure 5) and draw a

The internal resistance of the SA604A is 40 k From Q 1 = R  C P + C S  1 , and then

13.6 Audio outputs

Product data sheet Rev. 4.3 — 13 July 2016 17 of 31

At low frequencies, the RSSI makes an excellent logarithmic AC voltmeter.

13.8 Additional circuitry

Product data sheet Rev. 4.3 — 13 July 2016 18 of 31

14. Test information

Fig 14. SA604A test circuit

3 3 $\ %\ & ' ' [ \ +[ +\