Tl77Xxa Supply-Voltage Supervisors: 1 Features 3 Description
Tl77Xxa Supply-Voltage Supervisors: 1 Features 3 Description
Tl77Xxa Supply-Voltage Supervisors: 1 Features 3 Description
Three-Supply Monitoring
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TL7702A, TL7705A, TL7709A, TL7712A, TL7715A
SLVS028K – APRIL 1983 – REVISED SEPTEMBER 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.4 Device Functional Modes.......................................... 9
2 Applications ........................................................... 1 9 Application and Implementation ........................ 10
3 Description ............................................................. 1 9.1 Application Information............................................ 10
4 Revision History..................................................... 2 9.2 Typical Application .................................................. 10
9.3 System Examples ................................................... 12
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 10 Power Supply Recommendations ..................... 14
6.1 Absolute Maximum Ratings ...................................... 4 11 Layout................................................................... 14
6.2 ESD Ratings.............................................................. 4 11.1 Layout Guidelines ................................................. 14
6.3 Recommended Operating Conditions....................... 4 11.2 Layout Example .................................................... 14
6.4 Thermal Information .................................................. 5 12 Device and Documentation Support ................. 15
6.5 Electrical Characteristics........................................... 5 12.1 Related Links ........................................................ 15
6.6 Switching Characteristics .......................................... 5 12.2 Receiving Notification of Documentation Updates 15
6.7 Typical Characteristics .............................................. 6 12.3 Community Resources.......................................... 15
7 Parameter Measurement Information .................. 7 12.4 Trademarks ........................................................... 15
12.5 Electrostatic Discharge Caution ............................ 15
8 Detailed Description .............................................. 8
12.6 Glossary ................................................................ 15
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8 13 Mechanical, Packaging, and Orderable
8.3 Feature Description................................................... 9
Information ........................................................... 15
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
• Deleted Ordering Information table. ....................................................................................................................................... 1
REF 1 8 VCC
RESIN 2 7 SENSE
CT 3 6 RESET
GND 4 5 RESET
Not to scale
Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
CT 3 I/O External timing-capacitor pin
GND 4 — Device ground
REF 1 O Voltage reference output
RESET 6 O Supervisor reset signal output
RESET 5 O Supervisor reset signal output (inverted)
RESIN 2 I Reset input
SENSE 7 I Sense input
VCC 8 — Power Supply
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage (2) 20 V
VI Input voltage, RESIN –0.3 20 V
TL7702A (3) –0.3 6 V
TL7705A –0.3 20 V
VI Input voltage range SENSE
TL7709A –0.3 20 V
TL7712A, TL7715A –0.3 20 V
IOH High-level output current, IOH, RESET –30 mA
IOL Low-level output current, IOL, RESET 30 mA
TJ Operating virtual junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For proper operation of the TL7702A, the voltage applied to the SENSE terminal should not exceed VCC − 1 V or 6 V, whichever is less
(3) All voltage values are with respect to GND.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For proper operation of the TL7702A, the voltage applied to the SENSE terminal should not exceed VCC − 1 V or 6 V, whichever is less.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(1) All electrical characteristics are measured with 0.1-µF capacitors connected at REF, CT, and VCC to GND.
(1) All switching characteristics are measured with 0.1-µF capacitors connected at REF and VCC to GND.
(2) The rise and fall times are measured with a 4.7-kΩ load resistor at RESET and RESET.
Threshold Voltage
VCC ~ 3.6 V
VCC ~ 2 V
RESET td
td
Output
Undefined Output
Undefined
Figure 2. Assertion Time vs Load Resistance Figure 3. Deassertion Time vs Load Resistance
Figure 4. Assertion Time vs Load Capacitance Figure 5. De-assertion Time vs Load Capacitance
8 Detailed Description
8.1 Overview
The TL77xxA family of integrated-circuit supply-voltage supervisors is designed specifically for use as reset
controllers in microcomputer and microprocessor systems. The supply-voltage supervisor monitors the supply for
undervoltage conditions at the SENSE input. During power up, the RESET output becomes active (low) when
VCC attains a value approaching 3.6 V. At this point (assuming that SENSE is above VIT+), the delay timer
function activates a time delay, after which outputs RESET and RESET go inactive (high and low, respectively).
When an undervoltage condition occurs during normal operation, RESET and RESET go active. To ensure that a
complete reset occurs, the reset outputs remain active for a time delay after the voltage at the SENSE input
exceeds the positive-going threshold value.
During power down and when SENSE is below VIT−, the outputs remain active until VCC falls below 2 V. After
this, the outputs are undefined. An external capacitor (typically 0.1 μF) must be connected to REF to reduce the
influence of fast transients in the supply voltage.
Five versions of this circuit are available:
• TL7705A (Vt = 4.55 V): Application in TTL-systems and microcomputer systems which require a 5 volt supply
(for example, TMS7000)
• TL7709A (Vt = 7.6 V): Application in microcomputer systems using the TMS1XXXNLL
• TL7712A (Vt = 10.8 V): Application in CMOS, microprocessor, and memory circuits with a 12 volt supply.
• TL7715A (Vt = 13.5 V): Application in circuits which operate with a supply voltage of 15 V, as is found often in
analog circuits.
• TL7702A (Vt = 2.5 V): Application in systems where other supply voltages are used. The required trigger level
my be adjusted with an external resistor divider at the SENSE input.
~100 µA
A. TL7702A: R1 = 0 Ω, R2 = open
TL7705A: R1 = 7.8 kΩ, R2 = 10 kΩ
TL7709A: R1 = 19.7 kΩ, R2 = 10 kΩ
TL7712A: R1 = 32.7 kΩ, R2 = 10 kΩ
TL7715A: R1 = 43.4 kΩ, R2 = 10 kΩ
B. Resistor values shown are nominal.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
µC
=
5 5
4.5 4.5
4 4
3.5 3.5
3 3
2.5 2.5
2 2
1.5 1.5
1 1
0.5 0.5
0 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VCC (V) D005
VCC (V) D006
Figure 9. Supervisor RESET Output Voltage vs VCC Figure 10. Supervisor RESET Output Voltage vs VCC
5 5
4.5 4.5
4 4
RESET Voltage (V)
RESET Voltage (V)
3.5 3.5
3 3
2.5 2.5
2 2
1.5 1.5
1 1
0.5 0.5
0 0
4.5 4.52 4.54 4.56 4.58 4.6 4.5 4.52 4.54 4.56 4.58 4.6
VCC (V) D007
VCC (V) D008
Figure 11. Supervisor RESET Output Voltage vs VCC at Figure 12. Supervisor RESET Output Voltage vs VCC at
Transition Transition
CAUTION
These devices risk being damaged when powered by more than 20 V.
11 Layout
1 8
2 7
3 6
4 5
Figure 16. Printed Circuit Layout for the Supply Voltage Supervisor
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 13-Jan-2024
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TL7702ACD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7702AC Samples
TL7702ACDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7702AC Samples
TL7702ACP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 TL7702ACP Samples
TL7702AID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 7702AI Samples
TL7702AIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 7702AI Samples
TL7702AIP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 TL7702AIP Samples
TL7705ACD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7705AC Samples
TL7705ACDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7705AC Samples
TL7705ACP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 TL7705ACP Samples
TL7705ACPSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 T7705A Samples
TL7705AID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 7705AI Samples
TL7705AIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 7705AI Samples
TL7705AIP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 TL7705AIP Samples
TL7709ACD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7709AC Samples
TL7709ACDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7709AC Samples
TL7709ACP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 TL7709ACP Samples
TL7712ACD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7712AC Samples
TL7712ACDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7712AC Samples
TL7712ACP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 TL7712ACP Samples
TL7712AIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 7712AI Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 13-Jan-2024
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TL7715ACD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7715AC Samples
TL7715ACP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 TL7715ACP Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Jan-2024
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Jan-2024
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Jan-2024
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
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EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
4214825/C 02/2019
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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