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TLW Unit5

The document outlines the steps for analyzing signal integrity through theoretical design, simulation, measurement, and interpretation of results. It discusses the use of tools like VNA and TDR for frequency and time domain analysis, as well as common issues and limitations associated with microstrip lines in microwave engineering. Additionally, it highlights the applications and advantages of microstrip technology in various microwave components and systems.

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thomaslivingston31306
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14 views11 pages

TLW Unit5

The document outlines the steps for analyzing signal integrity through theoretical design, simulation, measurement, and interpretation of results. It discusses the use of tools like VNA and TDR for frequency and time domain analysis, as well as common issues and limitations associated with microstrip lines in microwave engineering. Additionally, it highlights the applications and advantages of microstrip technology in various microwave components and systems.

Uploaded by

thomaslivingston31306
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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Steps you would take to analyze the signal integrity

and interpret the results of a practical


measurement
• Theoretical Design and Simulation
• Geometry Definition
• Define the trace width, substrate height, dielectric constant (εᵣ), and copper thickness.
• Use design equations or tools (e.g., TXLine, ADS, HFSS) to calculate:
• Characteristic impedance (Z₀)
• Effective dielectric constant (εₑff)
• Propagation delay
• b. Simulation (Optional but Recommended)
• Simulate S-parameters and time-domain responses using EM simulators.
• Perform TDR (Time Domain Reflectometry) simulation to identify impedance discontinuities.
Prepare for Measurement

• Test Setup
• Use a VNA (Vector Network Analyzer) for frequency domain measurements (S-parameters).
• Use a TDR oscilloscope for time domain impedance profile.
• Apply proper connectors and calibration (SOLT or TRL calibration standards).
• b. De-embedding
• If probes or fixtures are used, de-embedding might be necessary to remove their influence.
Measurement: Frequency Domain Analysis

• Use a VNA to measure S-parameters (S11, S21):


• a. Return Loss (S11)
• Check how much signal is reflected.
• Good signal integrity: S11 < -10 dB over frequency band of interest.
• b. Insertion Loss (S21)
• Check how much signal is transmitted.
• Excessive loss can indicate poor conductor/dielectric quality or radiation loss.
• c. Phase of S21
• Use it to calculate group delay or phase velocity.
Measurement: Time Domain Analysis

• Use a TDR instrument:


• a. Impedance Profile
• Launch a fast edge and observe reflections.
• Flat, constant impedance means good signal integrity.
• Discontinuities (e.g., stubs, connectors, vias) show up
as reflections.
• b. Reflection Coefficient

•𝑍
• Translate the TDR trace to impedance using:
Interpret Results
Parameter Acceptable Range Indicates

S11 < -10 dB Low reflections

S21 Close to 0 dB (minus insertion loss)


Good transmission

TDR trace Flat around Z₀ Uniform impedance

Delay Matches simulation Accurate length/velocity


Identify and Address Issues

• If anomalies are found:


• High S11 / TDR reflections → Impedance mismatches, connector issues, discontinuities.
• High S21 loss → Dielectric loss, conductor loss, radiation.
• Crosstalk (if measuring multiple lines) → Poor spacing or shielding.
Limitations and Challenges of Microstrip Lines in Microwave
Engineering

• Radiation Losses
• Microstrip lines are not fully enclosed; they radiate electromagnetic energy.
• This becomes significant at higher frequencies (GHz range), causing signal degradation and EMI.
• 2. Dispersion
• Microstrip lines support quasi-TEM modes, which are not perfectly non-dispersive.
• Phase velocity changes with frequency, leading to distortion in broadband signals.
• 3. Losses at High Frequencies
• Dielectric and conductor losses increase with frequency.
• Skin effect and surface roughness of conductors worsen signal attenuation.
contd.
• Impedance Discontinuities
• Discontinuities at bends, junctions, or component interfaces cause reflections and signal integrity issues.
• Vias and connectors introduce parasitic inductance/capacitance.
• 5. Environmental Sensitivity
• Changes in temperature and humidity can alter dielectric properties, affecting impedance and delay.
• 6. Limited Power Handling
• Due to small cross-sectional area and open structure, microstrip lines can't handle high RF power as well
as coaxial or waveguide systems.
• 7. Cross-talk and Coupling
• In high-density designs, adjacent microstrip lines can couple, causing interference.
• Requires careful spacing and shielding.
Applications and Advantages of Microstrip
Lines in Microwave Engineering
• Microstrip lines are widely used due to their planar structure, ease of integration, and compatibility with PCB
fabrication.
• 1. Microwave Integrated Circuits (MICs)
• Microstrip lines are used as interconnects and passive elements (e.g., filters, couplers).
• Example: Microstrip low-pass filters in radar front-ends.
• 2. Antennas
• Microstrip patch antennas are popular due to their low profile, lightweight, and ease of fabrication.
• Example: GPS, mobile phone antennas, satellite communication systems.
• 3. Impedance Matching Networks
• Used to match RF sources to loads.
• Microstrip stubs, quarter-wave transformers are common tools.
• 4. Couplers and Power Dividers
• Microstrip lines implement directional couplers (e.g., Lange coupler) and Wilkinson power dividers.
• Example: Used in phased array radar for signal distribution.
• 5. Oscillators and Mixers
• Transmission line resonators based on microstrip lines are used in local oscillators.Example: PLL-based frequency synthesizers.

• 6. RF Filters
• Chebyshev and Butterworth bandpass filters can be realized using microstrip structures.

• Example: Used in 5G base stations and Wi-Fi routers.


Advantages of Microstrip Technology

Advantage Description

Planar Integration Can be fabricated with standard PCB or hybrid technology.

Compact Size Especially suitable for compact and portable systems.

Cost-Effective Lower manufacturing cost compared to waveguides.

Lightweight Important in aerospace, satellite, and mobile devices.

Ease of Prototyping Rapid development with PCB tools and materials.


When dominant mode is transmittedthrough a circular waveguide, the wave lenght
measured is to be 13.33 cm. The frequency of the microwave signal is 3.75 GHz.
Calculate a) cut off frequency b) Inner radius of guide c)Phase velosity d) group velocity
e) phase constant f) wave impedance g) bandwidth for operation in dominant mode only.

A circular waveguide has an internal diameter of 6 cm. For a 9 GHz signal propagated
init in the TE 11 mode, calculate cut-off frequency and characteristic impedance. [(ha
11 )’ = 1.84)]
A lossless air dielectric cylinderical waveguide whose inner diameter is 10 mm, and
f=1.3fc for TM01 mode. Find fc, guided wavelength, ZTM, phase velocity and group
velocity.
Given a circular waveguide used for a signal at afrequncy of 11GHz propagated in the
TE01 mode and the internal diameter is 4.5cm. determine (i) Cut-offwavelength (ii)
Guide wavelength (iii) group velocity (iv) Phase velocity (v) characteristic impedance
A Cylindrical copper tube of inside diameter 3cm is air filled. Calculate the cut off
frequencies in the TE10, TM10, TE11 and TM11 modes

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