HEF4052B
HEF4052B
HEF4052B
1. General description
The HEF4052B is a dual single-pole quad-throw analog switch (2x SP4T) suitable for use in
analog or digital 4:1 multiplexer/demultiplexer applications. Each switch features four independent
inputs/outputs (nY0, nY1, nY2 and nY3) and a common input/output (nZ). A digital enable input
(E) and two digital select inputs (S1 and S2) are common to both switches. When E is HIGH,
the switches are turned off. Inputs include clamp diodes. This enables the use of current limiting
resistors to interface inputs to voltages in excess of VDD.
3. Applications
• Analog multiplexing and demultiplexing
• Digital multiplexing and demultiplexing
• Signal gating
4. Ordering information
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
HEF4052BT -40 °C to +125 °C SO16 plastic small outline package; 16 leads; SOT109-1
body width 3.9 mm
HEF4052BTT -40 °C to +125 °C TSSOP16 plastic thin shrink small outline package; 16 SOT403-1
leads; body width 4.4 mm
Nexperia HEF4052B
Dual 4-channel analog multiplexer/demultiplexer
5. Functional diagram
VDD
16 13
1Z
12
1Y0
14
1Y1
15
10 1Y2
S1
11
1Y3
LOGIC 1 - OF - 4
LEVEL DECODER
9 CONVERSION 1
S2 2Y0
5
2Y1
6
E 2
2Y2
4
2Y3
3
2Z
8 7
mnb042
VSS VEE
nYn
VDD VDD
nZ
VEE
001aak604
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10
0 0
4×
9 3
13 1
6 G4
1Z
1Y0 12
MDX 1
10 S1 1Y1 14 0
S2 5
9 1Y2 15 1
3
1Y3 2
11 2
2Y0 1 4
3
2Y1 5 12
2Y2 2 14
13
6 E 2Y3 4 15
2Z
11
3 001aak605 mnb041
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1Z
1Y0
LEVEL
S1
CONVERTER 1Y1
LEVEL
S2
CONVERTER 1Y2
LEVEL
E
CONVERTER 1Y3
2Y0
2Y1
2Y2
2Y3
2Z
001aak634
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6. Pinning information
6.1. Pinning
HEF4052B
2Y0 1 16 VDD
HEF4052B
2Y2 2 15 1Y2
VSS VSS 8 9 S2
8 9 S2
001aag215 001aak606
Fig. 6. Pin configuration SOT109-1 (SO16) Fig. 7. Pin configuration SOT403-1 (TSSOP16)
7. Function table
Table 3. Function table
H = HIGH voltage level; L = LOW voltage level; X = don’t care.
Input Channel on
E S2 S1
L L L nY0 to nZ
L L H nY1 to nZ
L H L nY2 to nZ
L H H nY3 to nZ
H X X switches off
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8. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage -0.5 +18 V
VEE supply voltage referenced to VDD [1] -18 +0.5 V
IIK input clamping current pins Sn and E; - ±10 mA
VI < -0.5 V, or VI > VDD + 0.5 V
VI input voltage -0.5 VDD + 0.5 V
II/O input/output current - ±10 mA
IDD supply current - 50 mA
Tstg storage temperature -65 +150 °C
Tamb ambient temperature -40 +125 °C
Ptot total power dissipation Tamb = -40 °C to +125 °C [2] - 500 mW
P power dissipation per output - 100 mW
[1] To avoid drawing VDD current out of terminal Z, when switch current flows into terminals Y, the voltage drop across the bidirectional
switch must not exceed 0.4 V. If the switch current flows into terminal Z, no VDD current will flow out of terminals Y, and in this case
there is no limit for the voltage drop across the switch, but the voltages at Y and Z may not exceed VDD or VEE.
[2] For SOT109-1 (SO16) package: Ptot derates linearly with 12.4 mW/K above 110 °C.
For SOT403-1 (TSSOP16) package: Ptot derates linearly with 8.5 mW/K above 91 °C.
001aac285
15
VDD - VSS
(V)
10
operating area
0
0 5 10 15
VDD - VEE (V)
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S1 and S2
VDD or VSS
nZ nYn
E
IS
VSS = VEE
VDD
VO VI
001aak635
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VDD
S1 and S2 nY0 1
VDD or VSS switch
IS
nZ nYn 2
E
VSS = VEE
VSS
VI VO
001aak636
Fig. 10. Test circuit for measuring OFF-state leakage current nYn port
10.2. On resistance
Table 7. ON resistance
Tamb = 25 °C; ISW = 200 μA; VSS = VEE = 0 V.
Symbol Parameter Conditions VDD - VEE Typ Max Unit
RON(peak) ON resistance (peak) VI = 0 V to VDD - VEE; 5V 350 2500 Ω
see Fig. 11 and Fig. 12 10 V 80 245 Ω
15 V 60 175 Ω
RON(rail) ON resistance (rail) VI = 0 V; 5V 115 340 Ω
see Fig. 11 and Fig. 12 10 V 50 160 Ω
15 V 40 115 Ω
VI = VDD - VEE; 5V 120 365 Ω
see Fig. 11 and Fig. 12 10 V 65 200 Ω
15 V 50 155 Ω
ΔRON ON resistance mismatch VI = 0 V to VDD - VEE; 5V 25 - Ω
between channels see Fig. 11 10 V 10 - Ω
15 V 5 - Ω
V
VDD VSW
S1 and S2
VDD or VSS
nZ nYn
E
VSS = VEE
VSS
ISW VI
001aak637
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001aae648
400
RON
(Ω)
VDD = 5 V
300
200
100 10 V
15 V
0
0 5 10 15
VI (V)
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VEE Sn input VM
VSS
tPLH tPHL
tPLH tPHL
VO VO
90 %
nYn or nZ
nZ or nYn VM output
output VEE 10 %
VEE switch OFF switch ON switch OFF
001aac290 001aac291
Measurement points are given in Table 9. Measurement points are given in Table 9.
Fig. 13. nYn, nZ to nZ, nYn propagation delays Fig. 14. Sn to nYn, nZ propagation delays
VDD
E input VM
VSS
tPLZ tPZL
VO 90 %
nYn or nZ output
LOW-to-OFF
OFF-to-LOW 10 %
VEE
tPHZ tPZH
VO
90 %
nYn or nZ output
HIGH-to-OFF
OFF-to-HIGH
VEE 10 %
001aac292
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tW
VI
negative 90 %
VM VM
pulse
10 %
0V
tf tr
tr tf
VI
positive 90 %
VM VM
pulse 10 %
0V
tW
VDD
VDD VI
VI VO RL S1
PULSE open
DUT
GENERATOR
RT CL
VSS
VEE
001aaj903
[1] For nYn to nZ propagation delays use VEE. For Sn to nYn or nZ propagation delays use VDD.
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VDD
VDD
S1 and S2
VDD or VSS
S1 and S2
nZ nYn VDD or VSS
E nZ nYn
VSS = VEE E
VSS
RL CL D VSS = VEE
VSS
fi RL CL dB
fi
001aak638
001aak639
Fig. 17. Test circuit for measuring total harmonic
distortion Fig. 18. Test circuit for measuring frequency response
VDD
S1 and S2 nY0 1
VDD or VSS switch
nZ nYn 2
E
VSS = VEE
VSS RL CL dB
fi
001aak657
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RL RL
S1 and S2 nY0 1
switch
nZ nYn 2
E
G VSS = VEE CL V VO
VDD or VSS
001aak658
a. Test circuit
VO Vct
001aaj908
Fig. 20. Test circuit for measuring crosstalk voltage between digital inputs and switch
VDD
VDD
S1 and S2 nY0
S1 and S2 nY0 VDD or VSS
VDD or VSS
nZ nYn
nZ nYn
E
E
VSS = VEE
VSS = VEE VSS VI RL
VSS RL VO RL
VI RL VO
001aak659 001aak660
HEF4052B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2021. All rights reserved
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
D E A
X
y HE v M A
16 9
Q
A2
(A 3) A
A1
pin 1 index
θ
Lp
1 8 L
e w M detail X
bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
99-12-27
SOT109-1 076E07 MS-012
03-02-19
HEF4052B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2021. All rights reserved
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
D E A
X
y HE v M A
16 9
Q
A2 (A 3 )
A
A1
pin 1 index
θ
Lp
L
1 8
detail X
w M
e bp
0 2.5 5 mm
scale
mm
0.15 0.95 0.30 0.2 5.1 4.5 6.6 0.75 0.4 0.40 8o
1.1 0.25 0.65 1 0.2 0.13 0.1
0.05 0.80 0.19 0.1 4.9 4.3 6.2 0.50 0.3 0.06 0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT403-1 MO-153
03-02-18
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13. Abbreviations
Table 13. Abbreviations
Acronym Description
CMOS Complementary Metal-Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
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Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Ordering information....................................................1
5. Functional diagram.......................................................2
6. Pinning information......................................................5
6.1. Pinning.........................................................................5
6.2. Pin description............................................................. 5
7. Function table............................................................... 5
8. Limiting values............................................................. 6
9. Recommended operating conditions..........................6
10. Static characteristics..................................................7
10.1. Test circuits................................................................7
10.2. On resistance............................................................ 8
10.2.1. On resistance waveform and test circuit................. 8
11. Dynamic characteristics.............................................9
11.1. Waveforms and test circuit.......................................10
11.2. Additional dynamic parameters................................11
11.2.1. Test circuits........................................................... 12
12. Package outline........................................................ 14
13. Abbreviations............................................................ 16
14. Revision history........................................................16
15. Legal information......................................................17
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