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    CH 1

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    demos2011
    This document discusses MOS transistors and CMOS technology. It covers the basic operation of enhancement mode and depletion mode MOS transistors, including how a threshold voltage must be reached to form a channel between the source and drain. It also briefly mentions the design cycle for integrated circuits and some common IC processes like nMOS, CMOS, and BiCMOS.

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    CH 1

    Uploaded by

    demos2011
    48 views15 pages
    This document discusses MOS transistors and CMOS technology. It covers the basic operation of enhancement mode and depletion mode MOS transistors, including how a threshold voltage must be reached to form a channel between the source and drain. It also briefly mentions the design cycle for integrated circuits and some common IC processes like nMOS, CMOS, and BiCMOS.

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    Ch1

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    This document discusses MOS transistors and CMOS technology. It covers the basic operation of enhancement mode and depletion mode MOS transistors, including how a threshold voltage must be reached to form a channel between the source and drain. It also briefly mentions the design cycle for integrated circuits and some common IC processes like nMOS, CMOS, and BiCMOS.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    48 views15 pages

    CH 1

    Uploaded by

    demos2011
    This document discusses MOS transistors and CMOS technology. It covers the basic operation of enhancement mode and depletion mode MOS transistors, including how a threshold voltage must be reached to form a channel between the source and drain. It also briefly mentions the design cycle for integrated circuits and some common IC processes like nMOS, CMOS, and BiCMOS.

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    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 15

    Design cycle for MEMS

    Design cycle for ICs

    IC Pr ocess Selection

    nMOS CMOS BiCMOS ECL

    for logic for I/O and driver circuit for critical high speed parts of the system

    The Real Estate of a Wafer

    MOS Tr ansistor
    A tr ansistor is a thr ee-contact, thr ee-par t, two-junction device that per for ms as a switch or an amplifier .

    Switch analog Sour ce Emitter Gate Base

    MOS (Metal-Oxide-Semiconductor ) Tr ansistor

    Dr ain Collector Amplifier analog

    MOSFET (MOS field-effect) tr ansistor


    - nMOS (n-channel MOS) tr ansistor - pMOS (p-channel MOS) tr ansistor - CMOS (Complementar y MOS) tr ansistor

    Metal-oxide-semiconductor (MOS) Tr ansistor s


    The whole concept of MOS tr ansistor evolves fr om the use of a voltage on the gate to induce a char ge in the channel between sour ce and dr ain, which may then be caused to move fr om sour ce to dr ain under the electr ical field cr eated by voltage Vds applied between dr ain and sour ce.

    Enhancement mode:
    - A polysilicon gate is deposited on a layer of insulation over the region between source and drain. - If this gate is connected to a suitable positive voltage with respect to source, then the electric field is established between gate and substrate gives rise to a charge inversion region in the substrate under the gate insulation and a conducting channel is formed between source and drain

    Depletion mode:
    - By implanting suitable impurities in the region between the source and drain, the channel is present under the condition Vgs=0. - In this mode, source and drain are connected by a conducting channel, but the channel now is closed by applying a suitable negative voltage to the gate. In both modes, var iations of the gate voltage allow contr ol of any cur r ent flow between sour ce and dr ain.

    Fig1-4 shows the device in a non-conducting condition VD=Vs=Vgs=0

    Enhancement mode tr ansistor action


    a) Vgs > Vt , Vds= 0V
    The channel is established but no current flowing between source and drain (Vds=0)

    b)

    Vgs > Vt , Vds< Vgs Vt


    - When Vgs Vt >Vds> 0, The channel is established and a corresponding IR drop = Vds between the drain and source. - The voltage between gate and channel varying with distance along the channel with maximum of Vgs at the source end. - Since Vds< Vgs Vt, there is still voltage available to invert the channel at the drain end. => The device is in the non-saturated region of operation (current Isd can be still controlled by Vgs).

    c)

    Vgs > Vt , Vds> Vgs Vt


    - When Vds >Vgs Vt, there is insufficient electric field available to give rise to an inversion layer to create the channel. The channel is pinched off. Diffusion current completes the path from source to drain in this case, causing the channel to exhibit a high resistance and behavior as a constant current source. => The device is in the saturated region of operation

    In order to establish the channel in the first place, a minimum voltage level, called thr eshold voltage Vt , must be established between gate and source.

    Depletion mode tr ansistor action

    Under the condition Vgs=0, the channel is established because of the impurities implant in the region between the source and drain. In this mode, source and drain are connected by a conducting channel, but the channel now is closed by applying a suitable negative voltage to the gate.

    Tr ansistor Cir cuit Symbols

    CMOS
    n-channel MOS (nMOS) Complementary MOS (CMOS)

    p-channel MOS (pMOS)

    Basic MOS Cir cuits

    The whole concept of MOS tr ansistor evolves fr om the use of a voltage on the gate to induce a char ge in the channel between sour ce and dr ain, which may then be caused to move fr om sour ce to dr ain under the electr ical field cr eated by voltage Vds applied between dr ain and sour ce.

    The non-satur ated r egion

    Assume that the device is not saturated (Vds< Vgs-Vt) then the average voltage value on the substrate is Vds/2. Effective gate voltage:

    The satur ated r egion

    Gate Switching Speed

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