STA8089FG

Fully integrated GPS/Galileo/GLONASS/BeiDou/QZSS receiver

with embedded RF and in-package Flash
Datasheet - production data

 2 Controller Area Network (CAN)

 2 channels ADC (10 bits)
 Operating condition:
– Main voltage regulator (VINL): 1.8 V ± 5%
VFQFPN56 – Backup voltage (VINB): 1.6 V to 4.3 V
(7 x 7 x 1.0 mm) – Digital voltage (VDD): 1.0 V to 1.32 V
– RF core voltage (VCC): 1.2 V ± 10%
– IO Ring Voltage (VddIO): 1.8 V ± 5% or
3.3 V ± 10%
 Package:
– VFQFPN56 (7 x 7 x 1.0 mm) 0.4 mm pitch
Features  Ambient temperature range: -40/+85°C
 STMicroelectronics positioning receiver with 48
tracking channels and 2 fast acquisition Description
channels supporting GPS, Galileo, GLONASS,
BeiDou and QZSS systems STA8089FG belongs to Teseo III family products.
The device is a single die standalone positioning
 ST-DRAW (Dead Reckoning Automotive Way)
receiver IC working on multiple constellations
supported (STA8089FGBD only)
(GPS/Galileo/GLONASS/BeiDou/QZSS).
 Pin to pin compatible with STA8088FG
The device is backward compatible with
 Single die standalone receiver embedding RF STA8088FG, this enables fast customer
Front-End and low noise amplifier application migration.
 -162 dBm indoor sensitivity (tracking mode)
The device is offered with a complete GNSS
 Fast TTFF < 1 s in Hot start and 30 s in Cold firmware which performs all GNSS operations
Start including tracking, acquisition, navigation and
 High performance ARM946 MCU (up to data output with no need of external memories.
196 MHz) STA8089FGBD can run also TESEO-DRAW the
 256 Kbyte embedded SRAM STMicroelectronics dead reckoning firmware.
 In-package SQI Flash Memory (16 Mbits)
 Real Time Clock (RTC) circuit
 32-bit Watch-dog timer
 3 UARTs
 1 I2C master interface
 1 Synchronous Serial Port (SSP, Motorola-SPI
supported)
 USB2.0 full speed (12 MHz) with integrated
physical layer transceiver

February 2023 DS10716 Rev 9 1/34

This is information on a product in full production. www.st.com
Contents STA8089FG

Contents

1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 VFQFPN56 pin configuration .................................. 8
2.3 Power supply pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 Main function pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5 Test/emulated dedicated pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.6 Communication interface pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2.7 General purpose pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.8 RF front-end pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1 RF front end . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2 GPS/Galileo/GLONASS/BeiDou Base Band (G3BB+) processor . . . . . . 14
3.3 MCU Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.3.1 AHB slaves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.4 APB peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.4.1 CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.4.2 SSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.4.3 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.4.4 Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.4.5 MTU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.4.6 WDT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.4.7 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.4.8 ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.4.9 RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.3 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.4 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

2/34 DS10716 Rev 9

STA8089FG Contents

4.5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

4.6 Recommended DC operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.7 DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.8 AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.8.1 RF electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.8.2 Oscillator electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.8.3 OSCI oscillator specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.8.4 ADC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.8.5 Flash specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

5.1 ECOPACK packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.2 VFQFPN56 7 x 7 mm package information . . . . . . . . . . . . . . . . . . . . . . . 30

6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

DS10716 Rev 9 3/34

3
List of tables STA8089FG

List of tables

Table 1. Power supply pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 2. Main function pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 3. Test/emulated dedicated pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 4. Communication interface pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 5. General purpose pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6. RF front-end pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 7. TCM Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 8. Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 9. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 10. Frequency limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 11. Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 12. Recommended DC operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 13. LDO1 DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 14. LDO2 DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 15. Low voltage detection thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 16. I/O buffers DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 17. 1.0 V I/O buffers DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 18. RFACHAIN – GALGPS filter and VGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 19. RFCHAIN – GLONASS/BeiDou filter and VGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 20. Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 21. Crystal recommended specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 22. Oscillator amplifier specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 23. Characteristics of external slow clock input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 24. SARADC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 25. Flash specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 26. VFQFPN56 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 27. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

4/34 DS10716 Rev 9

STA8089FG List of figures

List of figures

Figure 1. STA8089FG system block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 2. VFQFPN56 connection diagram (with CAN). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 3. VFQFPN56 connection diagram (no CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 4. 32.768 kHz crystal connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 5. SARADC connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 6. VFQFPN56 7 x 7 mm package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 7. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

DS10716 Rev 9 5/34

5
Overview STA8089FG

1 Overview

STA8089FG is one of the part number of Teseo III STA8089x series.

The device is a highly integrated single-chip standalone GNSS receiver designed for
positioning system applications. STA8089FG embeds the new STMicroelectronics GNSS
positioning engine capable of receiving signals from multiple satellite navigation systems,
including the US GPS, European Galileo, Russia's GLONASS, Chinese BeiDou and
Japan's QZSS.
STA8089FGBD can be offered also bundled with STMicroelectronics dead reckoning
firmware called TESEO-DRAW.
The STA8089FG ability of tracking simultaneously the signals from multiple satellites
regardless of their constellation, make this chip capable of delivering exceptional accuracy
in urban canyons and in the environments where buildings and other obstructions make
satellite visibility challenging.
The STA8089FG is backward compatible with STA8088FG, enabling fast customer
application migration. The STA8089FG combines a high performance ARM946
microprocessor with I/O capabilities and enhanced peripherals. It supports USB2.0 standard
at full speed (12 Mbps) with on-chip PHY.
The chip embeds backup logic with real time clock. The device is offered with a complete
firmware performing all positioning operations including acquisition, tracking, navigation and
data output with no need of external memories.
The device powered with 1.8V enables the on-chip voltage regulators to internally supply
the RF front-end, core logic and the backup logic. The device can be directly powered with
1.2 V bypassing the embedded voltage regulators which will be put in power down mode.
I/O lines are compatible with 1.8 V and 3.3 V. The STA8089FG, using STMicroelectronics
CMOSRF Technology, is housed in a VFQFPN-56 (7 x 7 x 1.0 mm) package with stacked 16
Mbit Flash memory.

6/34 DS10716 Rev 9

STA8089FG Pin description

2 Pin description

2.1 Block diagram

Figure 1. STA8089FG system block diagram

G3BB+ Correlator Engine G4RF IP

Acq 48 Trk
GG IF ADC LNA
RAMs Channels OSCI CLOCK_GEN
GG Section
Mux

PLL
APB 1 Fast Acq
Bridge Channel GC IF
ADC RF
GC Section SPI IF

AHB
Ring
OSCI
FLASH
(16Mb) APB
Bridge3
IOs
UART0 UART1 UART2
CAN0 CAN1 SSP
Rx-Tx Rx-Tx Rx-Tx
SQI APB2
IF
Test
APB
Bridge2 controller

WD GPIO MTU EFT I2C ADC

USB JTAG
IF
VIC

BK_Domain PMU

HIGH SPEED D-TCM

128KB BKRAM 32KB PRCC
I/D SWITCHABLE

I-Cache BKLDO LDO2 LDO1

ISO
7x16KB

16KB CELL
APB
ARM 946
Bridge1
D-Cache
8KB
OSCI32
RTC Bandgap, Bias, Oscillator, LVDs
HIGH SPEED I-TCM
16KB

GAPG1601141710CFT

DS10716 Rev 9 7/34

33
Pin description STA8089FG

2.2 VFQFPN56 pin configuration

Figure 2. VFQFPN56 connection diagram (with CAN)

VDDIO_R1

VDDIO_R2

CAN0_RX

CAN1_RX
CAN0_TX
USB_DM
USB_DP
SPI_DO

VDDD

TDO

TCK
TDI
NC

NC
43 44 45 46 47 48 49 50 51 52 53 54 55 56

SPI_DI 42 1 CAN1_TX

SPI_CLK 41 2 TMS

SPI_CSN 40 3 TRSTn

UART0_TX 39 4 NC

UART0_RX 38 5 TP_IF_P

UART2_TX 37 6 TP_IF_N

UART2_RX 36 7 NC

GPIO1 35 8 VCC_RF

VDD_SQI 34 9 LNA_IN

ADC_IN2 33 10 GND_LNA

ADC_IN1 32 11 NC

VINL1 31 12 VOL2

VOL1 30 13 VINL2

VINB 29 14 NC
28 27 26 25 24 23 22 21 20 19 18 17 16 15
RTC_XTO

RTC_XTI

WAKEUP

RSTn

STDBYn

VDDD

VOB

NC
XTAL_OUT

XTAL_IN

VCC_PLL

NC

VCC_CHAIN
STDBY_OUT

GAPG1601140842CFT

8/34 DS10716 Rev 9

STA8089FG Pin description

Figure 3. VFQFPN56 connection diagram (no CAN)

UART0_RX
UART0_TX
VDDIO_R1

VDDIO_R2
USB_DM
USB_DP
SPI_DO

ISC_SD
VDDD

TDO

TCK
TDI
NC

NC
43 44 45 46 47 48 49 50 51 52 53 54 55 56

SPI_DI 42 1 I2C_CLK

SPI_CLK 41 2 TMS

SPI_CSN 40 3 TRSTn

UART0_TX 39 4 NC

UART0_RX 38 5 TP_IF_P

UART2_TX 37 6 TP_IF_N

UART2_RX 36 7 NC

GPIO1 35 8 VCC_RF

VDD_SQI 34 9 LNA_IN

ADC_IN2 33 10 GND_LNA

ADC_IN1 32 11 NC

VINL1 31 12 VOL2

VOL1 30 13 VINL2

VINB 29 14 NC
28 27 26 25 24 23 22 21 20 19 18 17 16 15
RTC_XTO

RTC_XTI

WAKEUP

RSTn

STDBYn

VDDD

VOB

NC
XTAL_OUT

XTAL_IN

VCC_PLL

NC

VCC_CHAIN
STDBY_OUT

GAPG2101140910CFT

2.3 Power supply pins

Table 1. Power supply pins
Symbol I/O voltage I/O Description STA8089FG

VCC_CHAIN 1.2 V PWR Analog supply voltage for RF chain (1.2 V) 16

VCC_PLL 1.2 V PWR Analog supply voltage for PLL RF (1.2 V) 18
VCC_RF 1.2 V PWR Analog supply voltage for RF (1.2 V) 8
VDD_SQI 1.8 V PWR Digital supply voltage for SQI 34
VDDD 1.1 V PWR Digital supply voltage 22,47
VDDIO_R1 1.8 V or 3.3 V PWR Digital supply voltage for I/O ring 1 (1.8 V or 3.3 V) 44
VDDIO_R2 3.3 V PWR Digital supply voltage for I/O ring 2 (3.3 V) 52

DS10716 Rev 9 9/34

33
Pin description STA8089FG

Table 1. Power supply pins (continued)

Symbol I/O voltage I/O Description STA8089FG

VINB 1.6 V - 4.3 V PWR Backup LDO input supply voltage (1.6 V to 4.3 V) 29
VINL1 1.8 V PWR LDO1 and ADC input supply voltage 31
VINL2 1.6 V - 4.3 V PWR LDO2 input supply voltage (1.6 V to 4.3 V) 13
VOB 1.0 V PWR LDO backup output voltage (1.0 V) 21
VOL1 1.1 V PWR LDO1 output voltage (1.1 V, it can be also configured to 1.2 V) 30
VOL2 1.2 V PWR LDO2 output voltage (1.2 V) 12
GND GND GND Ground EP
GND_LNA GND GND Ground 10

2.4 Main function pins

Table 2. Main function pins
Symbol I/O voltage I/O Description STA8089FG

ADC_IN1 1.4 V – 0 V typ range I ADC Analog input [1] 32

ADC_IN2 1.4 V – 0 V typ range I ADC Analog input [2] 33
Reset Input with Schmitt-Trigger characteristics and
RSTn 1.0 V I 25
noise filter.
Input of the 32 KHz oscillator amplifier circuit and
RTC_XTI 1.0 V (max) I 27
input of the internal real time clock circuit.
RTC_XTO 1.0 V (max) O Output of the oscillator amplifier circuit. 28
STDBY_OUT 1.0 V O When low, indicates the chip is in Standby mode 23
When low, the chip is forced in Standby Mode - All
STDBYn(1) 1.0 V I pins in high impedance except the ones powered by 24
Backup supply
WAKEUP 1.0 V I WAKEUP from STANDBY mode 26
1. As STDBYn is forced High to exit Standby mode, VINL1 must be present within 200us.

2.5 Test/emulated dedicated pins

Table 3. Test/emulated dedicated pins
Symbol I/O voltage I/O Description STA8089FG

TCK VDDIO_R2 I JTAG Test Clock 56

TDI VDDIO_R2 I JTAG Test Data In 53
TDO VDDIO_R2 O JTAG Test Data Out 50
TMS VDDIO_R2 I JTAG Test Mode Select 2
TRSTn VDDIO_R2 I JTAG Test Circuit Reset 3

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STA8089FG Pin description

Table 3. Test/emulated dedicated pins (continued)

Symbol I/O voltage I/O Description STA8089FG

TP_IF_N 1.2 V O Diff.Test Point for IF - Neg. 6

TP_IF_P 1.2 V O Diff.Test Point for IF - Pos. 5

2.6 Communication interface pins

Table 4. Communication interface pins
Alternative
Symbol I/O voltage I/O Function Description STA8089FG
function

AF0
I CAN0_RX(1) CAN0 receive data input
(default)
I AF1 UART0_RX UART0 Rx data
CAN0_RX(1) VDDIO_R2 54
External temperature capture
I/O AF2 TSENSE
port
I/O AF3 I2C_SD I2C serial data
AF0
O CAN0_TX(1) CAN0 transmit data output
(default)

CAN0_TX(1) VDDIO_R2 O AF1 UART0_TX UART0 Tx data 51

I/O AF2 GPIO7 General purpose I/O #7
O AF3 I2C_CLK I2C clock
I/O AF0 I2C_SD I2C serial data
I/O AF1 GPIO9 General purpose I/O #9
CAN1_RX(1) VDDIO_R2 AF2 55
I CAN1_RX(1) CAN1 receive data input
(default)
I/O AF3 SPI_CSN SPI chip select active low
O AF0 I2C_CLK I2C clock
I/O AF1 GPIO8 General purpose I/O #8
CAN1_TX(1) VDDIO_R2 AF2 1
O CAN1_TX(1) CAN1 transmit data output
(default)
O AF3 SPI_CLK SPI clock
AF0
O SPI_CLK SPI clock
(default)

SPI_CLK VDDIO_R1 I/O AF1 GPIO25 General purpose I/O #25 41

O AF2 SQI_CLK SQI Flash clock
O AF3 Reserved —

DS10716 Rev 9 11/34

33
Pin description STA8089FG

Table 4. Communication interface pins (continued)

Alternative
Symbol I/O voltage I/O Function Description STA8089FG
function

AF0 SPI chip select active low /

O SPI_CSN
(default) IO_Power Sel Ring 1

SPI_CSN VDDIO_R1 I/O AF1 GPIO24 General purpose I/O #24 40

I/O AF2 SQI_CEN SQI Flash chip enable
I/O AF3 Reserved —
AF0
I SPI_DI SPI serial data input / BOOT2
(default)
External temperature capture
SPI_DI VDDIO_R1 I/O AF1 TSENSE 42
port
I/O AF2 SQI_SIO0/SI SQI Flash data IO 0 / ser. I
I/O AF3 Reserved —
AF0
O SPI_DO SPI serial data output
(default)

SPI_DO VDDIO_R1 I/O AF1 GPIO27 General purpose I/O #27 43

I/O AF2 SQI_SIO1/SO SQI Flash data IO 1 / ser. O
I/O AF3 Reserved —
AF0
I UART0_RX UART0 Rx data
(default)
O AF1 SPI_DO SPI serial data output
UART0_RX VDDIO_R1 38
I/O AF2 SQI_SIO2 SQI Flash data IO 2
Extended Function Timer - Input
I AF3 Timer_ICAPA
Capture_A
AF0
O UART0_TX UART0 Tx data / BOOT1
(default)
I AF1 SPI_DI SPI serial data input
UART0_TX VDDIO_R1 39
I/O AF2 SQI_SIO3 SQI Flash data IO 3
Extended Function Timer –
O AF3 Timer_OCMPA
Output Compare A
AF0
I UART2_RX UART2 Rx data
(default)

UART2_RX VDDIO_R1 I/O AF1 GPIO28 General purpose I/O #28 36

I/O AF2 I2C_SD I2C serial data
I/O AF3 Reserved —
AF0
O UART2_TX UART2 Tx data / BOOT0
(default)

UART2_TX VDDIO_R1 I/O AF1 GPIO29 General purpose I/O #29 37

O AF2 I2C_CLK I2C clock
I/O AF3 Reserved —

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STA8089FG Pin description

Table 4. Communication interface pins (continued)

Alternative
Symbol I/O voltage I/O Function Description STA8089FG
function

USB AF0 USB_DM USB D- signal

AF1
I UART1_RX UART1 Rx data
USB_DM VDDIO_R2 (default) 49
I AF2 CAN1_RX(1) CAN1 receive data input
I/O AF3 I2C_SD I2C serial data
USB AF0 USB_DP USB D+ signal
AF1
O UART1_TX UART1 Tx data
USB_DP VDDIO_R2 (default) 48
O AF2 CAN1_TX(1) CAN1 transmit data output
O AF3 I2C_CLK I2C clock
1. Only for STA8089FGB and STA8089FGBD.

2.7 General purpose pins

Table 5. General purpose pins
Alternative
Symbol I/O voltage I/O Function Description STA8089FG
function

General purpose I/O #1 /

I/O AF0 (default) GPIO1
BOOT3
I/O AF1 Reserved —
GPIO1 VDDIO_R1 35
O AF2 PPS_OUT Pulse per second output
External temperature
I/O AF3 TSENSE
capture port

2.8 RF front-end pins

Table 6. RF front-end pins
Symbol I/O voltage I/O Description STA8089FG

LNA_IN 1.2 V I Low Noise Amplifier Input 9

XTAL_IN 1.2 V I Input Side of Crystal Oscillator or TCXO Input 19
XTAL_OUT 1.2 V O Output Side of Crystal Oscillator 20

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General description STA8089FG

3 General description

3.1 RF front end

The RF front-end is able to down-convert both the GPS-Galileo signal from 1575.42 MHz to
4.092 MHz (4 Fo, being F0 = 1.023 MHz), the GLONASS signal from 1601.718 MHz to
8.57 MHz and the BeiDou signal from 1561.098 MHz to 10.23 MHz.
It embeds high performance LNA minimizing external component count and two LDOs to
supply the internal core facilitating requirements for external power supply. A three bits ADC
converts the IF signals to sign (SIGN) and magnitude (MAG0 and MAG1). They can be
sampled or not by SPI. The magnitude bits are internally integrated in order to control the
variable gain amplifiers. The VGA gain can be also set by the SPI interface.
The RF tuner accepts a wide range of reference clocks (10 to 52 MHz) and can generate
64 Fo sampling clock for the baseband and 192 Fo clock for MCU subsystem.

3.2 GPS/Galileo/GLONASS/BeiDou Base Band (G3BB+)

processor
STA8089FG integrates G3BB+ proprietary IP, which is the ST last generation high-
sensitivity Baseband processor fully compliant with GPS, Galileo, GLONASS and BeiDou
systems.
The baseband receives, from the embedded RF Front-End, two separate IF signals coded
in sign-magnitude digital format on 3 bits and the related clocks. The Galileo/GPS
(GALGPS) and GLONASS/BeiDou (GNSCOM) signals at the base band inputs are
centered on 4.092 MHz, 8.57 MHz and 10.23 MHz.
The baseband processes the two IF signals performing data codification, sample rate
conversion and final frequency conversion to zero IF before acquisition and tracking
correlations.
The baseband processor has the capability of acquiring and tracking the Galileo, GPS,
GLONASS and BeiDou signals in a simultaneous or single way, or a combination of three,
being GLONASS and BeiDou mutually exclusive. The number of tracking channels to be
used is programmable; the not used tracking channels can be powered down.
A complete multi-OS software library is provided by ST to handle GPS processing,
managing satellite acquisition, tracking, pseudo-range calculation and positioning,
generating the output in the standard NMEA message format or in a ST binary format. The
library includes support of ST self-trained assisted GPS (ST-AGPS), a complete and
scalable solution for assisting GPS start-up with autonomous and server-based ephemeris
prediction and extension.

3.3 MCU Subsystem

The implemented sub-system includes an AHB Lite bus matrix.
An ARM946 core is embedded in the sub-system and masters the AHB bus. The totally
available TCM SRAM is 256 KB. The amount of memory on ITCM and DTCM can be

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STA8089FG General description

configured by the ARM946 (see Table 7: TCM Configuration). ITCM can be configured as Ni
x 16 KB; DTCM can be configured as 128 + Nd x 16 KB, where Ni + Nd = 8, Ni 1.

Table 7. TCM Configuration

TCMcfg [2] TCMcfg [1] TCMcfg [0] ITCM DTCM

0 0 0 16 KB 240 KB
0 0 1 32 KB 224 KB
0 1 0 48 KB 208 KB
0 1 1 64 KB 192 KB
1 0 0 80 KB 176 KB
1 0 1 96 KB 160 KB
1 1 0 112 KB 144 KB
1 1 1 128 KB 128 KB

3.3.1 AHB slaves

 G3 APB port that allows to interface with the G3BB acquisition memory and control
registers.
 512 Kbytes ROM
 Vectored Interrupt Controller (VIC).
 SQI flash memory controller
 3 x ARM946 APB peripheral bus (APB1, APB2, APB3).

Vectored Interrupt Controller (VIC)

This Vectored Interrupt Controller (VIC) allows the operative system interrupt handler to
quickly dispatch interrupt service routines in response to peripheral interrupts. It provides a
software interface to the interrupt system. There are up to 64 interrupt lines. The VIC uses a
bit position for each different interrupt source.
The software can control each request line to generate software interrupts. Each interrupt
line can be independently enabled and configured to trigger a non-vectored Normal Interrupt
Request (IRQ) or Fast Interrupt Request (FIQ) to the ARM946 CPU. Sixteen interrupt lines
can also be selected to trigger a vectored IRQ.
The VIC has two operation modes: the user mode and the privilege mode, in order to have
the possibility to set (or not) one level of protection during execution.

FS USB device controller

Full speed USB device with transceiver. It is an AHB slave. When active requires a 48 MHz
clock XTAL_IN.

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General description STA8089FG

3.4 APB peripherals

3.4.1 CAN
The 2 CAN(a) cores perform communication according to the CAN protocol version 2.0 part
A and B. The bit rate can be programmed to values up to 1 MBit/s. For the connection to the
physical layer, additional transceiver hardware is required.
CAN consists of the CAN core, message RAM, message handler, control registers and
module. For communication on a CAN network, individual message objects are configured.
The message objects and identifier masks for acceptance filtering of received messages are
stored in the message RAM. All functions concerning the handling of messages are
implemented in the message handler. These functions include acceptance filtering, the
transfer of messages between the CAN core and the message RAM, and the handling of
transmission requests as well as the generation of the module interrupt.
The register set of the CAN can be accessed directly by the CPU through the module
interface. These registers are used to control/configure the CAN core and the message
handler and to access the message RAM.

CAN features
 Supports CAN protocol version 2.0 part A and B
 Bit rates up to 1 MBit/s
 Each message object has its own identifier mask
 Maskable interrupt
 Disabled automatic re-transmission mode for time triggered CAN applications
 Programmable loop-back mode for self-test operation
 Two 16-bit module interfaces to the AMBA APB bus from ARM

3.4.2 SSP
The SSP is a master interface for synchronous serial communication with peripheral
devices that have Motorola SPI.
The SSP performs serial-to-parallel conversion on data received from a peripheral device
on SPI_DI pin, and parallel-to-serial conversion on data written by CPU for transmission on
SPI_DO pin. The transmit and receive paths are buffered with internal FIFO memories
allowing up to 32 x 32-bit values to be stored independently in both transmit and receive
modes. FIFOs may be burst-loaded or emptied by the system processor or DMA, from one
to eight words per transfer. Each 32-bit word from the system fills one entry in FIFO.
The SSP includes a programmable bit rate clock divider and prescaler to generate the serial
output clock SSPCLK from the on-chip clock. One combined interrupt is delivered, which is
asserted from several internal maskable events.

a. Only for STA8089FGB and STA8089FGBD(see Figure 7: Ordering information scheme).

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SSP features
The SSP has the following features:
 Parallel-to-serial conversion on data written to an internal 32-bit wide, 32-location deep
 transmit FIFO
 Serial-to-parallel conversion on received data, buffering it in a 32-bit wide, 32-location
 deep receive FIFO
 Programmable data frame size from 4 to 32 bits,
 Programmable clock bit rate and prescaler
 Programmable clock phase and polarity in SPI mode

3.4.3 UART
The UARTx (x = 0|1|2) performs serial-to-parallel conversion on data asynchronously
received from a peripheral device on UARTx_RX pin, and parallel-to-serial conversion on
data written by CPU for transmission on UARTx_TX pin. The transmit and receive paths are
buffered with internal FIFO memories allowing up to 64 data byte for transmission, and 64
data byte with 4-bit status (break, frame, parity, and overrun) for receive.

UART features
The UARTx (x = 0|1|2) are Universal Asynchronous Receiver/Transmitter that support much
of the functionality of the industry-standard 16C650 UART. The main features are:
 Programmable baud rates up to UARTCLK / 16 (1.5 Mbps with UARTCLK at 24 MHz),
or up to UARTCLK / 8 (3.0 Mbps with UARTCLK at 24 MHz), with fractional baud-rate
generator
 5, 6, 7 or 8 bits of data
 Even, odd, stick or no-parity bit generation and detection
 1 or 2 stop bit generation
 Support of software flow control using programmable Xon/Xoff characters
 False start bit detection
 Line break generation and detection
 Separate 8-bit wide, 64-deep transmit FIFO and 12-bit wide, 64-deep receive FIFO
 Programmable FIFO disabling for 1-byte depth data path
These UARTs vary from industry-standard 16C650 on some minor points which are:
 Receive FIFO trigger levels
 The internal register map address space, and the bit function of each register differ
 The deltas of the modem status signals are not available
 1.5 stop bits is not supported
 Independent receive clock feature is not supported

3.4.4 Flash
The STA8089FG integrates 16Mbits of Flash Memory. This eliminates the need external
Flash simplifying the routing associated to integrate a GPS receiver into a customer board.

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General description STA8089FG

3.4.5 MTU
The 2 Multi Timer Units provide access to eight interrupt generating programmable 32-bit
Free-Running decrementing Counters (FRCs). The FRCs have their own clock input,
allowing the counters to run from a much slower clock than the system clock.
The FRC is the part of the timer that performs the counting. There are four instantiations of
the FRC block in each MTU, allowing eight counts to be performed in parallel. The 32-bit
counter in the FRC is split up into two 16-bit counters.

3.4.6 WDT
Watchdog Timer (WDT) provides a way of recovering from software crashes. The watchdog
clock is used to generate a regular interrupt (WDOGINT), depending on a programmed
value.
The watchdog monitors the interrupt and asserts a reset signal (WDOGRES) if the interrupt
remains unserviced for the entire programmed period. You can enable or disable the
watchdog unit as required.
Note: Watchdog is stalled when the ARM processor is in Debug mode.

3.4.7 GPIO
The GPIO block provides twelve (12) programmable inputs or outputs. Each input or output
can be controlled in two modes:
 software mode through an APB bus interface
 alternate mode, where GPIO becomes a peripheral input or output line
Any GPIO input can be independently enabled or disabled (masked) for interrupt
generation. User can select for each GPIO which edge (rising, falling, both) will trigger an
interrupt.

3.4.8 ADC
10 bit SAR ADC operating at 1.8 V analog supply. It can convert up to 2 single ended
channels with analog input multiplexer at 500KSPS

3.4.9 RTC
This is an always-on power domain dedicated to RTC logic (backup system) with 32 Kbyte
SRAM and supplied with a dedicated voltage regulator.
The RTC provides a high resolution clock which can be used for GPS. It keeps the time
when the system is inactive and can be used to wake the system up when a programmed
alarm time is reached. It has a clock trimming feature to compensate for the accuracy of the
32.768 kHz crystal and a secured time update.

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RTC features
 47-bit counter clocked by 32.768 kHz clock
 32-bit for the integer part (seconds) and 15-bit for the fractional part
 The integer part and the fractional part are readable independently
 The counter, once enabled, can be stopped
 Integer part load register (32-bit)
 Fractional part load register (15-bit)
 Load bit to transfer the content of the entire load register (integer+fractional part) to the
47-bit counter. Once set by the MCU this bits is cleared by the hardware to signal to the
MCU that the RTC has been updated.

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Electrical characteristics STA8089FG

4 Electrical characteristics

4.1 Parameter conditions

Unless otherwise specified, all voltages are referred to GND.

4.2 Minimum and maximum values

Unless otherwise specified the minimum and maximum values are guaranteed in the worst
conditions of ambient temperature, supply voltage and frequencies by tests in production on
100% of the devices with an ambient temperature at TA = 25°C.

4.3 Typical values

Unless otherwise specified, typical data are based on TA = 25°C, Vddio = 1.8 V, Vdd = 1.20 V.
They are given only as design guidelines and are not tested.

4.4 Typical curves

Unless otherwise specified, all typical curves are given only as design guidelines and are
not tested.

4.5 Absolute maximum ratings

This product contains devices to protect the inputs against damage due to high static
voltages, however it is advisable to take normal precautions to avoid application of any
voltage higher than the specified maximum rated voltages.
Table 8 lists the absolute maximum rating for STA8089FG.

Table 8. Voltage characteristics

Symbol Parameter Min. Max. Unit

VCC_CHAIN Analog supply voltage for RF chain (1.2 V) -0.3 1.32 V

VCC_PLL Analog supply voltage for PLL RF (1.2 V) -0.3 1.32 V
VCC_RF Analog supply voltage for RF (1.2 V) -0.3 1.32 V
VDDD Power supply pins for the core logic -0.3 1.32 V
VDD_SQI Digital supply voltage for SQI -0.3 1.95 V
VDDIO_R1 Digital supply voltage for I/O ring 1 (1.8 V or 3.3 V) -0.3 3.63 V
VDDIO_R2 Digital supply voltage for I/O ring 2 (3.3 V) -0.3 3.63 V
VINB Backup LDO input supply voltage (1.6 V to 4.3 V) -0.3 4.8 V
VINL1 LDO1 input supply voltage (1.8 V) -0.3 1.98 V
VINL2 LDO2 input supply voltage (1.6 V to 4.3 V) -0.3 4.8 V

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Table 8. Voltage characteristics (continued)

Symbol Parameter Min. Max. Unit
(1)
VESD-HBM Electrostatic discharge, human body model -2 2 kV
VESD-CDM Electrostatic discharge, charge device model(2) -250 250 V
1. Pins sustaining only ±500 V are: 12, 13, 21, 27, 28, 29, 30 and 31
2. Pin 9 (LNA_IN) sustains only ±100 V.

Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.

Table 9. Thermal characteristics

Symbol Parameter Min. Max. Unit

Toper Operative ambient temperature -40 85 °C

Tj Operative junction temperature -40 125 °C
Tst Storage temperature -55 150 °C
Rj-amb Thermal resistance junction to ambient(1) 24.4 °C/W
1. According to JEDEC specification on a 2 layers board.

Table 10. Frequency limits

Symbol Parameter Test condition Min. Typ. Max. Unit

FCLK Operating ARM9 CPU frequency VDDD = 1.2 V; — — 196 MHz

FAHB AHB frequency TC = 85 °C(1) — — 49 MHz
1. Not tested in production.

Table 11. Power consumption

Symbol Parameter Test condition Min. Typ. Max. Unit

G2 = GPS/Galileo;
Tamb = 25 °C; — 25 — mW
VINL2 = 1.8 V
G2 + GLONASS;
PRF RFIP power (total VINL2) Tamb = 25 °C; — 35 — mW
VINL2 = 1.8 V
G2 + COMPASS;
Tamb = 25 °C; — 35 — mW
VINL2 = 1.8 V
fARM = 196 MHz;
fAHB = 49 MHz;
Switchable area power;
PMVR(1) Tamb = 25 °C; — 90 — mW
(total VINL1)
VINL1 = .8 V; UART active;
other peripherals inactive

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Electrical characteristics STA8089FG

Table 11. Power consumption (continued)

Symbol Parameter Test condition Min. Typ. Max. Unit

fARM = 196 MHz;

Always ON area power
PLPVR(1) fAHB = 49 MHz; — 1 — mW
(total VINB)
Tamb = 25 °C; VINB = 3.3 V
fARM = 196 MHz;
fAHB = 49 MHz;
IO rings power (total Tamb = 25 °C;
PIO(1) — 4 — mW
VDDIO_R1 + VDDIO_R2) VINL1 = 1.8 V; UART
active; other peripherals
inactive
Standby mode supply
IDStandby RTC — 29 — µA
current
running = 32.768 KHz;
Deep standby mode Tamb = 25 °C; VINB = 1.8 V
IDDeepStandby — 7 25 µA
supply current(2)
1. Not tested in production.
2. STDBY_OUT pin not supported in deep standby.

4.6 Recommended DC operating conditions

Table 12 lists the functional recommended operating DC parameters for STA8089FG.

Table 12. Recommended DC operating conditions

Symbol Parameter Min. Typ. Max. Unit

VCC_CHAIN Analog supply voltage for RF chain (1.2 V) 1.08 1.20 1.32 V
VCC_PLL Analog supply voltage for PLL RF (1.2 V) 1.08 1.20 1.32 V
VCC_RF Analog supply voltage for RF (1.2 V) 1.08 1.20 1.32 V
VDD_SQI Flash power supply 1.71 1.80 1.89 V
VDDD Power supply pins for the core logic 1.00 1.10 1.32 V
Digital supply voltage for I/O ring 1 (1.8 V) 1.71 1.80 1.89 V
VDDIO_R1
Digital supply voltage for I/O ring 1 (3.3 V) 3.00 3.30 3.60 V
VDDIO_R2 Digital supply voltage for I/O ring 2 (3.3 V) 3.00 3.30 3.60 V
Backup LDO input supply voltage (1.6 V to
VINB 1.60 4.30 V
4.3 V)
VINL1 LDO1 input supply voltage (1.8 V) 1.71 1.89 V
VINL2 LDO2 input supply voltage (1.6 V to 4.3 V) 1.60 4.30 V
TC Operating case temperature -40 85 °C

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4.7 DC characteristics
Table 13 specifies the LDO1 voltage regulator characteristics.

Table 13. LDO1 DC characteristics

Symbol Parameter Test condition Min. Typ. Max. Unit

1.71 V ≤ VINL1 ≤ 1.89 V;

Output voltage (1.2V) 1.08 1.20 1.32 V
IOL1 ≤ 70 mA
VOL1
1.71 V ≤ VINL1 ≤ 1.89 V;
Output voltage (1.1V) 1 1.10 1.2 V
IOL1 ≤ 70 mA
IOL1 Output current 0 — 70 mA

Table 14 specifies the LDO2 voltage regulator characteristics.

Table 14. LDO2 DC characteristics

Symbol Parameter Test condition Min. Typ. Max. Unit

1.6 V ≤ VINL2 ≤ 4.3 V;

VOL2 Output voltage 1.08 1.20 1.32 V
IOL2 ≤ 30 mA
IOL2 Output current 0 — 30 mA

Table 15 specifies the low voltage detection thresholds.

Table 15. Low voltage detection thresholds

Parameter Min. Typ. Max. Unit

Input LVD always on Upper voltage threshold — 1.680 — V

VR(1) Lower voltage threshold — 1.650 — V

Output LVD always Upper voltage threshold — 0.995 — V

on VR(1) Lower voltage threshold — 0.935 — V
Upper voltage threshold @ VOL1 = 1.2 V — 1.142 — V

Output LVD main Lower voltage threshold @ VOL1 = 1.2 V — 1.076 — V

VR(1) Upper voltage threshold @ VOL1 = 1.1 V — 1.048 — V
Lower voltage threshold @ VOL1 = 1.1 V — 0.986 — V
1. Not tested in production.

Table 16 lists the DC characteristics for all the IO digital buffers except for the following input
buffers: STBYn (24), STDBY_OUT (23), WAKEUP (26) and RSTn (25).

Table 16. I/O buffers DC characteristics

Test
Symbol Parameter Min. Typ. Max. Unit
conditions

VDDIO = 1.8 V -0.3 — 0.3 * VDDIO V

VIL(1) Logical input low level voltage
VDDIO = 3.3V -0.3 — 0.8 V

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Electrical characteristics STA8089FG

Table 16. I/O buffers DC characteristics (continued)

Test
Symbol Parameter Min. Typ. Max. Unit
conditions

Logical input high level VDDIO = 1.8 V 0.7 * VDDIO — VDDIO + 0.3 V
VIH(1)
voltage VDDIO = 3.3V 2.0 — VDDIO + 0.3 V
VHYST(2) Schmitt-trigger hysteresis – 50 — mV
VDDIO = 1.8 V — 0.4 V
VOL Low level output voltage
VDDIO = 3.3V — 0.4 V
VDDIO = 1.8 V VDDIO - 0.4 — V
VOH High level output voltage
VDDIO = 3.3V VDDIO - 0.4 — V
1. Excludes oscillator inputs RTC_XTI and XTAL_IN. Refer to oscillator electrical specifications.
2. Apply to all digital inputs unless specified otherwise.

Table 17 lists the DC characteristics for the 1.0 V IO digital buffers input buffers: STBYn
(24), STDBY_OUT (23), WAKEUP (26) and RSTn (25).

Table 17. 1.0 V I/O buffers DC characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

VIL Logical input low level voltage VOB = 1.0 V -0.3 — 0.35 * VOB V
VIH Logical input high level voltage VOB = 1.0 V 0.65 * VOB — VOB + 0.3 V
VOL Low level output voltage VOB = 1.0 V — 0.2 V
VOH High level output voltage VOB = 1.0 V VOB - 0.2 — V

4.8 AC characteristics

4.8.1 RF electrical specifications

Table 18. RFACHAIN – GALGPS filter and VGA

Symbol Parameter Test conditions Min Typ Max Unit

S11(1) Input return loss GPS band — -8 dB

PLL in default condition with
fIF IF frequency — 4.045 MHz
26Mhz as reference
NF overall chain with AGC set
NF Noise figure — 2(1) dB
at 0 dB

VGA at min gain — 69 dB

Conversion gain from
CG
RF input to ADC input
VGA at max gain — 119 dB

RF-IF-VGA input
IP1dB VGA min — -80 dBm
compression point
IRR Image rejection ratio — 20 dB

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Table 18. RFACHAIN – GALGPS filter and VGA (continued)

Symbol Parameter Test conditions Min Typ Max Unit

BWGPS GPS mode — 2.4 MHz

-3dB IF bandwidth
BWGAL Galileo mode — 4.8 MHz
Alias frequency F = 60 MHz
ATT — 30 dB
rejection (fs = 65.474 MHz)
TgGPS IF filter group delay GPS mode — 200(1) ns
variation (1)
TgGAL Galileo mode — 30 ns
1. Not tested in production.

Table 19. RFCHAIN – GLONASS/BeiDou filter and VGA

Symbol Parameter Test conditions Min Typ Max Unit

GLONASS band -10

S11(1) Input return loss dB
BeiDou band -7
IF frequency for PLL in default condition — 8.519
fIFGNS/BDU GLONASS with 26 Mhz as MHz
IF frequency for BeiDou reference — 10.277
NF overall chain with
NF Noise figure — 2(1) dB
AGC set at 0 dB

VGA at min gain — 68 dB

Conversion gain from
CG
RF input to ADC input
VGA at max gain — 118 dB

RF-IF-VGA input
IP1dB VGA min — -80 dBm
compression point
IRR Image rejection ratio — 25 dB
BWGNS/BDU -3dB IF bandwidth — 10 MHz
F = 53 MHz
ATT Alias frequency rejection — 30 dB
(fs = 65.474 MHz)
IF filter group delay
TgGNS/BDU — 20(1) ns
variation
1. Not tested in production.

Table 20. Synthesizer

Symbol Parameter Min. Typ. Max. Unit

FTCXO_XTAL Input frequency for xtal amplifier (1) 10 52 MHz

RDIV Reference divider range 1 63
NDIV Loop divider range 56 2047
FLO LO operating frequency 3142.656 MHz
1. That amplifier can be used also as a TCXO input buffer.

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Electrical characteristics STA8089FG

4.8.2 Oscillator electrical specifications

This device contains two oscillators:
 a 32.768 kHz oscillator/buffer for RTC circuit.
 an OSCI oscillator/buffer in the RF Front-End
When used in oscillator mode, each oscillator requires a specific crystal, with parameters
that must be as close as possible to the following recommended values. When used in input
buffer mode, an external clock source must be applied.

32.768 kHz OSCI32 oscillator specifications

The 32.768 kHz OSCI32 oscillator is connected between RTC_XTI (oscillator amplifier
input) and RTC_XTO (oscillator amplifier output). It also requires two external capacitors of
18 pF(b), as shown on Figure 4.
OSCI32 is disabled by default and must be enabled by setting bit28-OSCI_EN of
PRCC_BACKUP_REG0 to have 32.768KHz oscillation when an XTAL pi-network is
connected to RTC_XTI/RTC_XTO pins.
The recommended oscillator specifications are shown in Table 21:

Table 21. Crystal recommended specifications

Symbol Parameter Min. Typ. Max. Unit

FSXTAL Crystal frequency(1) — 32.768 — kHz

LMSXTAL Motion inductance(1) — 5 — kH
CMSXTAL Motional capacitance(1) — 5.0 — fF
COSXTAL Shunt capacitance(1) — 1.3 — pF
(1)
ESR Resonance resistance — — 80 kΩ
(1)
CL External load capacitance — 18 — pF
1. Not tested in production.

The oscillator amplifier specifications are shown in the following table:

Table 22. Oscillator amplifier specifications

Symbol Parameter Min. Typ. Max. Unit

TS Startup time(1) — 0.3 0.6 s

(1)
DL Drive level — — <0.1 µW
RLC Required load capacitance(1) — 12.5 — pF
GM Startup transconductance 22.5 33.6 — µA/V
1. Not tested in production.

b. Using crystal with recommended characteristics as per Table 21.

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Figure 4. 32.768 kHz crystal connection

Device

RTC_XTII RCT_XTO

CL = 18 pF 32.768 kHz CL = 18 pF
Crystal

To drive the 32.768 kHz crystal pins from an external clock source:
 Disable the oscillator (bit28-OSCI_EN = 0b in PRCC_BACKUP_REG0 register). This
disables the internal inverter, thus reducing the power consumption to minimum.
 Drive the RTC_XTI pin with a square signal or a sine wave.

Table 23. Characteristics of external slow clock input

Symbol Parameter Min. Typ. Max. Unit

TJIT (cc) Cycle-to-cycle jitter -70 — 70 ps

TJIT (per) Period jitter -70 — 70 ps
Variation -500 — 500 ppm
TDUTY Duty cycle 45 — 55 %

4.8.3 OSCI oscillator specifications

The supported values of the embedded BOOT ROM are 16.368 MHz, 24.00 MHz,
26.00 MHz and 48.00 MHz.
The default values supported by the GNSS binary image is 26MHz and 48MHz, to enable
USB peripheral the 48 MHz is mandatory.

4.8.4 ADC specifications

This section gives the AC specification of the 10 bit Successive Approximation Register
ADC embedded in STA8089FG device. It is controlled by the ARM9 MCU through a
wrapper and an APB bridge as depicted in Figure 5 and it has a maximum conversion rate
of 1MSPS with 8 muxed analog input channels capability. An internal voltage reference is
used and analog/digital power supplies connections are implemented inside the device
without any needs of dedicated external pins.

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Electrical characteristics STA8089FG

Figure 5. SARADC connections

GND
VINL1 VDD12_MVR

SARADC
AIN0

GND
AVDD

AGND
ADC_IN1

VDD
AIN1
ADC_IN2 VREF REFP
APB
D[9:0] Bridge2
SEL[2:0]

REFN
AIN7

START
ADC_IN8

EOC

CLK
EN

ADC WRAPPER

Table 24. SARADC specifications

Symbol Parameter Min. Typ. Max. Unit

VADCIN ADC_IN input range VGND-0.3 — VINL1+0.3 V

VADCCR Conversion range VGND — VREF V
VREF Voltage reference 1.35 1.4 1.45 V
CIN Input capacitance(1) 5.5 7.0 8.5 pF
Input mux resistance (total
RIN 1.5 2.0 2.5 k
equivalent sampling resistance)(2)
FCLK Clock frequency 2.5 15 MHz
CLK Clock duty cycle 45 50 55 %
TSUP Start up time(1)(3) — — 20 µs
TC Conversion time — 14 cycles
TS Sampling time — 3 cycles
INL < +/- 2 LSB
Performance
DNL < +/- 2 LSB
1. Not tested in production.
2. Pad input capacitance included.
3. From EN=1.

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4.8.5 Flash specifications

This section gives the AC specification of the embedded Flash in STA8089FG device.

Table 25. Flash specifications

Symbol Parameter Test conditions Min. Typ. Max. Unit

fC Serial clock frequency QPI mode - 4 read instructions — 78 MHz

tSE Sector erase cycle time — 30 200 ms
tBE Block erase cycle time — 500 2000 ms
tCE Chip erase time Size = 16 Mb — 8 20 s
tPP Page program cycle time — 0.9 3 ms

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Package and packing information STA8089FG

5 Package and packing information

5.1 ECOPACK packages

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.

5.2 VFQFPN56 7 x 7 mm package information

Table 26. VFQFPN56 package dimensions
Symbol Min. Typ. Max

Common dimensions

A 0.80 0.85 0.90

A1 0 0.01 0.05
A2 0.60 0.65 0.70
A3 0.20 REF
b 0.15 0.20 0.25
D 7.00 BSC
D1 6.75 BSC
D2 5.0 5.1 5.2
E 7.00 BSC
E1 6.75 BSC
E2 5.0 5.1 5.2
e 0.40 BSC
 0° 12°
L 0.30 0.40 0.50
N 56
Nd 14
Ne 14
P 0.24 0.42 0.60
Q 0.30 0.40 0.65
R 0.13 0.17 0.23

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Figure 6. VFQFPN56 7 x 7 mm package dimension

GAPGCFT00539

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Ordering information STA8089FG

6 Ordering information

Figure 7. Ordering information scheme

Example code:

STA8089FG B D TR
Family identifier Qualified Grade/CAN Bus Packing

TR = Tape and Reel 

<blank> = Tray
D = GNSS + DRAW 
<blank> = GNSS only
B = Industrial Grade (with CAN)
<blank> = Industrial Grade (no CAN)

SAL with Stacked Flash

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STA8089FG Revision history

7 Revision history

Table 27. Document revision history

Date Revision Changes

21-Nov-2014 1 Initial release.

Updated Features and Description
Updated Chapter 1: Overview
Updated Table 5: General purpose pins
15-Apr-2015 2
Updated Section 3.4.3: UART
Updated Section 4.7: DC characteristics, Section 4.8: AC
characteristics and Section 4.8.3: OSCI oscillator specifications
Table 1: Power supply pins:
– VDDD, VOL1: updated description
Table 13: LDO1 DC characteristics:
– VOL1: set min and max values as TBD, removed condition for Output
30-Jun-2015 3 voltage at 1.0 V
Table 14: LDO2 DC characteristics:
– VOL2: set min and max values as TBD
Table 15: Low voltage detection thresholds:
– Output LVD main VR: removed condition for Output voltage at 1.0 V
Table 8: Voltage characteristics:
24-Nov-2015 4
– VESD-HBM, VESD-CDM: updated values
25-Nov-2015 5 Updated package data
Updated Features and Description
Updated Overview
Updated Table 4: Communication interface pins:
01-Jun-2016 6 – Note 1
Updated Section 3.4.1: CAN:
– Note a
Updated Section Figure 7.: Ordering information scheme
Updated:
– Table 9: Thermal characteristics on page 21 (Rj-amb value);
– Table 11: Power consumption: removed IDSLEEP and added IDStandby
and IDDeepStandby parameters;
29-May-2017 7
– Table 13: LDO1 DC characteristics added Min and Max values of
VOL1 parameter;
– Table 14: LDO2 DC characteristics added Min and Max values of
VOL2 parameter.
Updated:
27-Jul-2017 8
– Table 11: Power consumption: added in IDDeepStandby max value.
07-Feb-2023 9 Updated Table 2: Main function pins.

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 STA8089FG

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