74LVC139D
74LVC139D
74LVC139D
1. General description
The 74LVC139 is a dual 2-to-4 line decoder/demultiplexer. It has two independent
decoders, each accepting two binary weighted inputs (nA0 and nA1) and providing four
mutually exclusive outputs (nY0 to nY3) that are LOW when selected. Each decoder has
an active LOW input (nE). When nE is HIGH, every output is forced HIGH. The enable
input can be used as the data input for a 1-to-4 demultiplexer application.
3. Ordering information
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74LVC139D 40 C to +125 C SO16 plastic small outline package; 16 leads; SOT109-1
body width 3.9 mm
74LVC139DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; SOT338-1
body width 5.3 mm
74LVC139PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads; SOT403-1
body width 4.4 mm
74LVC139BQ 40 C to +125 C DHVQFN16 plastic dual in-line compatible thermal enhanced very SOT763-1
thin quad flat package; no leads; 16 terminals;
body 2.5 3.5 0.85 mm
4. Functional diagram
1E DX 0 4 X/Y 0 4
4 2 2
1Y0 0 5 1 5
2 5 0 1 1
1A0 1Y1 3 G 3
1 3 6 2 6
3 6 1 2 1 2
1A1 1Y2 7 EN 7
7 3 3
1Y3
12
2Y0 12 12
14 11 DX 0 X/Y 0
2A0 2Y1 14 14
0 0 1 11 1 11
13 10 13 G 13 1
2A1 2Y2 1 3 10 2 10
9 15 2 15 2
2Y3 9 EN 9
2E 3 3
a) demultiplexer
b) decoder
Fig 1. Logic symbol Fig 2. IEC logic symbol
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1Y0 4
2 1A0 1Y1 5
3 1A1 DECODER 1Y2 6
1Y3 7
1 1E
2Y0 12
14 2A0 2Y1 11
13 2A1 DECODER 2Y2 10
2Y3 9
15 2E
mna780
5. Pinning information
5.1 Pinning
16 VCC
1E 1 16 VCC terminal 1 1E
index area
1
1A0 2 15 2E
1A0 2 15 2E
1A1 3 14 2A0 3 14 2A0
1A1
1Y3 7 10 2Y2
GND
2Y3
6. Functional description
Table 3. Function table[1]
Input Output
nE nA0 nA1 nY0 nY1 nY2 nY3
H X X H H H H
L L L L H H H
L H L H L H H
L L H H H L H
L H H H H H L
7. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +6.5 V
IIK input clamping current VI < 0 50 - mA
VI input voltage [1] 0.5 +6.5 V
IOK output clamping current VO > VCC or VO < 0 V - 50 mA
VO output voltage [2] 0.5 VCC + 0.5 V
IO output current VO = 0 V to VCC - 50 mA
ICC supply current - 100 mA
IGND ground current 100 - mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation Tamb = 40 C to +125 C [3] - 500 mW
[1] The minimum input voltage ratings may be exceeded if the input current ratings are observed.
[2] The output voltage ratings may be exceeded if the output current ratings are observed.
[3] For SO16 packages: above 70 C derate linearly with 8 mW/K.
For SSOP16 and TSSOP16 packages: above 60 C derate linearly with 5.5 mW/K.
For DHVQFN16 packages: above 60 C derate linearly with 4.5 mW/K.
74LVC139 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
9. Static characteristics
Table 6. Static characteristics
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 40 C to +85 C 40 C to +125 C Unit
Min Typ[1] Max Min Max
VIH HIGH-level VCC = 1.2 V 1.08 - - 1.08 - V
input voltage VCC = 1.65 V to 1.95 V 0.65 VCC - - 0.65 VCC - V
VCC = 2.3 V to 2.7 V 1.7 - - 1.7 - V
VCC = 2.7 V to 3.6 V 2.0 - - 2.0 - V
VIL LOW-level VCC = 1.2 V - - 0.12 - 0.12 V
input voltage VCC = 1.65 V to 1.95 V - - 0.35 VCC - 0.35 VCC V
VCC = 2.3 V to 2.7 V - - 0.7 - 0.7 V
VCC = 2.7 V to 3.6 V - - 0.8 - 0.8 V
VOH HIGH-level VI = VIH or VIL
output IO = 100 A; VCC 0.2 - - VCC 0.3 - V
voltage VCC = 1.65 V to 3.6 V
IO = 4 mA; VCC = 1.65 V 1.2 - - 1.05 - V
IO = 8 mA; VCC = 2.3 V 1.8 - - 1.65 - V
IO = 12 mA; VCC = 2.7 V 2.2 - - 2.05 - V
IO = 18 mA; VCC = 3.0 V 2.4 - - 2.25 - V
IO = 24 mA; VCC = 3.0 V 2.2 - - 2.0 - V
VOL LOW-level VI = VIH or VIL
output IO = 100 A; - - 0.2 - 0.3 V
voltage VCC = 1.65 V to 3.6 V
IO = 4 mA; VCC = 1.65 V - - 0.45 - 0.65 V
IO = 8 mA; VCC = 2.3 V - - 0.6 - 0.8 V
IO = 12 mA; VCC = 2.7 V - - 0.4 - 0.6 V
IO = 24 mA; VCC = 3.0 V - - 0.55 - 0.8 V
II input leakage VCC = 3.6 V; VI = 5.5 V or GND - 0.1 5 - 20 A
current
74LVC139 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
[1] All typical values are measured at VCC = 3.3 V (unless stated otherwise) and Tamb = 25 C.
VCC = 1.2 V - 14 - - - ns
VCC = 1.65 V to 1.95 V 0.5 4.7 10.4 0.5 11.3 ns
VCC = 2.3 V to 2.7 V 1.0 2.8 5.9 1.0 6.5 ns
VCC = 2.7 V 1.0 3.0 6.3 1.0 8.0 ns
VCC = 3.0 V to 3.6 V 1.0 2.5 5.3 1.0 7.0 ns
nE to Yn; see Figure 7 [2]
VCC = 1.2 V - 14 - - - ns
VCC = 1.65 V to 1.95 V 1.5 4.5 9.8 1.5 10.7 ns
VCC = 2.3 V to 2.7 V 2.1 2.7 5.6 2.1 6.1 ns
VCC = 2.7 V 1.0 2.8 5.4 1.0 7.0 ns
VCC = 3.0 V to 3.6 V 1.0 2.4 5.0 1.0 6.5 ns
tsk(o) output skew time VCC = 3.0 V to 3.6 V [3] - - 1.0 - 1.5 ns
CPD power dissipation VI = GND to VCC [4]
[1] Typical values are measured at Tamb = 25 C and VCC = 1.2 V, 1.8 V, 2.5 V, 2.7 V, and 3.3 V respectively.
[2] tpd is the same as tPLH and tPHL.
[3] Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.
[4] CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz; fo = output frequency in MHz
CL = output load capacitance in pF
VCC = supply voltage in V
N = number of inputs switching,
74LVC139 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
11. Waveforms
VI VI
GND GND
t PHL t PLH tPHL tPLH
VOH VOH
VOL VOL
mna782 mna783
74LVC139 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
tW
VI
90 %
negative
pulse VM VM
10 %
0V
tf tr
tr tf
VI
90 %
positive
pulse VM VM
10 %
0V
tW
VCC
VI VO
PULSE
DUT
GENERATOR
RT CL RL
001aaf615
74LVC139 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
D E A
X
y HE v M A
16 9
Q
A2
(A 3) A
A1
pin 1 index
θ
Lp
1 8 L
e w M detail X
bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
99-12-27
SOT109-1 076E07 MS-012
03-02-19
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1
D E A
X
c
y HE v M A
16 9
Q
A2 A
A1 (A 3)
pin 1 index
θ
Lp
L
1 8 detail X
w M
e bp
0 2.5 5 mm
scale
mm 2
0.21 1.80 0.38 0.20 6.4 5.4 7.9 1.03 0.9 1.00 8o
0.25 0.65 1.25 0.2 0.13 0.1 o
0.05 1.65 0.25 0.09 6.0 5.2 7.6 0.63 0.7 0.55 0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT338-1 MO-150
03-02-19
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
D E A
X
y HE v M A
16 9
Q
A2 (A 3)
A
A1
pin 1 index
θ
Lp
L
1 8
detail X
w M
e bp
0 2.5 5 mm
scale
mm 1.1
0.15 0.95 0.30 0.2 5.1 4.5 6.6 0.75 0.4 0.40 8o
0.25 0.65 1 0.2 0.13 0.1 o
0.05 0.80 0.19 0.1 4.9 4.3 6.2 0.50 0.3 0.06 0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT403-1 MO-153
03-02-18
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
16 terminals; body 2.5 x 3.5 x 0.85 mm SOT763-1
D B A
A
A1
E c
terminal 1 detail X
index area
terminal 1 C
e1
index area
e b v M C A B y1 C y
w M C
2 7
1 8
Eh e
16 9
15 10
Dh
X
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
A(1)
UNIT
max.
A1 b c D (1) Dh E (1) Eh e e1 L v w y y1
02-10-17
SOT763-1 --- MO-241 ---
03-01-27
13. Abbreviations
Table 9. Abbreviations
Acronym Description
CDM Charged Device Model
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
74LVC139 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in
be accurate and reliable. However, NXP Semiconductors does not give any the Absolute Maximum Ratings System of IEC 60134) will cause permanent
representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper)
completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in
consequences of use of such information. the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
In no event shall NXP Semiconductors be liable for any indirect, incidental,
repeated exposure to limiting values will permanently and irreversibly affect
punitive, special or consequential damages (including - without limitation - lost
the quality and reliability of the device.
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — NXP Semiconductors
damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial
contract or any other legal theory. sale, as published at http://www.nxp.com/profile/terms, unless otherwise
Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective
customer for the products described herein shall be limited in accordance agreement shall apply. NXP Semiconductors hereby expressly objects to
with the Terms and conditions of commercial sale of NXP Semiconductors. applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or
limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant,
notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or
to the publication hereof. other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed, Export control — This document as well as the item(s) described herein
authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior
safety-critical systems or equipment, nor in applications where failure or authorization from competent authorities.
74LVC139 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Non-automotive qualified products — Unless this data sheet expressly NXP Semiconductors’ specifications such use shall be solely at customer’s
states that this specific NXP Semiconductors product is automotive qualified, own risk, and (c) customer fully indemnifies NXP Semiconductors for any
the product is not suitable for automotive use. It is neither qualified nor tested liability, damages or failed product claims resulting from customer design and
in accordance with automotive testing or application requirements. NXP use of the product for automotive applications beyond NXP Semiconductors’
Semiconductors accepts no liability for inclusion and/or use of standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer 15.4 Trademarks
(a) shall use the product without NXP Semiconductors’ warranty of the
Notice: All referenced brands, product names, service names and trademarks
product for such automotive applications, use and specifications, and (b)
are the property of their respective owners.
whenever customer uses the product for automotive applications beyond
74LVC139 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
17. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Functional description . . . . . . . . . . . . . . . . . . . 4
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Recommended operating conditions. . . . . . . . 5
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
15.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
16 Contact information. . . . . . . . . . . . . . . . . . . . . 15
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
Authorized Distributor
NXP:
74LVC139D 74LVC139D-T 74LVC139DB 74LVC139DB-T 74LVC139PW 74LVC139BQ-G