Sil Pad Selection Guide

Thermally Conductive Interface Materials for Cooling Electronic Assemblies
S E L E C T I O N
Sil-Pad
G U I D E
June 2011
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers' and manufacturers' only obligation shall be to replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer. Copyright 2011, The Bergquist Company. All rights reserved.
Table of Contents
Introduction Thermal Properties and Testing Interface Material Selection Guide Gap Pad Thermally Conductive Materials Gap Pad Comparison Data Frequently Asked Questions Gap Pad VO Gap Pad VO Soft Gap Pad VO Ultra Soft Gap Pad VO Ultimate Gap Pad 1000SF Gap Pad HC1000 Gap Pad 1500 Gap Pad 1500R Gap Pad 1500S30 Gap Pad A2000 Gap Pad 2000S40 Gap Pad 2200SF Gap Pad 2500S20 Gap Pad 2500 Gap Pad A3000 Gap Pad 3000S30 Gap Pad 5000S35 Gap Filler Comparison Data Frequently Asked Questions Gap Filler 1000 (Two-Part) Gap Filler 1100SF (Two-Part) Gap Filler 1500 (Two-Part) Gap Filler 2000 (Two-Part) Gap Filler 3500S35 (Two-Part) TIC Thermal Interface Compound Comparison Data and Frequently Asked Questions TIC 1000A TIC 4000 Hi-Flow Phase Change Interface Materials Hi-Flow Comparison Data Frequently Asked Questions Hi-Flow 105 Hi-Flow 225F-AC Hi-Flow 225UT Hi-Flow 225U Hi-Flow 625 Hi-Flow 300P Hi-Flow 300G Hi-Flow 565U Hi-Flow 565UT Hi-Flow 650P

2 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48
Sil-Pad Thermally Conductive Insulators Frequently Asked Questions Choosing Sil-Pad Thermally Conductive Insulators Mechanical, Electrical and Thermal Properties Sil-Pad Applications Sil-Pad Selection Table Sil-Pad Comparison Data Sil-Pad 400 Sil-Pad 800 Sil-Pad 900S Sil-Pad 980 Sil-Pad 1100ST Sil-Pad 1200 Sil-Pad A1500 Sil-Pad 1500ST Sil-Pad 2000 Sil-Pad A2000 Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 Q-Pad II Q-Pad 3 Poly-Pad 400 Poly-Pad 1000 Poly-Pad K-4 Poly-Pad K-10 Sil-Pad Tubes Sil-Pad Shield Bond-Ply and Liqui-Bond Adhesives Bond-Ply and Liqui-Bond Comparison Data Frequently Asked Questions Bond-Ply 100 Bond-Ply 400 Bond-Ply 660P Liqui-Bond SA 1000 (One-Part) Liqui-Bond SA 1800 (One-Part) Liqui-Bond SA 2000 (One-Part) Solutions for Surface Mount Applications Ordering Information Sil-Pad Configurations - Imperial Hi-Flow Configurations - Imperial Sil-Pad Configurations - Metric Hi-Flow Configurations - Metric Sil-Pad Shield Configurations - Imperial Notes

49 50 51 52 54 54 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 79 80 81 82 83 84 85 86 88 90 93 94 97 98 99
INTRODUCTION
World Leader in Thermal Management Through Technology, Innovation and Service

At Bergquist, developing high quality components for the electronics industry is our first priority. As a worldleading manufacturer with state-ofthe-art facilities, we serve a multitude of industries worldwide including automotive, computer, consumer electronics, lighting/LED, solar, military, motor control, power conversion, telecommunications and more. We make it our business to know your business. We understand your problems. We also know that there will always be a better way to help you reach your goals and objectives. To that end, our company continually invests considerable time and money into research and development. The Bergquist Company is focused on a single purpose discovering the need, then developing and delivering technologically advanced solutions backed by superior service.
Bergquist Takes the Heat
World Class Operations Around the Globe
Thermal Management Products Bergquist's Thermal Products Group is a worldleading developer and manufacturer of thermal management materials which provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Used by many of the worlds largest OEMs in various industries including automotive, computer, power supply, military and motor control, these materials include: Sil-Pad Thermally Conductive Insulators Bond-Ply and Liqui-Bond Thermally Conductive Adhesives Gap Filler Thermally Conductive Liquid Gap Filling Materials Gap Pad Thermally Conductive Gap Filling Materials Hi-Flow Phase Change Interface Materials TIC Thermal Interface Compounds Thermal Clad Insulated Metal Substrates
Worldwide Locations In the United States, the Thermal Products Groups 90,000 square-foot manufacturing facility is located in Cannon Falls, Minnesota. A 95,000 square-foot facility in Prescott, Wisconsin houses the Thermal Clad printed circuit board operations. A130,000 squarefoot facility in Chanhassen, Minnesota is the location for Bergquists corporate headquarters and state-of-the-art research and development facilities. A 36,000 square foot facility was built in Brandon, South Dakota to serve the growing demand for Bergquist thermal management materials.Worldwide, Bergquist has facilities in The Netherlands, Germany,Taiwan, South Korea, Hong Kong and China with sales representatives in 30 countries to support worldwide growth.
INTRODUCTION
A Legacy of IndustryLeading Technology
Research and Development at the Speed of Change
GAP PAD TIC
New Product Innovation For over 40 years, outstanding quality, innovation and engineering have been hallmarks of The Bergquist Company.Today, developing innovative products for the electronics industry remains our first priority. Bergquist has developed over 260 materials which provide thermal solutions for a wide variety of electronic applications. Many of our products were originally developed to satisfy a customer request for a specific material designed to perform to their particular specifications.This can do attitude and customized technology has earned The Bergquist Company its ISO 9001:2000 certification.
R&D Facilities Keeping pace in todays aggressive electronics industry demands continual anticipation of change and the ability to develop customerdriven solutions quickly and efficiently. Our Chanhassen headquarters features a state-of-the-art development laboratory and engineering department staffed with highly skilled chemical engineers, laboratory technicians and manufacturing engineers all dedicated to researching, developing and testing new materials. From such dedication have come many industry-standard proprietary products including Thermal Clad, Sil-Pad, Gap Pad, Gap Filler, Bond-Ply, Liqui-Bond,TIC and Hi-Flow materials.
HI--FLOW SIL-PAD BOND-PLY ORDERING

3
Thermal Properties and Testing

Thermal Conductivity
INTRODUCTION
The time rate of heat flow through a unit area producing a unit temperature difference across a unit thickness.
Thermal Resistance
The opposition to the flow of heat through a unit area of material across an undefined thickness.
Thermal conductivity is an inherent or absolute property of the material.
Thermal resistance varies with thickness.
Thermal Impedance
A property of a particular assembly measured by the ratio of the temperature difference between two surfaces to the steady-state heat flow through them.
Test Methods ASTM D5470
Factors affecting thermal impedance include: Area: Increasing the area of thermal contact decreases thermal impedance. Thickness: Increasing the insulator thickness increases thermal impedance. Pressure: Increasing mounting pressure under ideal conditions decreases thermal impedance. Time: Thermal impedance decreases over time. Measurement: Thermal impedance is affected by the method of temperature measurement. Thermal Impedance Per Bergquist TO-220 Thermal Performance (25 C Cold Plate Testing)
o
2 in. diameter stack (ref. 3.14 in2) 10-500 psi, 1 hour per layer
Interface Material Selection Guide

INTRODUCTION
T = Typical; AS = Application-Specific (contact Bergquist Sales); A = Available; * = Roll stock configurations are limited contact your Bergquist Sales Representative for more information. Note: For Hi-Flow 225UT, 225F-AC and Hi-Flow 565UT, the adhesive is not a pressure sensitive adhesive (PSA).
Gap Pad Thermally Conductive Materials
Solution-Driven Thermal Management Products for Electronic Devices A Complete Range of Choices for Filling Air Gaps and Enhancing Thermal Conductivity
The Bergquist Company, a world leader in thermal interface materials, developed the Gap Pad family to meet the electronic industrys growing need for interface materials with greater conformability, higher thermal performance and easier application. The extensive Gap Pad family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. Bergquist application specialists work closely with customers to specify the proper Gap Pad material for each unique thermal management requirement.
GAP PAD
Features
Each of the many products within the Gap Pad family is unique in its construction, properties and performance. Following is an overview of the important features offered by the Gap Pad family. Low-modulus polymer material Available with fiberglass/rubber carriers or in a non-reinforced version Special fillers to achieve specific thermal and conformability characteristics Highly conformable to uneven and rough surfaces Electrically isolating Natural tack on one or both sides with protective liner Variety of thicknesses and hardnesses Range of thermal conductivities Available in sheets and die-cut parts
Benefits
Gap Pad thermal products are designed to improve an assemblys thermal performance and reliability while saving time and money. Specifically: Eliminates air gaps to reduce thermal resistance High conformability reduces interfacial resistance Low-stress vibration dampening Shock absorbing Easy material handling Simplified application Puncture, shear and tear resistance Improved performance for high-heat assemblies Compatible with automated dispensing equipment
Options
Some Gap Pad products have special features for particular applications, including: Available with or without adhesive Rubber-coated fiberglass reinforcement Thicknesses from 0.010" to 0.250" Available in custom die-cut parts, sheets and rolls (converted or unconverted) Custom thicknesses and constructions Adhesive or natural inherent tack Silicone-free Gap Pad available in thicknesses of 0.010" - 0.125" Gap Fillers are well suited for automated dispensing We produce thousands of specials. Tooling charges vary depending on tolerance and complexity of the part.
Applications
Gap Pad products are well suited to a wide variety of electronics, automotive, medical, aerospace and military applications such as: Between an IC and a heat sink or chassis.Typical packages include BGAs, QFP, SMT power components and magnetics Between a semiconductor and heat sink CD-ROM/DVD cooling Heat pipe assemblies RDRAM memory modules DDR SDRAM Hard drive cooling Power supply IGBT modules Signal amplifiers Between other heat-generating devices and chassis
Gap Pad Comparison Data
Conductivity, Hardness and General Overview
GAP PAD
7
Frequently Asked Questions

Q: What thermal conductivity test method was used to A:
achieve the values given on the data sheets? A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: What is the thickness tolerance of your pads? A: The thickness tolerance is 10% on materials 10 mil and 1 mil
on materials 10 mil.
Q: Is Gap Pad offered with an adhesive? A: Currently, Gap Pad VO, Gap Pad VO Soft, and Gap Pad VO Ultra
Soft are offered with or without an adhesive on the Sil-Pad 800/900 carrier-side of the material.The remaining surface has natural inherent tack. All other Gap Pads have inherent tack.
Q: What are the upper processing temperature limits A:

for Gap Pad and for how long can Gap Pad be exposed to them? Gap Pad in general can be exposed to temporary processing temperatures of 250C for five minutes and 300C for one minute.
GAP PAD
Q: Is the adhesive repositionable? A: Depending on the surface being applied to, if care is taken, the
pad may be repositioned. Special care should be taken when removing the pad from aluminum or anodized surfaces to avoid tearing or delamination.
Q: Is Gap Pad electrically isolating? A: Yes, all Gap Pad materials are electrically isolating. However,
keep in mind that Gap Pad is designed to FILL gaps and it is not recommended for applications where high mounting pressure is exerted on the Gap Pad.
Q: What is meant by natural tack? A: The characteristic of the rubber itself has a natural inherent tack,
with the addition of an adhesive. As with adhesive-backed products, the surfaces with natural tack may help in the assembly process to temporarily hold the pad in place while the application is being assembled. Unlike adhesive-backed products, inherent tack does not have a thermal penalty since the rubber itself has the tack.Tack strength varies from one Gap Pad product to the next.
Q: How much force will the pad place on my device? A: Refer to the Pressure vs. Deflection charts in Bergquist
Application Note #116. In addition, there are other helpful resources online at www.bergquistcompany.com.
Q: Why are wet out, compliance or conformability

characteristics of Gap Pad important?
A: The better a Gap Pad lays smooth "wets out" or conforms to a

rough or stepped surface, giving less interfacial resistance caused by air voids and air gaps. Gap Pads are conformable or compliant as they adhere very well to the surface.The Gap Pads can act similar to a "suction cup" on the surface.This leads to a lower overall thermal resistance of the pad between the two interfaces.
Q: Can Gap Pad with natural tack be repositioned? A: Depending on the material that the pad is applied to, in most
cases they are repositionable. Care should be taken when removing the pad from aluminum or anodized surfaces to avoid tearing or delaminating the pad.The side with the natural tack is always easier to reposition than an adhesive side.
Q: Is anything given off by the material

(e.g. extractables, outgassing)?
Q: Is Gap Pad reworkable? A: Depending on the application and the pad being used, Gap Pad
has been reworked in the past. Bergquist has customers that are currently using the same pad for reassembling their applications after burn-in processes and after fieldwork repairs. However, this is left up to the design engineer's judgment as to whether or not the Gap Pad will withstand reuse.
A: 1) Silicone Gap Pad and Gap Fillers, like all soft silicone materials,
can extract low molecular weight silicone (refer to White Paper on Gap Pad S-Class). Also note that Gap Pad and Gap Filler have some of the lowest extraction values for silicone-based gap filling products on the market and if your application requires minimal silicone, see our line of Sil-Free material. 2) Primarily for aerospace applications, outgassing data is tested per ASTM E595.
Q: Will heat make the material softer? A: From -60C to 200C, there is no significant variance in hardness
for silicone Gap Pads and Gap Fillers.
Q: Why does the data sheet describe the hardness rating

as a bulk rubber hardness?
Q: What is the shelf life of Gap Pad? A: Shelf life for most Gap Pads is one (1) year after the date of
manufacture. For Gap Pad with adhesive the shelf life is six (6) months from the date of manufacture. After these dates, inherent tack and adhesive properties should be recharacterized.The Gap Pad material long-term stability is not the limiter on the shelf-life; it is related to the adhesion or "age up" of the Gap Pad to the liner. Or in the case of a Gap Pad with adhesive, the shelf life is determined by how the adhesive ages up to the removable liner.
A: A reinforcement carrier is generally utilized in Bergquist Gap Pads

for ease of handling.When testing hardness, the reinforcement carrier can alter the test results and incorrectly depict thinner materials as being harder.To eliminate this error, a 250 mil rubber puck is molded with no reinforcement carrier.The puck is then tested for hardness.The Shore hardness is recorded after a 30 second delay.
Q: How is extraction testing performed? A: The test method used is the Soxhlet Extraction Method, please
refer to Gap Pad S-Class White Paper.
Gap Pad VO
Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits
Thermal conductivity: 0.8 W/m-K Enhanced puncture, shear and tear resistance Conformable gap filling material Electrically isolating
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Inherent Surface Tack (1 sided) Density (Bulk Rubber) (g/cc) Heat Capacity (J/g-K) Hardness (Bulk Rubber) (Shore 00) (1) Young's Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs. STRAIN Deflection (% strain) Thermal Impedance (C-in2/W) 0.040" (3) 10 2.47 20 2.37 30 2.24
TYPICAL PROPERTIES OF GAP PAD VO

IMPERIAL VALUE Gold/Pink Sil-Pad 0.020 to 0.250 1 1.6 1.0 40 100 -76 to 392 >6000 5.5 1011 V-O 0.8 METRIC VALUE Gold/Pink Sil-Pad 0.508 to 6.350 1 1.6 1.0 40 689 -60 to 200 >6000 5.5 1011 V-O 0.8 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
GAP PAD
Gap Pad VO is a cost-effective, thermally conductive interface material.The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling.The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.
Note: Resultant thickness is defined as the final gap thickness of the application.
Thickness vs. Thermal Resistance Gap Pad VO
Resultant Thickness (mils)
1) Thir ty second delay value Shore 00 hardness scale. 2)Youngs Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch 2. 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include:

Telecommunications Computer and peripherals Power conversion Between heat-generating semiconductors and a heat sink Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader Between heat-generating magnetic components and a heat sink
250 200 150 100 50 0 1 3 5 7 9 11 Thermal Resistance (C-in2/W) 13
Configurations Available:
Sheet form and die-cut parts
Building a Part Number

GPVO 0.040 AC 0816 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16" or 00 = custom configuration AC = Adhesive on Sil-Pad side, natural tack on one side 01 = No pressure sensitive adhesive, natural tack on one side Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250" GPVO = Gap Pad VO Material
Section A
Section B
Section C
Note: To build a part number, visit our website at www.bergquistcompany.com.
Section D
Gap Pad VO Soft
Highly Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits
Thermal conductivity: 0.8 W/m-K Conformable, low hardness Enhanced puncture, shear and tear resistance Electrically isolating
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Inherent Surface Tack (1 side) Density (Bulk Rubber) (g/cc) Heat Capacity (J/g-K) Hardness (Bulk Rubber) (Shore 00) (1)
TYPICAL PROPERTIES OF GAP PAD VO SOFT

IMPERIAL VALUE Mauve/Pink Sil-Pad 0.020 to 0.200 1 1.6 1.0 25 40 -76 to 392 >6000 5.5 1011 V-O 0.8 METRIC VALUE Mauve/Pink Sil-Pad 0.508 to 5.080 1 1.6 1.0 25 275 -60 to 200 >6000 5.5 1011 V-O 0.8 10 2.48 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 20 2.29 30 2.11
GAP PAD
Young's Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs. STRAIN
Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low-modulus, filled-silicone polymer on a rubber-coated fiberglass carrier.The material can be used as an interface where one side is in contact with a leaded device.
Thickness vs. Thermal Resistance Gap Pad VO Soft 200 180 160 140 120 100 80 60 40 20 1 2 3 4 5 6 7 8 9 Thermal Resistance (C-in2/W) 10
Deflection (% strain) Thermal Impedance (C-in2/W) 0.040" (3)

Telecommunications Computer and peripherals Power conversion Between heat-generating semiconductors or magnetic components and a heat sink Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader

GPVOS 0.060 AC 00 ACME10256 Rev. a
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration AC = Adhesive on Sil-Pad side, natural tack on one side 01 = No pressure sensitive adhesive, natural tack on one side Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200" GPVOS = Gap Pad VO Soft Material
Section A
Section B
Section C
10
Section D
Gap Pad VO Ultra Soft
Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits
Thermal conductivity: 1.0 W/m-K Highly conformable, low hardness Gel-like modulus Decreased strain Puncture, shear and tear resistant Electrically isolating TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Inherent Surface Tack (1 sided) Density (Bulk Rubber) (g/cc) Heat Capacity (J/g-K) Hardness (Bulk Rubber) (Shore 00) (1) Young's Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs. STRAIN IMPERIAL VALUE Mauve/Pink Fiberglass 0.020 to 0.250 1 1.6 1.0 5 8 -76 to 392 6000 5.5 1011 V-0 1.0 METRIC VALUE Mauve/Pink Fiberglass 0.508 to 6.350 1 1.6 1.0 5 55 -60 to 200 6000 5.5 1011 V-0 1.0 10 1.97 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 20 1.87 30 1.68
GAP PAD
Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components.The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Gap Pad VO Ultra Soft is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
Thickness vs. Thermal Resistance Gap Pad VO Ultra Soft

Telecommunications Computer and peripherals Power conversion Between heat-generating semiconductors or magnetic components and a heat sink Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
250 200 150 100 50 0 1 2 3 4 5 6 7 8 9 Thermal Resistance (C-in2/W) 10

GPVOUS 0.100 AC 0816 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration AC = Adhesive on Sil-Pad side, natural tack on one side 01 = No pressure sensitive adhesive, natural tack on one side Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250" GPVOUS = Gap Pad VO Ultra Soft Material
Section A
Section B
Section C
Section D
11
Gap Pad VO Ultimate
Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material Features and Benefits
Thermal conductivity: 1.3 W/m-K Ultra conformability Gel-like modulus Excellent rebound Decreased strain Remarkable handling Electrically isolating TYPICAL PROPERTIES OF GAP PAD VO ULTIMATE
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Inherent Surface Tack (1 side) Density (Bulk Rubber) (g/cc) Heat Capacity (J/g-K) Hardness (Bulk Rubber) (Shore 00) (1) Young's Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs. STRAIN IMPERIAL VALUE Gray/Black Fiberglass 0.020 to 0.125 1 1.8 1.0 30 13 -76 to 392 6000 5.0 109 V-O 1.3 METRIC VALUE Gray/Black Fiberglass 0.508 to 3.175 1 1.8 1.0 30 90 -60 to 200 6000 5.0 109 V-O 1.3 10 1.60 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 20 1.55 30 1.46
GAP PAD
Gap Pad VO Ultimate is a robust, highly compliant product that is ideal for both small and large gap designs.The fiberglass carrier on one side of the material allows ease of rework, excellent handling characteristics and puncture resistance. Additionally the fiberglass carrier has a slight inherent tack, minimizing any shifting during assembly. The conformable and elastic nature of Gap Pad VO Ultimate allows excellent interfacing and wetout characteristics, even to surfaces with a high degree of roughness or uneven topography. The construction of Gap Pad VO Ultimate; one side has high inherent tack, while the other side has minimal tack.This combination is useful for manual and automated processes.
Thickness vs. Thermal Resistance Gap Pad VO Ultimate 140 120 100 80 60 40 20 0 0.61 1.21 1.82 2.42 3.03 3.79 Thermal Resistance (C-in2/W)
Typical Applications:
Various IC packages Thermally enhanced BGA packages Between any heat-generating semiconductor and a heat sink Computers and peripherals
Telecommunications Power conversion Automotive LED lighting packages

GPVOU 0.020 01 0816
Standard Options
0.020", 0.040", 0.060"
12
Gap Pad 1000SF
Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits

Thermal conductivity: 0.9 W/m-K No silicone outgassing No silicone extraction Reduced tack on one side to aid in application assembly Electrically isolating
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Inherent Surface Tack (1- or 2-sided) Density (g/cc) Heat Capacity (J/g-K) Hardness, Bulk Rubber (Shore 00) (1) Youngs Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K)
TYPICAL PROPERTIES OF GAP PAD 1000SF

IMPERIAL VALUE Green Fiberglass 0.010 to 0.125 2 2.0 1.1 40 34 -76 to 257 >6000 5.0 1010 V-1 0.9 METRIC VALUE Green Fiberglass 0.254 to 3.175 2 2.0 1.1 40 234 -60 to 125 >6000 5.0 1010 V-1 0.9 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
GAP PAD
The new Gap Pad 1000SF is a thermally conductive, electrically insulating, siliconefree polymer specially designed for silicone-sensitive applications.The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF is reinforced for easy material handling and added durability during assembly.The material is available with a protective liner on both sides of the material.The topside has reduced tack for ease of handling.
Thickness vs. Thermal Resistance Gap Pad 1000SF
1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116.

Digital disk drives / CD-ROM Automotive modules Fiber optics modules
Sheet form Die-cut parts

GP1000SF 0.010 02 0816 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0806: = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125"
Section C
Section A
125 100 75 50 25 0 0 1 2 3 4 Thermal Resistance (C-in2/W) 5
Section D
Section B
GP1000SF = Gap Pad 1000SF Material
13
Gap Pad HC1000
Gel-Like Modulus Gap Filling Material Features and Benefits

Thermal conductivity: 1.0 W/m-K Highly conformable, low hardness Gel-like modulus Fiberglass reinforced for puncture, shear and tear resistance
TYPICAL PROPERTIES OF GAP PAD HC1000

IMPERIAL VALUE Gray Fiberglass 0.010 to 0.020 2 1.6 1.0 25 40 -76 to 392 >5000 5.5 1011 V-O 1.0 METRIC VALUE Gray Fiberglass 0.254 to 0.508 2 1.6 1.0 25 275 -60 to 200 >5000 5.5 1011 V-O 1.0 10 1.30 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 20 1.00 30 0.96
GAP PAD
Young's Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K)
Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks.The gel-like modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad HC1000 is offered with removable protective liners on both sides of the material.
Thickness vs. Thermal Resistance Gap Pad HC1000
THERMAL PERFORMANCE vs. STRAIN Deflection (% strain) Thermal Impedance (C-in2/W) 0.020" (3)

Computer and peripherals Telecommunications Heat interfaces to frames, chassis, or other heat spreading devices RDRAM memory modules / chip scale packages CDROM / DVD cooling Areas where irregular surfaces need to make a thermal interface to a heat sink DDR SDRAM memory modules FBDIMM modules
20 18 16 14 12 10 0.25 0.30 0.35 0.40 0.45 0.50 Thermal Resistance (C-in2/W) 0.55
Sheet form, die-cut parts, and roll form (converted or unconverted)

HC1000 0.015 02 0816 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020" HC1000 = High Compliance 1000 Material
Section A
Section B
Section C
14
Section D
Gap Pad 1500
Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits

Thermal conductivity: 1.5 W/m-K Un-reinforced construction for additional compliancy Conformable, low hardness Electrically isolating
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Inherent Surface Tack (1 sided) Density (Bulk Rubber) (g/cc) Heat Capacity (J/g-K) Hardness (Bulk Rubber) (Shore 00) (1) Young's Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K)
TYPICAL PROPERTIES OF GAP PAD 1500

IMPERIAL VALUE Black 0.020 to 0.200 2 2.1 1.0 40 45 -76 to 392 >6000 5.5 1011 V-O 1.5 METRIC VALUE Black 0.508 to 5.080 2 2.1 1.0 40 310 -60 to 200 >6000 5.5 1011 V-O 1.5 10 1.62 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 20 1.50 30 1.33
GAP PAD
Gap Pad 1500 has an ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.
Thickness vs. Thermal Resistance Gap Pad 1500

Telecommunications Computer and peripherals Power conversion RDRAM memory modules / chip scale packages Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
200 150 100 50 0 0 1 2 3 4 5 Thermal Resistance (C-in2/W) 6

GP1500 0.100 02 0816 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200" GP1500 = Gap Pad 1500 Material
Section A
Section B
Section C
Section D
15
Gap Pad 1500R
Thermally Conductive, Reinforced Gap Filling Material Features and Benefits

Thermal conductivity: 1.5 W/m-K Fiberglass reinforced for puncture, shear and tear resistance Easy release construction Electrically isolating
TYPICAL PROPERTIES OF GAP PAD 1500R

IMPERIAL VALUE Black Fiberglass 0.010 to 0.020 2 2.1 1.3 40 45 -76 to 392 >6000 6.0 1011 V-O 1.5 METRIC VALUE Black Fiberglass 0.254 to 0.508 2 2.1 1.3 40 310 -60 to 200 >6000 6.0 1011 V-O 1.5 10 1.07 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 20 0.88 30 0.82
GAP PAD
Young's Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K)
Gap Pad 1500R has the same highly conformable, low-modulus polymer as the standard Gap Pad 1500.The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance.The natural tack on both sides of the material allows for good compliance to mating surfaces of components, further reducing thermal resistance.
Thickness vs. Thermal Resistance Gap Pad 1500R

Telecommunications Computer and peripherals Power conversion RDRAM memory modules / chip scale packages Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
20 18 16 14 12 10 0.25 0.30 0.35 0.40 0.45 0.50 Thermal Resistance (C-in2/W) 0.55
Sheet form, die-cut parts, and roll form (converted or unconverted)

GP1500R 0.020 02 00 ACME10256 Rev. A
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020" GP1500R = Gap Pad 1500R Material
Section C
Section A
Section B
16
Section D
Gap Pad 1500S30
Highly Conformable,Thermally Conductive, Reinforced S-Class Gap Filling Material Features and Benefits
Thermal conductivity: 1.3 W/m-K Highly conformable / low hardness Decreased strain on fragile components Fiberglass reinforced for puncture, shear and tear resistance Quick rebound to original shape
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Inherent Surface Tack (1 side) Density (Bulk Rubber) (g/cc) Heat Capacity (J/g-K) Hardness (Bulk Rubber) (Shore 00) (1) Young's Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs. STRAIN
TYPICAL PROPERTIES OF GAP PAD 1500S30

IMPERIAL VALUE Light Pink Fiberglass 0.020 to 0.250 2 1.8 1.0 30 16 -76 to 392 >6000 5.0 1011 V-O 1.3 METRIC VALUE Light Pink Fiberglass 0.508 to 6.350 2 1.8 1.0 30 110 -60 to 200 >6000 5.0 1011 V-O 1.3 10 1.69 TEST METHOD Visual ASTM D374 ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 20 1.41 30 1.26
GAP PAD
Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad 1500S30 maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. Gap Pad 1500S30 features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.
Thickness vs. Thermal Resistance Gap Pad 1500S30 250 200 160 125 100 80 60 40 20 0
Any heat-generating component and a heat sink Computers and peripherals Telecommunications Between any heat-generating semiconductor and a heat sink Shielding devices

GP1500S30 0.020 02 0816
Standard Options
0816 = Standard sheet size 8" x 16", or

0.61 1.21 1.82 2.42 3.03 3.79 4.85 Thermal Resistance (C-in2/W) 6.06 7.57
02 = Natural tack, both sides 0.020", 0.040", 0.060" 0.080", 0.100", 0.125", 0.160", 0.200", 0.250" GP1500S30 = Gap Pad 1500S30 Material
17
Gap Pad A2000
High Performance,Thermally Conductive Gap Filling Material Features and Benefits

Thermal conductivity: 2.0 W/m-K Fiberglass reinforced for puncture, shear and tear resistance Electrically isolating
TYPICAL PROPERTIES OF GAP PAD A2000

IMPERIAL VALUE Gray Fiberglass 0.010 to 0.040 2 2.9 1.0 80 55 -76 to 392 >4000 6.0 1011 V-O 2.0 METRIC VALUE Gray Fiberglass 0.254 to 1.016 2 2.9 1.0 80 379 -60 to 200 >4000 6.0 1011 V-O 2.0 10 1.04 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 20 1.00 30 0.95
GAP PAD
Young's Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs. STRAIN
Gap Pad A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components.The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.
Thickness vs. Thermal Resistance Gap Pad A2000 40 35 30 25 20 15 10 0 0.20

Computer and peripherals; between CPU and heat spreader Telecommunications Heat pipe assemblies RDRAM memory modules CDROM / DVD cooling Areas where heat needs to be transferred to a frame chassis or other type of heat spreader DDR SDRAM memory modules
0.30 0.40 0.50 0.60 0.70 Thermal Resistance (C-in2/W)
0.80
Sheet form, die-cut parts and roll form (converted or unconverted)
Building a Part Number Standard Options

GPA2000 0.010 02 0816 NA
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020" 0.040" GPA2000 = Gap Pad A2000 Material
18
Gap Pad 2000S40
Thermal conductivity: 2.0 W/m-K Low S-Class thermal resistance at very low pressures Highly conformable, low hardness Designed for low-stress applications Fiberglass reinforced for puncture, shear and tear resistance
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Inherent Surface Tack (1 side) Density (Bulk Rubber) (g/cc) Heat Capacity (J/g-K) Hardness (Bulk Rubber) (Shore 00) (1) Young's Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs. STRAIN Deflection (% strain) Thermal Impedance (C-in2/W) 0.040" (3) 10 0.97 20 0.89 30 0.80

IMPERIAL VALUE Gray Fiberglass 0.020 to 0.125 2 2.9 0.6 30 45 -76 to 392 >5000 6.0 1011 V-O 2.0 METRIC VALUE Gray Fiberglass 0.508 to 3.175 2 2.9 0.6 30 310 -60 to 200 >5000 6.0 1011 V-O 2.0 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
GAP PAD
Gap Pad 2000S40 is recommended for lowstress applications that require a mid to high thermally conductive interface material.The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. Gap Pad 2000S40 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly.The material is supplied with protective liners on both sides.The top side has reduced tack for ease of handling.
Thickness vs. Thermal Resistance Gap Pad 2000S40

Power electronics DC/DC; 1/4, 1/2, full bricks, etc. Mass storage devices Graphics card/processor/ASIC Wireline/wireless communications hardware Automotive engine/transmission controls

GP2000S40 0.020 02 0816 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides
Section A
Section B
Section C
100 75 50 25 0 0.20 0.50 1.00 1.50 2.00 Thermal Resistance (C-in2/W) 2.50
Section D
125
Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" GP2000S40 = Gap Pad 2000S40 Material
19
Gap Pad 2200SF
Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits

Thermal conductivity: 2.0 W/m-K Silicone-free formulation Medium compliance with easy handling Electrically isolating
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Inherent Surface Tack (1 or 2 sided) Density (g/cc) Heat Capacity (J/g-K) Hardness, Bulk Rubber (Shore 00) (1)
TYPICAL PROPERTIES OF GAP PAD 2200SF

IMPERIAL VALUE Green Fiberglass 0.010 to 0.125 2 2.8 1.0 70 33 -76 to 257 >5000 6.0 108 V-O 2.0 METRIC VALUE Green Fiberglass 0.254 to 3.175 2 2.8 1.0 70 228 -60 to 125 >5000 6.0 108 V-O 2.0 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
GAP PAD
Youngs Modulus (psi) / (kPa) (2) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K)
Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications.The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad 2200SF is reinforced for easy material handling and added durability during assembly.The material is available with a protective liner on both sides. Gap Pad 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework.
140 Gap Pad 2200SF
1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116.
Digital disk drives Proximity near electrical contacts (e.g. DC brush motors, connectors, relays) Fiber optics modules
Sheet form Die-cut parts Standard sheet size is 8" x 16"
Building a Part Number Standard Options

GP2200SF 0.010 02 0816 NA
Section B
Section C
Section D
0.5
1.0
1.5
2.0
2.5
Section A
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" GP2200SF = Gap Pad 2200SF Material
20
Gap Pad 2500S20
Thermal conductivity: 2.4 W/m-K Low S-Class thermal resistance at ultra-low pressures Ultra conformable,gel-like modulus Designed for low-stress applications Fiberglass reinforced for puncture, shear and tear resistance

IMPERIAL VALUE Light Yellow Fiberglass 0.010 to 0.250 2 3.1 1.0 20 5 -76 to 392 >3000 6.6 1011 V-O 2.4 METRIC VALUE Light Yellow Fiberglass 0.254 to 6.350 2 3.1 1.0 20 35 -60 to 200 >3000 6.6 1011 V-O 2.4 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
GAP PAD
Gap Pad 2500S20 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K.The material is a filled-polymer material yielding extremely soft, elastic characteristics.The material is reinforced to provide easy handling, converting, added electrical isolation and tear resistance. Gap Pad 2500S20 is well suited for low-pressure applications that typically use fixed standoff or clip mounting.The material maintains a conformable, yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. Gap Pad 2500S20 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly.The material is supplied with protective liners on both sides.The top side has reduced tack for ease of handling.
Thickness vs. Thermal Resistance Gap Pad 2500S20 250 200 160 125 100 80 60 40 20 0
Typical Applications
Between processors and heat sinks Between graphics chips and heat sinks DVD and CDROM electronics cooling Areas where heat needs to be transferred to a frame, chassis or other type of heat spreader

GP2500S20 0.100 02 00 ACME 89302 Rev a
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250" GP2500S20 = Gap Pad 2500S20 Material
Section C
Section A
Section B
.33
.66
.99 1.31 1.64 2.05 2.63 3.28 Thermal Resistance (C-in2/W)
4.10
Section D
21
Gap Pad 2500
Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits

Thermal conductivity: 2.7 W/m-K High thermal performance, cost-effective solution Un-reinforced construction for additional compliancy Medium compliancy and conformability

IMPERIAL VALUE Light Brown 0.020 to 0.125 2 3.1 1.0 80 113 -76 to 392 >6000 6.8 1011 V-O 2.7 METRIC VALUE Light Brown 0.508 to 3.175 2 3.1 1.0 80 779 -60 to 200 >6000 6.8 1011 V-O 2.7 10 0.74 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 20 0.62 30 0.61
GAP PAD
Gap Pad 2500 is a thermally conductive, electrically insulating, un-reinforced gap filling material. Gap Pad 2500 is a filled-polymer material yielding an elastic polymer that allows for easy handling and converting without the need for reinforcement.These properties also allow for good wet-out and interfacing characteristics to surfaces with roughness and/or topography. All these characteristics make this material ideal for applications using either clip or screw-mounted assemblies. Gap Pad 2500 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly.The material is supplied with protective liners on both sides.
Thickness vs. Thermal Resistance Gap Pad 2500

Multiple heat-generating components to a common heat sink Graphics chips to heat sinks Processors to heat sinks Mass storage drives Wireline / wireless communications hardware

GP2500 0.100 02 00 ACME 89302 Rev a
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125"
Section B
120 100 80 60 40 20 0 0.20
0.60 1.00 1.40 1.80 Thermal Resistance (C-in2/W)
Section D
Section A
Section C
GP2500 = Gap Pad 2500 Material
22
Gap Pad A3000
Thermally Conductive, Reinforced Gap Filling Material Features and Benefits

Thermal conductivity: 2.6 W/m-K Fiberglass reinforced for puncture, shear and tear resistance Reduced tack on one side to aid in application assembly Electrically isolating

IMPERIAL VALUE Gold Fiberglass 0.015 to 0.125 1 3.2 1.0 80 50 -76 to 392 >5000 7.0 1010 V-O 2.6 METRIC VALUE Gold Fiberglass 0.381 to 3.175 1 3.2 1.0 80 344 -60 to 200 >5000 7.0 1010 V-O 2.6 10 0.78 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 20 0.73 30 0.68
GAP PAD
Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad A3000 has a reinforcement layer on the dark gold side of the material that assists in burn-in and rework processes while the light gold and soft side of the material allows for added compliance.
Thickness vs. Thermal Resistance Gap Pad A3000

Computer and peripherals Telecommunications Heat pipe assemblies RDRAM memory modules CDROM / DVD cooling Between CPU and heat spreader Area where heat needs to be transferred to a frame, chassis or other type of heat spreader
Sheet form, die-cut parts and roll form (converted or unconverted)
125 115 95 75 55 35

GPA3000 0.015 01 0816 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 01 = Natural tack, one side Standard thicknesses available: 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" GPA3000 = Gap Pad A3000 Material
Section C
Section A
Section B
0.10 0.30 0.50 0.70 0.90 1.10 1.30 1.50 1.70 Thermal Resistance (C-in2/W)
Section D
23
Gap Pad 3000S30
Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material Features and Benefits
Thermal conductivity: 3.0 W/m-K Low S-Class thermal resistance at very low pressures Highly conformable,S-Class softness Designed for low-stress applications Fiberglass reinforced for puncture, shear and tear resistance

IMPERIAL VALUE Light Blue Fiberglass 0.010 to 0.125 2 3.2 1.0 30 26 -76 to 392 >3000 7.0 10 9 V-O 3.0 METRIC VALUE Light Blue Fiberglass 0.254 to 3.175 2 3.2 1.0 30 180 -60 to 200 >3000 7.0 10 9 V-O 3.0 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
GAP PAD
Gap Pad 3000S30 is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an allnew 3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. Gap Pad 3000S30 maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. Gap Pad 3000S30 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers.The materials natural inherent tack allows for stick-in-place characteristics during assembly. Gap Pad 3000S30 is supplied with protective liners on both sides.The top side has reduced tack for ease of handling.
Thickness vs. Thermal Resistance Gap Pad 3000S30
130 110 90 70 50 30 10
Processors Notebook computers Server S-RAMs BGA packages Mass storage drives Power conversion Wireline / wireless communications hardware
Sheet form and die-cut parts available

GP3000S30 0.020 02 0816 ACME 89302 Rev a
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" GP3000S30 = Gap Pad 3000S30 Material
Section A
Section B
Section C
0.10 0.30 0.50 0.70 0.90 1.10 1.30 1.50 1.70 Thermal Resistance (C-in2/W)
24
Section D
Gap Pad 5000S35
High thermal conductivity plus S-Class softness and conformability Features and Benefits
High thermal conductivity: 5 W/m-K Highly conformable,S-Class softness Natural inherent tack reduces interfacial thermal resistance Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads Fiberglass reinforced for puncture, shear and tear resistance Excellent thermal performance at low pressures

IMPERIAL VALUE Light Green Fiberglass 0.020 to 0.125 2 3.6 1.0 35 17.5 -76 to 392 >5000 7.5 109 V-O 5.0 METRIC VALUE Light Green Fiberglass 0.508 to 3.175 2 3.6 1.0 35 121 -60 to 200 >5000 7.5 109 V-O 5.0 TEST METHOD Visual ASTM D374 ASTM D792 ASTM E1269 ASTM D2240 ASTM D575 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
GAP PAD
Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity.The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance.The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance.The top side has reduced tack for ease of handling. Gap Pad 5000S35 is ideal for high-performance applications at low mounting pressures.
CDROM / DVD ROM Voltage Regulator Modules ( VRMs) and POLs Thermally-enhanced BGAs
Memory packages / modules PC Board to chassis ASICs and DSPs
Die-cut parts are available in any shape or size, separated or in sheet form
Standard Options
25
Liquid Dispensable Gap Filler Materials

Introduction Effective thermal management is key to ensuring consistent performance and long term reliability of many electronic devices. With the wide variety of applications requiring thermal management, the need for alternative thermal material solutions and innovative material placement methods continues to grow. In response, Bergquist has developed a family of dispensable liquid polymer materials with unique characteristics especially designed for ultimate thermal management design and component assembly flexibility. Two-Part Gap Fillers Bergquist two-part, cure-in-place materials are dispensed as a liquid onto the target surface. As the components are assembled, the material will wet-out to the adjacent surfaces, filling even the smallest gaps and air voids. Once cured, the material remains a flexible and soft elastomer, designed to assist in relieving coefficient of thermal expansion (CTE) mismatch stresses during thermal cycling. Gap Filler is ideally suited for applications where pads cannot perform adequately, can be used to replace grease or potting compounds and is currently used in power supply, telecom, digital, and automotive applications. Liquid Gap Filler Key Performance Benefits Ultra Low Modulus: Minimal Stress During Assembly Because Gap Filler is dispensed and wet-out in its liquid state, the material will create virtually zero stress on components during the assembly process. Gap Filler can be used to interface even the most fragile and delicate devices. Excellent Conformability to Intricate Geometries Liquid Gap Filler materials are able to conform to intricate topographies, including multi-level surfaces. Due to its increased mobility prior to cure, Gap Filler can fill small air voids, crevices, and holes, reducing overall thermal resistance to the heat generating device.
GAP PAD
Gap Filler solutions provide easy dispensing and efficient heat transfer in electronic applications
Single Solution for Multiple Applications Unlike pre-cured gap filling materials, the liquid approach offers infinite thickness options and eliminates the need for specific pad thicknesses or die-cut shapes for individual applications. Efficient Material Usage Manual or semi-automatic dispensing tools can be used to apply material directly to the target surface resulting in effective use of material with minimal waste. Further maximization of material usage can be achieved with implementation of automated dispensing equipment, which allows for precise material placement and reduces the application time of the material. Customizable Flow Characteristics Although Gap Fillers are designed to flow easily under minimal pressure, they are thixotropic in nature which helps the material remain in place after dispensing and prior to cure. Bergquist Gap Filler offerings include a range of rheological characteristics and can be tailored to meet customer specific flow requirements from self-leveling to highly thixotropic materials that maintain their form as dispensed.
26

Q: How is viscosity measured? A: Due to the thixotropic characteristics of most Gap Fillers, special
consideration should be given to the test method(s) used to determine viscosity of these materials. Because the material viscosity is dependent on shear rate, different measurement equipment testing under varying shear rates will produce varied viscosity readings.When comparing apparent viscosities of multiple materials, it is important to ensure that the data was generated using the same test method and test conditions (therefore the same shear rate). Bergquist test methods and conditions are noted in the individual product data sheets.
Q: What container sizes are available for Gap Fillers? A: Two-part materials are available in several standard dual cartridge
sizes including 50cc (25cc each of parts A and B) and 400cc (200 cc each of parts A and B). Gap fillers are also available in kits of 1200cc (two stand-alone 600cc containers, one of each part) and 10-gallon (two 5-gallon pails, one of each part) sizes for higher volume production. Other special and custom container sizes are available upon request.
Q: How do I mix the two-part Gap Fillers? A: Disposable plastic static mixing nozzles are used to mix parts A
and B together at the desired ratio. Static mixers can be attached to the ends of cartridges or mounted on automated dispensing equipment.They are reliable, accurate and inexpensive to replace after extended down times. Unless otherwise indicated, mixing nozzles with a minimum of 21 mixing elements are recommended to achieve proper mixing.
GAP PAD
Q: How are Pot Life and Cure Time Defined? A: Two-part Gap Filler systems begin curing once the two components are mixed together. Bergquist defines the pot life (working life) of a two-part system as the time for the viscosity to double after parts A and B are mixed. Bergquist defines the cure time of a two-part material as the time to reach 90% cure after mixing.Two-part Gap Fillers will cure at room temperature (25C), or cure time can be accelerated with exposure to elevated temperatures.
Q: What is the tolerance on the mix ratio? A: Two-part materials should be mixed to the stated mix ratio by
volume within a +/-5% tolerance to ensure proper material characteristics. If light colored streaks or marbling are present in the material, there has been inadequate mixing. Bergquist recommends purging newly tapped containers through the static mixer until a uniform color is achieved. In order to ensure consistent material characteristics and performance, Bergquist two-part systems are to be used with matching part A and B lot numbers.
Q: Can I use my Gap Filler after the shelf life has expired? A: Bergquist does not advocate using Gap Filler beyond the recommended shelf life and is unable to recertify material that has expired. In order to ensure timely use of product, Bergquist recommends a first-in-first-out (FIFO) inventory system.
Q: How should I store my Gap Filler? A: Unless otherwise indicated on product data sheets, two-part Gap
Fillers should be stored in the original sealed container in a climate controlled environment at or below 25C and 50% Relative Humidity. If stored at reduced temperatures, materials should be placed at room temperature and allowed to stabilize prior to use. Unless otherwise noted, all cartridges and tubes should be stored in Bergquist defined packaging with the nozzle end down.
Q: What options are available for dispensing material

onto my application?
A: Bergquist can provide manual or pneumatic applicator guns for

product supplied in dual cartridge form. Gap Filler supplied in high volume container kits can be dispensed via automated dispensing equipment for high-speed in-line manufacturing. Bergquist has aligned with several experienced automated dispensing equipment vendors to further assist our customers in creating an optimized dispensing process. For information regarding dispensing equipment, contact your local Bergquist representative. For some materials, screen or stencil application may be an option and should be evaluated on a case by case basis.
Q: Do temperature excursions above 25C affect the

shelf life?
A: Short periods of time above the recommended storage temperature, such as during shipping, have not been shown to affect the material characteristics.
Q: Does Gap Filler have adhesive characteristics? A: Although Gap Fillers are not designed as structural adhesives,
when cured, they have a low level of natural tack, which will allow the material to adhere mildly to adjacent components.This aids in keeping the material in the interface throughout repeated temperature cycling and eliminates pump-out from the interface.
Q: Should I be concerned about Gap Filler compatibility

with other materials in my application?
A: Although not common, it is possible to encounter materials that

can affect the cure of two-part Gap Fillers. A list of general categories of compounds that may inhibit the rate of cure or poison the curing catalyst in Gap Filler products is available to help assist with material compatibility evaluation. Please contact your local Bergquist representative for more details.
Q: Is Gap Filler reworkable? A: In many cases, Gap Filler can be reworked. The ease of rework is
highly dependent on the topography of the application as well as the coverage area.
27
Gap Filler 1000 (Two-Part)

Thermally Conductive, Liquid Gap Filling Material Features and Benefits
Thermal conductivity: 1.0 W/m-K Ultra-conforming, designed for fragile and low-stress applications Ambient and accelerated cure schedules 100% solids no cure by-products Excellent low and high temperature mechanical and chemical stability
PROPERTY Color / Part A Color / Part B Viscosity as Mixed (cps) (1) Density (g/cc) Mix Ratio Shelf Life @ 25C (months) PROPERTY AS CURED Color Hardness (Shore 00) (2) Heat Capacity (J/g-K) Continuous Use Temp (F) / (C) ELECTRICAL AS CURED Dielectric Strength (V/mil) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL AS CURED Thermal Conductivity (W/m-K) CURE SCHEDULE Pot Life @ 25C (min) (3) Cure @ 25C (min) (4) Cure @ 100C (min) (4)
1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25C. 2) Thirty second delay value Shore 00 hardness scale. 3) Time for viscosity to double. 4) Cure schedule (rheometer - time to read 90% cure)
TYPICAL PROPERTIES OF GAP FILLER 1000

IMPERIAL VALUE Gray White 100,000 1.6 1:1 6 Gray 30 1.0 -76 to 347 500 5.0 1011 V-O 1.0 15 60 - 120 5 METRIC VALUE Gray White 100,000 1.6 1:1 6 Gray 30 1.0 -60 to 175 500 5.0 1011 V-O 1.0 15 60 - 120 5 TEST METHOD Visual Visual ASTM D2196 ASTM D792 Visual ASTM D2240 ASTM E1269 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
GAP PAD
Gap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a twocomponent, room or elevated temperature curing system.The material is formulated to provide a balance of cured material properties highlighted by a low modulus and good compression set (memory).The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling hot electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, Gap Filler 1000 flows under pressure like a grease. After cure, it does not pump from the interface as a result of thermal cycling. Unlike thermal grease, the cured product is dry to the touch. Unlike cured gap filling materials, the liquid approach offers infinite thickness with little or no stress during displacement and eliminates the need for specific pad thickness and die-cut shapes for individual applications. Gap Filler 1000 is intended for use in thermal interface applications when a strong structural bond is not required.

Automotive electronics Telecommunications Computer and peripherals Thermally conductive vibration dampening Between any heat-generating semiconductor and a heat sink
Supplied in cartridge and kit form

GF1000 00 15 50cc NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 50cc = 50.0cc, 400cc = 400.0cc Kits: 1200cc = 1200.0cc, or 10G = 10 gallon Pot Life: 15 = 15 minutes 00 = No spacer beads 07 = 0.007" spacer beads GF1000 = Gap Filler 1000 Material
Section A
Section B
Section C
28
Section D
Gap Filler 1 100SF (Two-Part)

Thermally Conductive, Silicone-Free, Liquid Gap Filling Material Features and Benefits
Thermal conductivity: 1.1 W/m-K No silicone outgassing or extraction Ultra-conforming, designed for fragile and low-stress applications Ambient and accelerated cure schedules 100% solids no cure by-products Gap Filler 1100SF is the thermal solution for silicone-sensitive applications.The material is supplied as a two-part component, curing at room or elevated temperatures.The material exhibits low modulus properties then cures to a soft, flexible elastomer, helping reduce thermal cycling stresses during operation and virtually eliminating stress during assembly of low-stress applications. The two components are colored to assist as a mix indicator (1:1 by volume).The mixed system will cure at ambient temperature. Unlike cured thermal pad materials, the liquid approach offers infinite thickness variations with little or no stress during assembly displacement. Gap Filler 1100SF, although exhibiting some natural tack characteristics, is not intended for use in thermal interface applications requiring a mechanical structural bond. TYPICAL PROPERTIES OF GAP FILLER 1100SF
PROPERTY Color / Part A Color / Part B Viscosity as Mixed (cps) (1) Density (g/cc) Mix Ratio Shelf Life @ 25C (months) PROPERTY AS CURED Color Hardness (Shore 00) (2) Heat Capacity (J/g-K) Continuous Use Temp (F) / (C) ELECTRICAL AS CURED Dielectric Strength (V/mil) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL AS CURED Thermal Conductivity (W/m-K) CURE SCHEDULE Pot Life @ 25C (3) Cure @ 25C (hrs) (4) Cure @ 100C (min) (4)
IMPERIAL VALUE Yellow Red 450,000 2.0 1:1 6 Orange 60 0.9 -76 to 257 400 5.0 1010 V-O 1.1 240 min (4 hr) 24 10
METRIC VALUE Yellow Red 450,000 2.0 1:1 6 Orange 60 0.9 -60 to 125 400 5.0 1010 V-O 1.1 240 min (4 hr) 24 10
TEST METHOD Visual Visual ASTM D2196 ASTM D792 Visual ASTM D2240 ASTM E1269 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
GAP PAD
Application
Gap Filler 1100SF can be mixed and dispensed using dual-tube cartridge packs with static mixers and manual or pneumatic gun or high volume mixing and dispensing equipment (application of heat may be used to reduce viscosity).
TEMPERATURE DEPENDENCE OF VISCOSITY The viscosity of the Gap Filler 1100SF material is temperature dependent.The table below provides the multiplication factor to obtain viscosity at various temperatures.To obtain the viscosity at a given temperature, look up the multiplication factor at that temperature and multiply the corresponding viscosity at 25C.

Silicone-sensitive optic components Hard disk assemblies Silicone-sensitive electronics Dielectric for bare-leaded devices Filling various gaps between heat-generating devices to heat sinks and housings Mechanical switching relay
Supplied in cartridge or kit form

GF1100SF 00 240 400cc NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 400cc = 400.0cc Kits: 1200cc = 1200.0cc, or 10G = 10 gallon Pot Life: 240 = 240 minutes 00 = No spacer beads 07 = 0.007" spacer beads GF1100SF = Gap Filler 1100SF Material
Temperature C 20 25 35 45 50
Multiplication Factor Part A Part B 1.43 1.57 1.00 1.00 0.58 0.50 0.39 0.30 0.32 0.24
Section B
Section C
Section A
Example - Viscosity of Part A @ 45: Viscosity of Part A at 25C is 450,000 cp. The multiplication factor for part A at 45C is 0.39. Therefore: (450,000) x (0.39) = 175,500 cps
Section D
29

Thermally Conductive Liquid Gap Filling Material Features and Benefits
Thermal conductivity: 1.8 W/mK Optimized shear thinning characteristics for ease of dispensing Excellent slump resistance (stays in place) Ultra-conforming with excellent wet-out for low stress interface applications
PROPERTY Color / Part A Color / Part B Viscosity as Mixed (cps) (1) Density (g/cc) Mix Ratio Shelf Life @ 25C (months) PROPERTY AS CURED Color Hardness (Shore 00) (2) Heat Capacity (J/g-K) Continuous Use Temp (F) / (C) ELECTRICAL AS CURED Dielectric Strength (V/mil) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL AS CURED Thermal Conductivity (W/m-K) CURE SCHEDULE Pot Life @ 25C (min) (3) Cure @ 25C (hrs) (4) Cure @ 100C (min) (4)

IMPERIAL VALUE Yellow White 250,000 2.7 1:1 6 Yellow 50 1.0 -76 to 347 400 6.4 1010 V-O 1.8 60 5 2 METRIC VALUE Yellow White 250,000 2.7 1:1 6 Yellow 50 1.0 -60 to 175 400 6.4 1010 V-O 1.8 60 5 2 TEST METHOD Visual Visual ASTM D2196 ASTM D792 Visual ASTM D2240 ASTM D1269 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 -
GAP PAD
100% solids no cure by-products Excellent low and high temperature mechanical and chemical stability
Gap Filler 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing.The mixed system will cure at room temperature and can be accelerated with the addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness variations with little or no stress to the sensitive components during assembly. Gap Filler 1500 exhibits low level natural tack characteristics and is intended for use in applications where a strong structural bond is not required.As cured, Gap Filler 1500 provides a soft, thermally conductive, form-inplace elastomer that is ideal for fragile assemblies and filling unique and intricate air voids and gaps.
1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25C. 2) Thirty second delay value Shore 00 hardness scale. 3) ARES Parallel Plate Rheometer - Working life as liquid, time for viscosity to double. 4) ARES Parallel Plate Rheometer - Estimated time to read 90% cure.

Automotive electronics Telecommunications Computer and peripherals Thermally conductive vibration dampening Between any heat generating semiconductor and a heat sink
Supplied in cartridge or kit form With or without glass beads Many other special or custom configurations are available upon request

GF1500 00 60 10G NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 50cc = 50.0cc, 400cc = 400.0cc Kits: 1200cc = 1200.00cc, 10G = 10 gallon Pot Life: 60 = 60 min 00 = No spacer beads, 07 = 0.007" spacer beads, 10 = 0.010" spacer beads GF1500 = Gap Filler 1500 (Two-Part) Material
Section A
Section B
Section C
30
Section D

Thermally Conductive, Liquid Gap Filling Material Features and Benefits
Thermal conductivity: 2.0 W/m-K Ultra-conforming, designed for fragile and low-stress applications Ambient and accelerated cure schedules 100% solids no cure by-products Excellent low and high temperature mechanical and chemical stability
PROPERTY Color / Part A Color / Part B Viscosity as Mixed (cps)(1) Density (g/cc) Mix Ratio Shelf Life @ 25C (months) PROPERTY AS CURED Color Hardness (Shore 00)(2) Heat Capacity (J/g-K) Continuous Use Temp (F) / (C) ELECTRICAL AS CURED Dielectric Strength (V/mil) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL AS CURED Thermal Conductivity (W/m-K) CURE SCHEDULE Pot Life @ 25C (3) Cure @ 25C (4) Cure @ 100C
(4)

IMPERIAL VALUE Pink White 300,000 2.9 1:1 6 Pink 70 1.0 -76 to 392 500 7 1011 V-O 2.0 SCHEDULE 1 15 min 1-2 hours 5 min METRIC VALUE Pink White 300,000 2.9 1:1 6 Pink 70 1.0 -60 to 200 500 7 1011 V-O 2.0 SCHEDULE 2 60 min 3-4 hours 15 min TEST METHOD Visual ASTM D2196 ASTM D792 Visual ASTM D2240 ASTM D1269 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 SCHEDULE 3 600 min (10 hr) 3 days 1 hour
GAP PAD
Gap Filler 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material properties and good compression set (memory).The result is a soft, form-in-place elastomer ideal for coupling hot electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won't pump from the interface as a result of thermal cycling and is dry to the touch. Unlike cured Gap Filling materials, the liquid approach offers infinite thickness with little or no stress during displacement and assembly. It also eliminates the need for specific pad thickness and die-cut shapes for individual applications. Gap Filler 2000 is intended for use in thermal interface applications when a strong structural bond is not required.

Automotive electronics Telecommunications Computer and peripherals Thermally conductive vibration dampening Between any heat-generating semiconductor and a heat sink

GF2000 00 60 10G NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 50cc = 50.0cc, 400cc = 400.0cc Kits: 1200cc = 1200.0cc, or 10G = 10 gallon Pot Life: 15 = 15 minutes, 60 = 60 minutes 600 = 600 minutes 00 = No spacer beads 07 = 0.007" spacer beads GF2000 = Gap Filler 2000 Material
Section A
Section B
Section C
Section D
31
Gap Filler 3500S35 (Two-Part)

Thermally Conductive Liquid Gap Filling Material Features and Benefits
Thermal Conductivity: 3.6 W/m-K Thixotropic nature makes it easy to dispense Two-part formulation for easy storage Ultra-conforming - designed for fragile and low stress applications Ambient or accelerated cure schedules TYPICAL PROPERTIES OF GAP FILLER 3500S35
PROPERTY Color / Part A Color / Part B Viscosity as Mixed (cps) (1) Density (g/cc) Mix Ratio Shelf Life @ 25C (months) PROPERTY AS CURED Color Hardness (Shore 00) (2) Continuous Use Temp (F) / (C) ELECTRICAL AS CURED Dielectric Strength (V/mil) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL AS CURED Thermal Conductivity (W/m-K) IMPERIAL VALUE White Blue 150,000 3.0 1:1 5 Blue 35 -76 to 392 275 8.0 10
9
METRIC VALUE White Blue 150,000 3.0 1:1 5 Blue 35 -60 to 200 275 8.0 10
9
TEST METHOD Visual Visual ASTM D2196 ASTM D792 Visual ASTM D2240 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
GAP PAD
V-O 3.6 60 15 30
V-O 3.6 60 15 30
Gap Filler 3500S35 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior softness.The material is twocomponent, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics as well as low viscosity.The result is a gel-like liquid material designed to fill air gaps and voids yet flow when acted upon by an external force (e.g. dispensing or assembly process).The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. Once cured, it remains a low modulus elastomer designed to assist in relieving CTE stresses during thermal cycling yet maintain enough modulus to prevent pump-out from the interface. Gap Filler 3500S35 will lightly adhere to surfaces, thus improving surface area contact. Gap Filler 3500S35 is not designed to be a structural adhesive.
CURE SCHEDULE Pot Life @ 25C (min) (3) Cure @ 25C (hrs) (4) Cure @ 100C (min) (4)

Automotive electronics Discrete components to housing PCBA to housing Fiber optic telecommunications equipment
Standard Options
32
TIC - Thermal Interface Compound
Thermally Conductive Grease Compounds

Bergquists line of thermally conductive thermal interface compounds will flow under assembly pressure to wet-out the thermal interface surfaces and produce very low thermal impedance. TIC products are designed for use between a high-end computer processor and a heat sink or other high watt density applications.
Features
The TIC portfolio has diverse thermal and electrical characteristics. Key criteria when selecting TIC products include: Viscosity Volume resistivity Thermal conductivity Thermal performance Filler size
Benefits
TIC products are ideal for high watt density applications. Primary benefits include: Low interfacial resistance Low thermal impedance Resists dripping Ideally suited to screen printing applications No post cure conditioning required
Options
TIC products can be obtained with application-specific options such as: Containers
Applications
TIC has a variety of applications such as: CPU GPU IGBT High power density applications
TIC
Comparison Data and FAQs

Q: What is the best fastening method for a TIC interface? A: A constant-pressure fastener is preferred when using TIC for high performance applications.The constant pressure from a clip or spring washer will ensure adequate pressure is being applied with varying bond line thickness. Q: How should the TIC be applied? A: Screenprinting the TIC is a fast, low-cost method that delivers a consistent and accurate amount of material on each application. Alternate methods include stenciling, pin transfer and needle dispensing. Q: Will the grease stay in the interface? A: All the TIC materials were specifically designed to resist pump-out of the interface, even after many hours of thermal and power cycling.
33
TIC 1000A
High Performance,Value Compound for High-End Computer Processors Features and Benefits
High thermal performance: 0.32C/W (@ 50 psi) Good screenability Room temperature storage No post cure required Exceptional value
PROPERTY Color Density (g/cc) Continuous Use Temp (F) / (C) ELECTRICAL Electrical Resistivity (Ohm-meter) (1) THERMAL Thermal Conductivity (W/m-K)
TYPICAL PROPERTIES OF TIC 1000A

IMPERIAL VALUE Gray 2.1 302 N/A 1.5 10 0.32 25 0.32 METRIC VALUE Gray 2.1 150 N/A 1.5 50 0.32 TEST METHOD Visual ASTM D792 ASTM D257 ASTM D5470 100 0.31 200 0.28
THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) (2)
1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin. 2) TO-220 performance data is provided as a reference to compare material thermal performance.
Application Cleanliness
1. Pre-clean heat sink and component interface with isopropyl alcohol prior to assembly or repair. Ensure heat sink is dry before applying TIC 1000A.
TIC
Application Methods
TIC 1000A is a high performance, thermally conductive compound intended for use as a thermal interface material between a highend computer processor and a heat sink. Other high watt density applications will also benefit from the extremely low thermal impedance of TIC 1000A. TIC 1000A compound wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance.The compound requires pressure of the assembly to cause flow.The TIC 1000A compound will resist dripping. For microprocessor applications, traditional screw fastening or spring clamping methods will provide adequate force to optimize the thermal performance of TIC 1000A. An optimized application would utilize the minimum volume of TIC 1000A material necessary to ensure complete wet-out of both mechanical interfaces. 1. Dispense and/or screenprint TIC 1000A compound onto the processor or heat sink surface like thermal grease (see a Bergquist Representative for application information). 2. Assemble the processor and heat sink with spring clips or constant-pressure fasteners.

High performance CPUs High performance GPUs
Standard Options
Cartridge: 600cc = 600.0cc
Assembly No Post Screen Cure

TIC 1000A has good screenability. No solvent is used to reduce the viscosity, so no post cure conditioning is required.
34
TIC 4000
High Performance Thermal Interface Compound for Copper-Based Heat Sinks Features and Benefits
Thermal conductivity: 4.0 W/m-K Exceptional thermal performance: 0.19C/W @ 50 psi
PROPERTY Color Density (g/cc) Continuous Use Temp (F) / (C) ELECTRICAL Electrical Resistivity (Ohm-meter) (1) THERMAL Thermal Conductivity (W/m-K)
TYPICAL PROPERTIES OF TIC 4000

IMPERIAL VALUE Gray 4.0 302 N/A 4.0 10 0.21 25 0.20 METRIC VALUE Gray 4.0 150 N/A 4.0 50 0.19 TEST METHOD Visual ASTM D792 ASTM D257 ASTM D5470 100 0.19 200 0.18
THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) (2)
1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin. 2) TO-220 performance data is provided as a reference to compare material thermal performance.
Application Methods
TIC 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt density applications will benefit from the extremely low thermal impedance of TIC 4000. TIC 4000 compound wets-out the thermal interface surfaces and flows to produce low thermal impedance.The compound requires pressure of the assembly to cause flow. TIC 4000 compound will not drip. For a typical 0.5" x 0.5" application at 0.005" thick, Bergquist estimates approximately 0.02 ml (cc) of TIC 4000. Although Bergquist estimates a 0.02 ml (cc) volumetric requirement for a 0.5" x 0.5" component interface, dispensed at a thickness of 0.005", Bergquist also recognizes that an optimized application would utilize the minimum volume of TIC 4000 material necessary to ensure complete wet-out of both mechanical interfaces. 1. Pre-clean heat sink and component interface with isopropyl alcohol prior to assembly or repair. Ensure heat sink is dry before applying TIC 4000. 2. Dispense TIC 4000 compound onto the processor or heat sink surface like thermal grease. 3. Assemble the processor and heat sink with clip or constant-pressure fasteners.
TIC

High performance computer processors (traditional screw fastening or clamping methods will provide adequate force to optimize the thermal performance of TIC 4000) High watt density applications where the lowest thermal resistance interface is required
Standard Options
35
Hi-Flow Phase Change Interface Materials
Solutions-Driven Thermal Management Products for Electronic Devices Use phase change materials for excellent thermal performance without the mess of grease.
Hi-Flow phase change materials are an excellent replacement for grease as a thermal interface between a CPU or power device and a heat sink.The materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface without overflow.The result is a thermal interface comparable to grease, without the mess, contamination and hassle. The Hi-Flow family of phase change thermal interface materials covers a wide range of applications.The Bergquist Company is a leader in thermal management solutions and works closely with customers to ensure that the proper Hi-Flow material is specified.
Features
Hi-Flow handles like Bergquists famed Sil-Pad materials at room temperature, but flows like grease at its designed phase change temperature.The following is an overview of the important features shared by the Hi-Flow family: Comparable thermal performance to grease in most applications Thermally conductive phase change compound Aluminum, film or fiberglass carriers and non-reinforced versions Low volatility Easy to handle and apply in the manufacturing environment Tackified or tack-free at room temperature
Benefits
Using Hi-Flow materials instead of grease can save time and money without sacrificing thermal performance. Here are some other benefits: No mess thixotropic characteristics of the materials keep it from flowing out of the interface Easier handling tackified or tack-free at room temperature Does not require protective liner High thermal performance helps ensure CPU reliability Does not attract contaminants Easier material handling and shipping Simplified application process
Options
The broad Hi-Flow family offers a variety of choices to meet the customers performance, handling and process needs. Some of the choices include: Some Hi-Flows are available with or without adhesive Aluminum carrier for applications not requiring electrical isolation Film or fiberglass carrier for electrical isolation Dry, non-reinforced material Tackified or tack-free at room temperature Tabbed parts, die-cut parts, sheets or bulk rolls Adhesive specifically for cold application without preheating heat sink We produce thousands of specials. Tooling charges vary depending on the complexity of the part.
Applications
Hi-Flow materials are suited for consumer and industrial electronics, automotive, medical, aerospace and telecommunications applications such as: UPS and SMPS AC/DC, DC/DC or linear power supplies Between a CPU and heat sink Power conversion devices Fractional and integral motor control Leaded, surface mount and power module assemblies
HI-FLOW
36
Hi-Flow Comparison Data
TO-220 Thermal Performance
Non-Isolating Hi-Flow Series 105 to 300G Grease Replacement Materials
HI-FLOW
Non-Isolating Hi-Flow 225 and 565 Grease Replacement Materials
Hi-Flow 565UT Hi-Flow 565U
0.10 0
37

Q: How is the ASTM D5470 test modified to characterA:
ize phase change thermal performance? ASTM classifies a phase change as a Type 1, viscous liquid that exhibits unlimited deformation when a stress is applied. Bergquist utilizes test equipment that is designed to meet ASTM D5470 specifications for Type 1, which requires a shim or mechanical stop to precisely control the thickness.The phase change material is conditioned at 5oC over the stated phase change temperature. Understanding that time is also a key variable for material flow, the over-temperature condition is limited to 10 minutes and then allowed to cool, prior to initiating the actual test at the given pressure.The 10 minute time has been demonstrated to be an acceptable time period for the thermal mass inherent in the test setup. Note: Actual application testing may require more or less time to condition, depending upon the heat transfer and associated thermal mass.The performance values are recorded and published at 10, 25, 50, 100 and 200 psi to give the designer a broad-based understanding of Hi-Flows performance. the thermal performance of the Hi-Flow material?
Q: Is Hi-Flow material reworkable? A: If the material has not gone through phase change, the material
will readily release from the device surface. For this situation, the Hi-Flow material will not likely have to be replaced. If the material has gone through the phase change, it will adhere very well to both surfaces. In this case, Bergquist suggests warming the heat sink to soften the Hi-Flow compound for easier removal from the processor. Replace with a new piece of Hi-Flow material.
Q: What is meant by easy to handle in manufacturing? A: Insulated Hi-Flow products are manufactured with inner film
support.This film stiffens the material, allowing parts to be more readily die-cut as well as making the material easier to handle in manual or automated assembly.
Q: What is meant by tack free and why is this important?
A: Many Hi-Flow materials have no surface tack at room temperature.

The softer materials will pick up dirt more readily. Softer resins are more difficult to clean if any dirt is on the surface. If you try to rub the dirt away, the dirt is easily pushed into the soft phase change materials. Hi-Flow coatings are typically hard at room temperature rendering them easier to clean off without embedding dirt.
Q: What is the minimum pressure required to optimize A: Upon achieving phase change temperature (e.g. pre-conditioning),
Bergquist has demonstrated that 10 psi provides adequate pressure to achieve exceptional thermal performance. Bergquist continues to research lower pressure wet-out characteristics in an effort to minimize interfacial losses associated with ultra-thin material interfaces.
Q: What does more scratch resistance mean on

Hi-Flow 625?
HI-FLOW
Q: Will the Hi-Flow replace a mechanical fastener? A: Mechanical fasteners are required. Bergquist recommends the
use of spring clips to maintain consistent pressure over time.
A: Hi-Flow 625 does not require a protective film during shipment.

There are two issues with competitors materials: 1) Melt point of the material is low enough that it can go through phase change in shipment and be very tacky. Hi-Flow has a higher phase change temperature and remains hard to a higher temperature. 2) The Hi-Flow material is harder and is not as easy to scratch or dent in shipping and handling.
Q: Can I use screw-mount devices with Hi-Flow material? A: Hi-Flow works best with a clip or spring washer-mounted
assembly.The continuous force applied by these devices allows the Hi-Flow material to flow and reduce the cross sectional gap. Bergquist suggests that design engineers evaluate whether a screw-mount assembly will have acceptable performance. See TO-220 Technical Note.
Q: Why is Hi-Flow phase change temperature 65oC? A: The 65oC phase change temperature was selected for two reasons.
First, it was a low enough temperature for the phase change to occur in applications. Second, it would not phase change in transport. Bergquist studies show that shipping containers can reach 60oC in domestic and international shipments.The higher phase change temperature eliminates the possibility of a product being ruined in shipment.We offer a standard line of Hi-Flow 225 and 300 series products with 55oC phase change for those customers wanting the lower phase change temperature.
Q: Is the adhesive in Hi-Flow 225F-AC repositionable? A: The adhesive in the current construction does adhere more to
the heat sink aluminum than to the Hi-Flow material.There is the potential that the adhesive will be removed by the heat sink surface when it is removed to reposition on the heat sink.Time and/or pressure will increase the bond to the aluminum increasing the potential for the adhesive to adhere to the heat sink.
Q: Is there any surface preparation required before A:

applying the adhesive-backed Hi-Flow to the heat sink? Standard electronics industry cleaning procedures apply. Remove dirt or other debris. Best results are attained when the Hi-Flow material is applied to a heat sink at a temperature of 25 +/- 10C. If the heat sink has been surface treated (e.g. anodized or chromated), it is typically ready for assembly. For bare aluminum, mild soap and water wash cleaning processes are typically used to eliminate machine oils and debris.
Q: In which applications should I avoid using Hi-Flow? A: Avoid using Hi-Flow in applications in which the device will
not reach operation at or above phase change temperature. Also avoid applications in which the operating temperature exceeds the maximum recommended operating temperature of the compound.
38
Hi-Flow 105
Phase Change Coated Aluminum Features and Benefits

Thermal impedance: 0.37C-in2/W (@25 psi) Used where electrical isolation is not required Low volatility less than 1% Easy to handle in the manufacturing environment Flows but doesnt run like grease
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Continuous Use Temp (F) / (C) Phase Change Temp (F) / (C) ELECTRICAL Dielectric Constant (1000 (Hz) Flame Rating THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (2)
TYPICAL PROPERTIES OF HI-FLOW 105

IMPERIAL VALUE Dark Gray Aluminum 0.0055 266 149 3.2 V-O 0.9 10 0.95 0.39 25 0.80 0.37 METRIC VALUE Dark Gray Aluminum 0.139 130 65 3.2 V-O 0.9 50 0.74 0.36 TEST METHOD Visual ASTM D374 ASTM D3418 ASTM D150 U.L. 94 ASTM D5470 100 0.69 0.33 200 0.64 0.30
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Hi-Flow 105 is a phase change material coated on both sides of an aluminum substrate. It is designed specifically to replace grease as a thermal interface, eliminating the mess, contamination and difficult handling associated with grease. Hi-Flow 105 is tack-free and scratch resistant at room temperature and does not require a protective liner in shipment when attached to a heat sink. At 65C (phase change temperature), Hi-Flow 105 changes from a solid and flows, thereby assuring total wet-out of the interface. The thixotropic characteristics of Hi-Flow 105 reduce the pump-out from the interface. Hi-Flow 105 has thermal performance equal to grease with 0.10C-in2/W contact thermal resistance.

Power semiconductors Microprocessors mounted on a heat sink Power conversion modules Spring or clip mount applications where thermal grease is used
HI-FLOW
Sheet form, die-cut parts and roll form With or without pressure sensitive adhesive

HF105 0.0055 AC 12/250 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.0055" HF105 = Hi-Flow 105 Phase Change Material
Section A
Section B
Section C
Section D
39
Hi-Flow 225F-AC
Reinforced, Phase Change Thermal Interface Material Features and Benefits

Thermal impedance: 0.10C-in2/W (@25 psi) Can be manually or automatically applied to the surfaces of room-temperature heat sinks Foil reinforced, adhesive-coated Soft, thermally conductive 55C phase change compound
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Carrier Thickness (inch) / (mm) Continuous Use Temp (F) / (C) Phase Change Temp (F) / (C) ELECTRICAL Flame Rating THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (2)
TYPICAL PROPERTIES OF HI-FLOW 225F-AC

IMPERIAL VALUE Black Aluminum 0.004 0.0015 248 131 V-O 1.0 10 0.87 0.12 25 0.68 0.10 METRIC VALUE Black Aluminum 0.102 0.038 120 55 V-O 1.0 50 0.57 0.09 TEST METHOD Visual ASTM D374 ASTM D374 ASTM D3418 U.L. 94 ASTM D5470 100 0.50 0.08 200 0.45 0.07
Hi-Flow 225F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. Hi-Flow 225F-AC consists of a soft, thermally conductive 55C phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heat sink. Above the 55C phase change temperature, Hi-Flow 225F-AC wets-out the thermal interface surfaces and flows to produce low thermal impedance. Hi-Flow 225F-AC requires pressure from the assembly to cause material flow.The Hi-Flow coatings resist dripping in vertical orientation. The material includes a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly. Please contact Bergquist Product Management for applications that are less than 0.07" square.

Computer and peripherals Power conversion High performance computer processors Power semiconductors Power modules
HI-FLOW
Roll form, kiss-cut parts, and sheet form

HF225FAC 0.004 AC 11/250 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side Standard thicknesses available: 0.004" HF225FAC = Hi-Flow 225F-AC Phase Change Material
Section A
Section B
Section C
40
Section D
Hi-Flow 225UT
Un-Reinforced, Pressure Sensitive Phase Change Thermal Interface Material Features and Benefits
Thermal impedance: 0.08C-in2/W (@25 psi) 55C phase change composite with inherent tack characteristics High-visibility protective tabs Pressure sensitive phase change thermal interface material
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Continuous Use Temp (F) / (C) Phase Change Temp (F) / (C) ELECTRICAL Flame Rating THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (2)
TYPICAL PROPERTIES OF HI-FLOW 225UT

IMPERIAL VALUE Black None 0.003 248 131 V-O 0.7 10 0.60 0.09 25 0.53 0.08 METRIC VALUE Black None 0.077 120 55 V-O 0.7 50 0.46 0.07 TEST METHOD Visual ASTM D374 ASTM D3418 U.L. 94 ASTM D5470 100 0.40 0.06 200 0.35 0.05
Hi-Flow 225UT is designed as a pressure sensitive thermal interface material for use between a high performance processor and a heat sink. Hi-Flow 225UT is a thermally conductive 55C phase change composite with inherent tack.The material is supplied on a polyester carrier liner and is available with high-visibility protective tabs. Above its phase change temperature, Hi-Flow 225UT wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance.The material requires pressure of the assembly to cause flow.

Computer and peripherals High performance computer processors Graphic cards Power modules
HF 225UT Roll Form, Kiss-Cut Parts Clear/Colored Protective Tab
HI-FLOW
"Quick-Snap" High Visibility Tab for Removal
Adhesive Strip Clear Polyester Carrier Liner
Roll form with tabs, kiss-cut parts no holes Hi-Flow 225UT is limited to a square or rectangular part design. Dimensional tolerance is +/- 0.020 inch (0.5mm).
Application Methods:
1. Hand-apply Hi-Flow 225UT to a roomtemperature heat sink.The Hi-Flow 225UT pad exhibits inherent tack and can be hand-applied similar to an adhesive pad. The tab liner can remain on the heat sink and pad throughout shipping and handling until is it is ready for final assembly.
Standard Options
41
Hi-Flow 225U
Un-Reinforced Phase Change Thermal Interface Material Features and Benefits

Thermal impedance: 0.07C-in /W (@25 psi) Hi-Flow coating will resist dripping Thermally conductive 55C phase change compound Available in roll form with kiss-cut parts
2
TYPICAL PROPERTIES OF HI-FLOW 225U

PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Continuous Use Temp (F) / (C) Phase Change Temp (F) / (C) ELECTRICAL Flame Rating THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (2) IMPERIAL VALUE Black None 0.0015 302 131 V-O 1.0 10 0.53 0.08 25 0.47 0.07 METRIC VALUE Black None 0.036 150 55 V-O 1.0 50 0.39 0.06 TEST METHOD Visual ASTM D374 ASTM D3418 U.L. 94 ASTM D5470 100 0.34 0.05 200 0.32 0.04
HI-FLOW
Hi-Flow 225U is designed for use as a thermal interface material between a computer processor and a heat sink.The product consists of a thermally conductive 55C phase change compound coated on a release liner and supplied on a carrier. Above its phase change temperature, Hi-Flow 225U wets-out the thermal interface surfaces and flows to produce low thermal impedance. Hi-Flow 225U requires pressure of the assembly to cause flow.

Computer and peripherals High performance computer processors Graphic cards Power modules
Roll form with tabs, kiss-cut parts no holes Hi-Flow 225U is limited to a square or rectangular part design. Dimensional tolerance is +/- 0.020 inch (0.5mm).
Application Methods:
1. Hand-apply to 35- 45C heat sink.The heat sink is heated in an oven or via heat gun to between 35- 45C.The Hi-Flow 225U part is then applied like an adhesive pad.The heat sink is cooled to room temperature and packaged. A protective tab liner remains in place until the unit is ready for final assembly. The protective tab can be readily removed from the applied Hi-Flow 225U pad at a maximum temperature of 28C. 2. Automated equipment with 30-psi pressure. A pick-and-place automated dispensing unit can be used to apply the Hi-Flow 225U pad to a room-temperature heat sink.The placement head should have a silicone rubber pad, and should apply approximately 30-psi pressure to the pad on transfer to the 25 35C heat sink. Once applied, the protective tab can be readily removed from the Hi-Flow 225U pad at a maximum temperature of 28C. 42

HF225U 0.0015 00 11/500 NA
Standard Options
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard Hi-Flow 225U configuration, 11/500 = 11" x 500' rolls, or 00 = custom configuration 00 = No adhesive Standard thicknesses available: 0.0015" HF225U = Hi-Flow 225U Phase Change Material
Section B
Section A
Section C
Section D
Section E
Hi-Flow 625
Un-Reinforced Phase Change Thermal Interface Material Features and Benefits

Thermal impedance: 0.71C-in2/W (@25 psi) Electrically isolating 65C phase change compound coated on PEN film Tack-free and scratch-resistant
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Elongation (%45 to Warp and Fill) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) Phase Change Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) 0.5 10 2.26 0.79 25 2.10 0.71 0.5 50 2.00 0.70 ASTM D5470 100 1.93 0.67 200 1.87 0.61
TYPICAL PROPERTIES OF HI-FLOW 625

IMPERIAL VALUE Green PEN Film 0.005 60 30,000 302 149 4000 3.5 1010 V-O METRIC VALUE Green PEN Film 0.127 60 206 150 65 4000 3.5 1010 V-O TEST METHOD Visual ASTM D374 ASTM D882A ASTM D882A ASTM D3418 ASTM D149 ASTM D150 ASTM D257 U.L. 94
Hi-Flow 625 is a film-reinforced phase change material.The product consists of a thermally conductive 65C phase change compound coated on PEN film. Hi-Flow 625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink.The reinforcement makes Hi-Flow 625 easy to handle, and the 65C phase change temperature of the coating material eliminates shipping and handling problems.The PEN film has a continuous use temperature of 150C. Hi-Flow 625 is tack-free and scratch-resistant at production temperature and does not require a protective liner in most shipping situations. The material has the thermal performance of 2-3 mil mica and grease assemblies.
Thermal Impedance (C-in2/W) (2)
HI-FLOW

Spring / clip mounted Power semiconductors Power modules

HF625 0.005 AC 1212 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 1212 = 12" x 12" sheets, 12/200 = 12" x 200' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.005" HF625 = Hi-Flow 625 Phase Change Material
Section B
Section D
Section A
Section C
43
Hi-Flow 300P
Electrically Insulating,Thermally Conductive Phase Change Material Features and Benefits

Thermal impedance: 0.13C-in2/W (@25 psi) Field-proven polyimide film - excellent dielectric performance - excellent cut-through resistance Outstanding thermal performance in an insulated pad
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Film Thickness (inch) / (mm) Elongation (%) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) Phase Change Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) 0.0010" 1.6 10 0.95 1.19 1.38 0.13 0.17 0.19 25 0.94 1.17 1.37 0.13 0.16 0.19 1.6 50 0.92 1.16 1.35 0.12 0.16 0.19 ASTM D5470 100 0.91 1.14 1.33 0.12 0.16 0.18 200 0.90 1.12 1.32 0.12 0.15 0.18
TYPICAL PROPERTIES OF HI-FLOW 300P

IMPERIAL VALUE Green Polyimide 0.004 - 0.005 0.001 - 0.002 40 7000 302 131 5000 4.5 1012 V-O METRIC VALUE Green Polyimide 0.102 - 0.127 0.025 - 0.050 40 48 150 55 5000 4.5 1012 V-O TEST METHOD Visual ASTM D374 ASTM D374 ASTM D882A ASTM D882A ASTM D3418 ASTM D149 ASTM D150 ASTM D257 U.L. 94
HI-FLOW
Hi-Flow 300P consists of a thermally conductive 55C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle and the 55C phase change temperature minimizes shipping and handling problems. Hi-Flow 300P achieves superior values in voltage breakdown and thermal performance when compared to its competition.The product is supplied on an easy release liner for exceptional handling in high volume manual assemblies. Hi-Flow 300P is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink. Bergquist suggests the use of spring clips to assure constant pressure with the interface and power source. Please refer to thermal performance data to determine nominal spring pressure for your application.
TO-220 Thermal Performance (C/W) 0.0015" TO-220 Thermal Performance (C/W) 0.0020" Thermal Impedance (C-in2/W) 0.0010" (2) Thermal Impedance (C-in2/W) 0.0015" (2) Thermal Impedance (C-in2/W) 0.0020" (2)

Spring / clip mounted Discrete power semiconductors and modules
Roll form, die-cut parts and sheet form, dry both sides

HF300P 0.001 00 00 ACME10256 Rev a
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or 00 = custom configuration 00 = No adhesive Standard polyimide thicknesses available: 0.001", 0.0015", 0.002"
Section B
Section C
Section D
Section A
We produce thousands of specials.Tooling charges vary depending on tolerances and complexity of the part.
HF300P = Hi-Flow 300P Phase Change Material
44
Hi-Flow 300G
Fiberglass-Reinforced, Phase Change Thermal Interface Material Features and Benefits

Thermal impedance: 0.20C-in2/W (@25 psi) Resists running or dripping Phase change compound coated on a fiberglass carrier
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Elongation (%45 to Warp and Fill) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) Phase Change Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 0.96 0.27 25 0.92 0.20 50 0.88 0.16 100 0.85 0.15 200 0.84 0.14 1.6 1.6 ASTM D5470 300 3.5 108 V-O 300 3.5 108 V-O ASTM D149 ASTM D150 ASTM D257 U.L. 94
TYPICAL PROPERTIES OF HI-FLOW 300G

IMPERIAL VALUE Green Fiberglass 0.005 40 400 212 131 METRIC VALUE Green Fiberglass 0.127 40 3 100 55 TEST METHOD Visual ASTM D374 ASTM D882A ASTM D882A ASTM 3418
Hi-Flow 300G consists of a thermally conductive 55C phase change compound coated on a fiberglass web. Hi-Flow 300G is designed as a thermal interface material between a computer processor and a heat sink. Above the phase change temperature, Hi-Flow 300G wets-out the thermal interface surfaces and flows to produce low thermal impedance.The material requires pressure of the assembly to cause flow. Hi-Flow 300G will resist running or dripping.
TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (2)
HI-FLOW

Computer and peripherals As a thermal interface where bare die is exposed and needs to be heat sinked
Application Methods
1. Hand-apply to 40- 50C heat sink.The heat sink is heated in an oven or by a heat gun to between 40- 50C allowing the Hi-Flow 300G pad to be applied like an adhesive pad.The heat sink is then cooled to room temperature and packaged. 2. Hand-apply to 20- 35C heat sink. Hi-Flow 300G can be applied to a room temperature heat sink with the assistance of a foam roller.The pad is positioned on the heat sink and a hand roller is used to apply pressure of 30 psi. 3. Automated equipment with 30 psi pressure. A pick-and-place automated dispensing unit can be used to apply Hi-Flow 300G to a room temperature heat sink.The placement head should have a soft silicone rubber pad, and apply 30 psi pressure to the pad on transfer to the 20- 35C heat sink.

HF300G 0.005 00 1012 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.005" HF300G = Hi-Flow 300G Phase Change Material
Section B
Section D
Section A
Section C
45
Hi-Flow 565U
High Performance, Un-Reinforced Phase Change Thermal Interface Material Features and Benefits
Thermal impedance: 0.04C-in2/W (@25 psi) Very high thermal conductivity: 3.5 W/mk 52C phase change temperature Unsupported
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Continuous Use Temp (F) / (C) Phase Change Temp (F) / (C) ELECTRICAL Flame Rating THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W)(2) 3.5 10 0.29 0.05 25 0.27 0.04 3.5 50 0.25 0.04 ASTM D5470 100 0.24 0.04 200 0.23 0.03
TYPICAL PROPERTIES OF HI-FLOW 565U

IMPERIAL VALUE Gray None 0.010 257 126 V-O METRIC VALUE Gray None 0.254 125 52 V-O TEST METHOD Visual ASTM D374 ASTM D3418 U.L. 94
HI-FLOW
Hi-Flow 565U is a thermally conductive phase change material which is applied in tabulated pad form. In the application the easy to use material undergoes a phase change at 52C. After phase change, Hi-Flow 565U wets out the thermal interfaces producing a very low thermal impedance. Hi-Flow 565U displaces easily at low pressures to provide a thermal performance comparable to the best thermal greases. Hi-Flow 565U is provided at a consistent thickness to ensure reliable performance. Hi-Flow 565U is attached to the target surface via pressure from a hard rubber roller or squeegee.

Processor lid to heat sink Processor die to lid or heat sink FBDIMM to heat spreader
Tabulated in roll form, kiss-cut parts - no holes Hi-Flow 565U is limited to a square or rectangular part design. Dimensional tolerance is +/- 0.20 inch (0.5mm)

HF565U 0.010 00 00 ACME10256 Rev a
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 11/100 = 11" x 100' rolls, or 00 = custom configuration 00 = No adhesive Standard Thickness Available = 0.010" HF565U = Hi-Flow 565U Phase Change Material
Section C
Section A
Section B
46
Section D
Hi-Flow 565UT
Tacky, High Performance, Un-Reinforced Phase Change TIM Features and Benefits
Thermal impedance: 0.05C-in2/W (@25 psi) High thermal conductivity: 3.0 W/mk Phase change softening temp 52C Naturally tacky Tabulated for ease of assembly
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Continuous Use Temp (F) / (C) Phase Change Softening Temp (F) / (C) ELECTRICAL Flame Rating THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W)(2) 3.0 10 0.37 0.09 25 0.35 0.05 3.0 50 0.34 0.03 ASTM D5470 100 0.30 0.02 200 0.26 0.02
TYPICAL PROPERTIES OF HI-FLOW 565UT

IMPERIAL VALUE Blue None 0.005, 0.010 257 126 V-O METRIC VALUE Blue None 0.127, 0.254 125 52 V-O TEST METHOD Visual ASTM D374 ASTM D3418 U.L. 94
Hi-Flow 565UT is a naturally tacky, thermally conductive phase change material which is supplied in an easy to use tabulated pad form. In the application the material undergoes a phase change softening, starting near 52C.The phase change softening feature improves handling characteristics prior to a facilitated assembly. At application temperatures and pressures, Hi-Flow 565UT wets out the thermal interfaces producing a very low thermal impedance. The thermal performance of Hi-Flow 565UT is comparable to the best thermal greases. Hi-Flow 565UT is provided at a consistent thickness to ensure reliable performance. Hi-Flow 565UT can be applied in high volumes to the target surface via low pressure from a roller or manual application.
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate. The Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.

Processor lid to heat sink Processor die to lid or heat sink FBDIMM to heat spreader
HI-FLOW
Tabulated in roll form, kiss-cut parts - no holes Hi-Flow 565UT is limited to a square or rectangular part design. Dimensional tolerance is +/- 0.20 inch (0.5mm)

HF565UT 0.005 02 00 ACME10256 Rev a
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 11/250 = 11" x 250' rolls, or 00 = custom configuration
Section C
Section A
Section B
Section D
02 = Natural Tack Standard Thickness Available = 0.005", 0.010" HF565UT = Hi-Flow 565UT Phase Change Material
47
Hi-Flow 650P
Electrically Insulating, High Performance,Thermally Conductive Phase Change Material Features and Benefits
Thermal Impedance: 0.20C-in /W (@25 psi) 150C high temperature reliability Natural tack one side for ease of assembly Exceptional thermal peformance in an insulated pad
2
TYPICAL PROPERTIES OF HI-FLOW 650P

PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Film Thickness (inch) / (mm) Inherent Surface Tack (1 or 2-Side) Elongation (%) Tensile Strength (psi) Continuous Use Temp (F / C)
Phase Change Softening Temp (F / C)
IMPERIAL VALUE Gold Polyimide 0.0045 - 0.0055 0.001 - 0.002 1 40 7000 -40 to 302 126
METRIC VALUE Gold Polyimide 0.114 - 0.140 0.025 - 0.050 1 40 7000 -40 to 150 52
TEST METHOD Visual ASTM D374 ASTM D374 ASTM D882A ASTM D882A ASTM D3418
ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL 5000 4.5 1012 V-O 5000 4.5 1012 V-O ASTM D149 ASTM D150 ASTM D257 U.L. 94
HI-FLOW
Hi-Flow 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side.The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow 650P offers high temperature reliability ideal for automotive applications. Hi-Flow 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Bergquist recommends the use of spring clips to assure constant pressure with the component interface and the heat sink. Please refer to the TO-220 thermal performance data to determine the nominal spring pressure for your application.
Thermal Conductivity (W/m-K)(1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) 0.0010" TO-220 Thermal Performance (C/W) 0.0015" TO-220 Thermal Performance (C/W) 0.0020" Thermal Impedance (C-in /W)(2) 0.0010"
2
1.5
1.5
ASTM D5470
10 1.20 1.47 1.59 0.21 0.23 0.27
25 1.15 1.41 1.48 0.20 0.22 0.27
50 1.11 1.37 1.43 0.19 0.21 0.26
100 1.06 1.33 1.38 0.18 0.20 0.25
200 1.00 1.29 1.35 0.17 0.20 0.24
Thermal Impedance (C-in2/W)(2) 0.0015" Thermal Impedance (C-in2/W)(2) 0.0020"
1) This is the measured thermal conductivity of the Hi-Flow wax coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C for 5 minutes prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.

HF650P 0.001 01 00 ACME10256 Rev a
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or 00 = custom configuration
Section A
Section B
Section C
Spring / clip-mounted devices Discrete power semiconductors and modules
Section D
01 = Natural Tack Standard Polyimide Thickness Available = 0.001", 0.0015", 0.002" HF650P = Hi-Flow 650P Phase Change Material
Configurations Available
Roll form, die-cut parts, sheet form Available with 1.0, 1.5 or 2.0 mil Polyimide reinforcement carrier
48
Sil-Pad Thermally Conductive Insulators
Solutions-Driven Thermal Management Products for Electronic Devices Comprehensive choices for a cleaner and more efficient thermal interface
More than 25 years ago, Bergquist set the standard for elastomeric thermal interface materials with the introduction of Sil-Pad.Today, Bergquist is a world leader with a complete family of Sil-Pad materials to meet the critical needs of a rapidly changing electronics industry. Sil-Pad thermally conductive insulators, in their many forms, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications. Bergquist application specialists work closely with customers to specify the proper Sil-Pad material for each unique thermal management requirement.
Features
The Sil-Pad family encompasses dozens of products, each with its own unique construction, properties and performance. Here are some of the important features offered by the Sil-Pad family: Proven silicone rubber binders Fiberglass, dielectric film or polyester film carriers Special fillers to achieve specific performance characteristics Flexible and conformable Reinforcements to resist cut-through Variety of thicknesses Wide range of thermal conductivities and dielectric strengths
Benefits
Choosing Sil-Pad thermal products saves time and money while maximizing an assemblys performance and reliability. Specifically: Excellent thermal performance Eliminates the mess of grease More durable than mica Less costly than ceramic Resistant to electrical shorting Easier and cleaner to apply Under time and pressure, thermal resistance will decrease Better performance for todays high-heat compacted assemblies A specific interfacial performance that matches the need Efficient total applied cost that compares favorably with other alternatives
Options
Some Sil-Pad products have special features for particular applications. Options include: Available with or without adhesive Some configurations are well suited for automated dispensing and/or placement Aluminum foil or imbedded graphite construction for applications not requiring electrical insulation Copper shield layer Polyester binder material for silicone-sensitive applications Polyimide film carrier for increased voltage breakdown Materials with reduced moisture sensitivity Available in rolls, sheets, tubes and custom die-cut parts Custom thicknesses and constructions We produce thousands of specials. Tooling charges vary depending on the complexity of the part.
Applications
The large family of Sil-Pad thermally conductive insulators is extremely versatile. In todays marketplace, Sil-Pads are used in virtually every component of the electronics industry, including: Interface between a power transistor, CPU or other heatgenerating component and a heat sink or rail Isolate electrical components and power sources from heat sink and/or mounting bracket Interface for discrete semiconductors requiring low-pressure spring-clamp mounting Consumer electronics Automotive systems Telecommunications Aerospace Military Medical devices Industrial controls
SIL-PAD
49

Q: What is the primary difference between A:
Sil-Pad A2000 and Sil-Pad 2000 products? Sil-Pad A2000 utilizes a different filler package than Sil-Pad 2000. This change results in a more compliant Sil-Pad A2000 material that inherently lowers interfacial resistance losses.This reduction in interfacial resistance results in improved overall thermal performance when measured at lower pressures in standard ASTM D5470 and TO-220 testing. versus Sil-Pad 2000 for my application?
Q: When should I choose Sil-Pad 980

versus Sil-Pad 900S for my application?
A: Sil-Pad 980 is specifically formulated to provide superior cutthrough and crush resistance in combination with excellent heat transfer and dielectric properties. Sil-Pad 980 has a proven history of reliability in high-pressure applications where surface imperfections such as burrs and dents are inherently common. These applications often include heavily machined metal surfaces manufactured from extrusions or castings. Sil-Pad 900S carries a high level of crush resistance and is more likely to be used in burr-free or controlled-surface finish applications.
Q: When should I choose Sil-Pad A2000 A: The answer is based on the assumption that the primary design
intent is to increase thermal performance. If your application utilizes lower clamping pressures (e.g. 10 to 75 psi) you will find the Sil-Pad A2000 to provide excellent thermal performance. In contrast, if you are designing for higher clamping pressures (e.g. 100 psi or greater), it is likely that you will require the thermal performance characteristics of the Sil-Pad 2000.
Q: Is there an adhesive available for Sil-Pad 1500ST and

Sil-Pad 1100ST?
A: Sil-Pad 1500ST and Sil-Pad 1100ST have an inherent tack on

both sides of the material.This inherent tack is used instead of an adhesive.The tack provides sufficient adhesive for dispensing from the carrier liner and placement on the component. Sil-Pad 1500ST and Sil-Pad 1100ST can be repositioned after the initial placement.
Q: Are there differences in electrical characteristics

between Sil-Pad A2000 and Sil-Pad 2000?
A: Yes. Bergquist evaluates and publishes voltage breakdown,

dielectric constant and volume resistivity data per ASTM standards for these materials. Due to differences between ASTM lab testing and actual application performance, for best results, these characteristics should be evaluated within the actual customer system.
Q: Why are the thermal performance curves of Sil-Pad A:

1500ST and Sil-Pad 1100ST so flat when compared to other Sil-Pads? Sil-Pad 1500ST and Sil-Pad 1100ST wet-out the application surfaces at a very low pressures. Optimal thermal performance is achieved at pressures as low as 50 psi. my specific application?
Q: Can I get Sil-Pad A2000 in roll form? A: Yes.With the new environmentally green process improvements added with the introduction of Sil-Pad A2000 products, the materials are now available in roll form.The original Sil-Pad 2000 material cannot be produced in continuous roll form.
Q: How do I know which Sil-Pad is right for A: Each application has specific characteristics (e.g. surface finish,
flatness tolerances, high pressure requirements, potential burrs, etc.) that determine which Sil-Pad will optimize thermal performance. Select a minimum of two pads that best fit the application, then conduct testing to determine which material performs the best.
Q: When should I choose Sil-Pad 800

versus Sil-Pad 900S for my application?
SIL-PAD
A: Sil-Pad 800 is specifically formulated to provide excellent thermal

performance for discrete semiconductor applications that utilize low clamping pressures (e.g. spring clips at 10 to 50 psi). In contrast, if you are designing for higher clamping pressure applications using discrete semi-conductors (e.g. 50 to 100 psi), it is likely that you will prefer the combination of high thermal performance and cut-through resistance inherent in Sil-Pad 900S material.
Q: What is IS09001:2008? A: The ISO certification is the adoption of a quality management

system that is a strategic decision of the organization.This International Standard specifies requirements for a quality management system where an organization: a) needs to demonstrate its ability to consistently provide product that meets customer and applicable regulatory requirements, and b) aims to enhance customer satisfaction through the effective application of the system, including processes for continual improvement of the system and the assurance of conformity to customer and regulatory requirements.
50
Why Choose Sil-Pad Thermally Conductive Insulators?

Mica and Grease
Mica insulators have been in use for over 35 years and are still commonly used as an insulator. Mica is inexpensive and has excellent dielectric strength, but it is brittle and is easily cracked or broken. Because mica used by itself has high thermal impedance, thermal grease is commonly applied to it.The grease flows easily and excludes air from the interface to reduce the interfacial thermal resistance. If the mica is also thin (2-3 mils [50-80 m]), a low thermal impedance can be achieved. However, thermal grease introduces a number of problems to the assembly process. It is time-consuming to apply, messy and difficult to clean. Once thermal grease has been applied to an electronic assembly, solder processes must be avoided to prevent contamination of the solder. Cleaning baths must also be avoided to prevent wash-out of the interface grease, causing a dry joint and contamination of the bath. Assembly, soldering and cleaning processes must be performed in one process while the greased insulators are installed off-line in a secondary process. If the grease is silicone-based, migration of silicone molecules occurs over time, drying out the grease and contaminating the assembly.
Binders
Most Sil-Pad products use silicone rubber as the binder. Silicone rubber has a low dielectric constant, high dielectric strength, good chemical resistance and high thermal stability. Silicone rubber also exhibits cold flow, which excludes air from the interface as it conforms to the mating surfaces.This flow eliminates the need for thermal grease. A rough-surface-textured insulator needs to flow more to exclude air than a smooth one.The smoother pads also need less pressure to wet-out the surfaces and obtain optimum thermal contact.
Polyimide Films
Polyimide films can also be used as insulators and are often combined with wax or grease to achieve a low thermal impedance. These polyimide films are especially tough and have high dielectric strength. Sil-Pad K-4, K-6 and K-10 incorporate polyimide film as the carrier material.
Ceramic Insulators
Other insulation materials include ceramic wafer insulators which have a higher thermal conductivity than mica.They are often used thicker (20-60 mils), (.5 to 1.5 mm) to reduce capacitive coupling while maintaining a low thermal impedance. Drawbacks to ceramic insulators are their high cost and, like mica, they are rigid and crack easily. Also, ceramic beryllia use requires careful handling since inhalation of beryllia dust can cause lung inflammation (berylliosis).
Carriers
The carrier provides physical reinforcement and contributes to dielectric strength. High dielectric and physical strength are obtained by using a heavy, tight mesh, but thermal resistance will suffer. A light, open mesh reduces thermal resistance, dielectric strength and cut-through resistance. The carrier materials used in Sil-Pad materials include fiberglass and dielectric film.
SIL-PAD
Fillers
The thermal conductivity of Sil-Pad products is improved by filling them with ingredients of high thermal conductivity.The fillers change the characteristics of the silicone rubber to enhance thermal and/or physical characteristics. For instance, some fillers make the silicone rubber hard and tough while still retaining the ability to flow under pressure. A harder silicone helps the material resist cut-through. In other applications a filler is used to make the silicone rubber softer and more conformable to rough surfaces.While the range in thermal resistance of greased mica is quite large, the average is comparable to elastomeric insulators filled with a blend of the appropriate ingredients.
Sil-Pad Materials
Sil-Pad thermally conductive insulators are designed to be clean, grease-free and flexible.The combination of a tough carrier material such as fiberglass and silicone rubber which is conformable, provides the engineer with a more versatile material than mica or ceramics and grease. Sil-Pad products minimize the thermal resistance from the case of a power semiconductor to the heat sink. Sil-Pad materials electrically isolate the semiconductor from the heat sink and have suffiicient dielectric strength to withstand high voltage.They are also strong enough to resist puncture by the facing metal surface.
51
Mechanical and Electrical Properties

Mechanical Properties
Woven fiberglass and films are used in Sil-Pad products to provide mechanical reinforcement.The most important mechanical property in Sil-Pad applications is resistance to cut-through to avoid electrical shorting from the device to the heat sink. Devices with larger surface areas need more pressure to get the insulator to conform to the interface than smaller devices. In most screw-mount applications, the torque required to tighten the fastener is sufficient to generate the pressure needed for optimum thermal resistance.There are exceptions where the specified torque on the fastener does not yield the optimum thermal resistance for the insulator being used and either a different insulator or a different mounting scheme should be used. Interfacial thermal resistance decreases as time under pressure increases. In applications where high clamping forces cannot be used, time can be substituted for pressure to achieve lower thermal resistance.The only way to know precisely what the thermal resistance of an insulator will be in an application is to measure it in that application.
Electrical Properties
If your application does not require electrical insulation, Q-Pad II or Q-Pad 3 are ideal grease replacement materials.These materials do not provide electrical isolation but have excellent thermal properties. Hi-Flow phase change materials should also be considered for these applications. (Reference pages 36-48 of this guide.) The most important electrical property in a typical assembly where a Sil-Pad insulator is used is dielectric strength. In many cases the dielectric strength of a Sil-Pad will be the determining factor in the design of the apparatus in which it is to be used. Here are some general guidelines regarding electrical properties to consider when selecting a Sil-Pad material: Q-Pad II and Q-Pad 3 are used when electrical isolation is not required. Dielectric breakdown voltage is the total voltage that a dielectric material can withstand.When insulating electrical components from each other and ground, it is desirable to use an insulator with a high breakdown voltage.
Cut-Through Resistance - Bergquist introduced its TO-220 cut-through test to help customers better understand typical application performance.
Mounting Techniques and Mounting Pressure

Typical mounting techniques include: A spring clip, which exerts a centralized clamping force on the body of the transistor.The greater the mounting force of the spring, the lower the thermal resistance of the insulator. A screw in the mounting tab.With a screw-mounted TO-220, the force on the transistor is determined by the torque applied to the fastener. In extremely low-pressure applications, an insulator with pressure sensitive adhesive on each side may give the lowest thermal resistance since the adhesive wets-out the interface easier than the dry rubber. This decreases the interfacial thermal resistance.
SIL-PAD
SIL-PAD TYPICAL ELECTRICAL PROPERTIES

BREAKDOWN VOLTAGE Material Sil-Pad 400 - 0.007 Sil-Pad 400 - 0.009 Sil-Pad 900S Sil-Pad 1200 - 0.009 Sil-Pad A1500 Sil-Pad 2000 Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 Test Method (kV) 3.5 4.5 5.5 6.0 6.0 4.0 6.0 6.0 6.0 ASTM D149*
* Method A,Type 3 Electrodes
DIELECTRIC STRENGTH (Volts/mil) (kV/mm) 500 20 500 20 600 24 667 26 600 24 400 16 1000 39 1000 39 1000 39 ASTM D149*
* Method A,Type 3 Electrodes
DIELECTRIC CONSTANT (1000 Hz) 5.5 5.5 6.0 7.0 7.0 4.0 5.0 4.0 3.7 ASTM D150
VOLUME RESISTIVITY (Ohm-Meter) 1011 1011 1010 1010 1011 1011 1012 1012 1012 ASTM D257
52
Thermal Properties
Breakdown voltage decreases as the area of the electrodes increases.This area effect is more pronounced as the thickness of the insulator decreases. Breakdown voltage decreases as temperature increases. Breakdown voltage decreases as humidity increases. Breakdown voltage decreases in the presence of partial discharge. Breakdown voltage decreases as the size of the voltage source (kVA rating) increases. Breakdown voltage can be decreased by excessive mechanical stress on the insulator. Dielectric strength, dielectric constant and volume resistivity should all be taken into consideration when selecting a Sil-Pad material. If your application requires specific electrical performance, please contact a Bergquist Sales Representative for more detailed testing information. The thermal properties of Sil-Pad products are thermal impedance, thermal conductivity and thermal resistance. The thermal resistance and conductivity of Sil-Pad products are inherent to the material and do not change.Thermal resistance and thermal conductivity are measured per ASTM D5470 and do not include the interfacial thermal resistance effects.Thermal impedance applies to the thermal transfer in an application and includes the effects of interfacial thermal resistance. As the material is applied in different ways, the thermal impedance values will vary from application to application. The original Sil-Pad material, Sil-Pad 400, continues to be Bergquist's most popular material for many applications. Sil-Pad A1500 is chosen when greater thermal performance is required. Sil-Pad A2000 is ideal for high performance, high reliability applications. Beyond these standard materials, many things can contribute to the selection of the correct material for a particular application. Questions regarding the amount of torque and clamping pressure are often asked when selecting a Sil-Pad material. Here are some guidelines: Interfacial thermal resistance decreases as clamping pressure increases. The clamping pressure required to minimize interfacial thermal resistance can vary with each type of insulator. Sil-Pad products with smooth surface finishes (Sil-Pad A1500, Sil-Pad A2000, Sil-Pad K-4, Sil-Pad K-6 and Sil-Pad K-10) are less sensitive to clamping pressure than Sil-Pads with rough surface finishes (Sil-Pad 400) or smooth and tacky finishes (Sil-Pad 1500ST).
Thermal Properties
The thermal properties of a Sil-Pad material and your requirements for thermal performance probably have more to do with your selection of a Sil-Pad than any other factor. Discrete semiconductors, under normal operating conditions, dissipate waste power which raises the junction temperature of the device. Unless sufficient heat is conducted out of the device, its electrical performance and parameters are changed. A 10C rise in junction temperature can reduce the mean-time-to-failure of a device by a factor of two. Also, above 25C, the semiconductor's total power handling capability will be reduced by a derating factor inherent to the device.
SIL-PAD
5.14
2.90 2.45 2.68 2.21 2.41
3.13 2.76
2.0 1.51
1.86
2.01 1.23
1.76
SP1200
(0.008)
(0.010)
53
Sil-Pad Thermally Conductive
Sil-Pad 400 .007 in. Color Thickness (in/mm) Thermal Performance TO-220 Test @ 50 psi C/W Thermal Impedance (Cin2/W) Thermal Conductivity (W/m-K nominal) Voltage Breakdown (Vac) Continuous Use Temperature (C) Construction Gray Sil-Pad 400 .009 in. Gray Sil-Pad 800 Gold Sil-Pad 900S Pink Sil-Pad 980 Mauve Sil-Pad 1100ST Yellow Sil-Pad 1200 Black Sil-Pad A1500 Green
.007 .001 .009 .001 .005 .001 .009 .001 .009 .001 .012 .001 .009 .001 .010 .001 (.18 .025) (.23 .025) (.13 .025) (.23 .025) (.23 .025) (.30 .025) (.23 .025) (.25 .025) 5.14 1.13 0.9 3500 -60 to 180 Silicone/ Fiberglass 6.61 1.45 0.9 4500 -60 to 180 Silicone/ Fiberglass 2.45 0.53 1.6 2000 -60 to 180 Silicone/ Fiberglass 2.50 0.61 1.6 4500 -60 to 180 Silicone/ Fiberglass 4.52 1.07 1.2 4000 -40 to 150 Silicone/ Fiberglass 2.68 0.81 1.1 3000 -60 to 180 Silicone/ Fiberglass 2.41 0.53 1.8 6000 -60 to 180 Silicone/ Fiberglass 2.21 0.42 2.0 4000 -60 to 180 Silicone/ Fiberglass
Sil-Pad Applications
SIL-PAD
Here, Sil-Pad 900S enhances the thermal transfer from this FR-4 circuit board with thermal vias to the metal base plate.
Sil-Pad is available in over 100 standard configurations for common JEDEC package outlines.
The circuit board above shows punched parts interfacing screwmounted transistors to a finned heat sink.
This application uses Sil-Pad to isolate the mounting brackets from the assembly frame.
A common Sil-Pad application includes TO-220 transistors mounted in a row on a heat rail.
These Sil-Pad applications show clip mounting of transistors on the left and screw mounting to an aluminum bracket on the right.
Choose a Sil-Pad that optimizes thermal performance for your mounting method screw, clip, spring, bar, etc.
Sil-Pad 980 is used extensively in industrial applications having excellent cut-through and abrasion resistance.
54
Insulator Selection Table

Sil-Pad 1500ST Blue Sil-Pad 2000 White Sil-Pad A2000 White Sil-Pad K-4 Gray Sil-Pad K-6 Bluegreen Sil-Pad K-10 Beige Poly-Pad 1000 Yellow Poly-Pad K-4 Tan Poly-Pad K-10 Yellow Test Method Visual
.008 .001 .010 .001 .015 .001 .006 .001 .006 .001 .006 .001 .009 .001 .006 .001 .006 .001 ASTM D374 (.20 .025) (.25 .025) (.38 .025) (.15 .025) (.15 .025) (.15 .025) (.23 .025) (.15 .025) (.15 .025) 1.51 0.23 1.8 3000 -60 to 180 Silicone/ Fiberglass 2.02 0.33 3.5 4000 -60 to 200 Silicone/ Fiberglass 1.86 0.32 3.0 4000 -60 to 200 Silicone/ Fiberglass 3.13 0.62 0.9 6000 -60 to 180 Silicone/ Film 2.76 0.64 1.1 6000 -60 to 180 Silicone/ Film 2.01 0.41 1.3 6000 -60 to 180 Silicone/ Film 3.74 0.82 1.2 1300 -20 to 150 Polyester/ Fiberglass 4.34 0.95 0.9 5500 -20 to 150 Polyester/ Film 2.75 0.60 1.3 6000 -20 to 150 Polyester/ Film ASTM D5470 ASTM D5470 ASTM D5470 ASTM D149
Sil-Pad Comparison Made Simple!

Comparing thermally conductive interface materials has never been easier.
Simply go to the Thermal Materials section of the Bergquist website (www.bergquistcompany.com) and select Compare Material Properties. Then select up to three separate products and this handy comparison tool will automatically chart thermal resistance values and display a material properties table of the selected materials. The materials comparison tool can be used for most Bergquist thermal materials, including Sil-Pad, Hi-Flow, Gap Pad, Q-Pad, Bond-Ply and Liqui-Bond products.
SIL-PAD
55
Sil-Pad Comparison Data
TO-220 Thermal Performance

Q-Pad Materials Non-Electrically Isolating
2.75 2.50 2.25
Thermal Performance (C/W)
Q-Pad 3 Q-Pad II
Sil-Pad High Value Materials

9.25 8.25 Thermal Performance (C/W) 7.25 6.25 5.25 4.25 3.25 2.25 1.25
Sil-Pad 400, 9 mil Sil-Pad 400, 7 mil Sil-Pad 980 Sil-Pad 900S Sil-Pad 800 Sil-Pad 1100ST
2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 0 50 100 150 200
Interface Pressure (psi)
50
100
150
200
Sil-Pad High Performance Materials

3.25 3.05
Sil-Pad A1500, 10 mil Sil-Pad 1200, 9 mil Sil-Pad 2000, 10 mil Sil-Pad A2000, 15 mil Sil-Pad 1500ST, 8 mil
Sil-Pad Polyimide-Based Materials

4.25 4.00 3.75 Thermal Performance (C/W) 3.50 3.25 3.00 2.75 2.50 2.25 2.00 1.75 1.50 1.25
Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10
SIL-PAD
2.85 Thermal Performance (C/W) 2.65 2.45 2.25 2.05 1.85 1.65 1.45 1.25 0 50
100
150
200
50
100
150
200
56
Sil-Pad 400
The Original Sil-Pad Material Features and Benefits

Thermal impedance: 1.13C-in2/W (@50 psi) Original Sil-Pad material Excellent mechanical and physical characteristics Flame retardant
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Breaking Strength (lbs/inch) / (kN/m) Elongation (%45 to Warp and Fill) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi)
TYPICAL PROPERTIES OF SIL-PAD 400

IMPERIAL VALUE Gray Fiberglass 0.007, 0.009 85 30 54 3000 -76 to 356 3500, 4500 5.5 1011 V-O 0.9 10 6.62 8.51 1.82 2.34 25 5.93 7.62 1.42 1.83 METRIC VALUE Gray Fiberglass 0.178, 0.229 85 5 54 20 -60 to 180 3500, 4500 5.5 1011 V-O 0.9 50 5.14 6.61 1.13 1.45 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 100 4.38 5.63 0.82 1.05 200 3.61 4.64 0.54 0.69
Sil-Pad 400 is a composite of silicone rubber and fiberglass.The material is flame retardant and is specially formulated for use as a thermally conductive insulator.The primary use for Sil-Pad 400 is to electrically isolate power sources from heat sinks. Sil-Pad 400 has excellent mechanical and physical characteristics. Surfaces are pliable and allow complete surface contact with excellent heat dissipation. Sil-Pad 400 actually improves its thermal resistance with age. The reinforcing fiberglass provides excellent cut-through resistance. In addition, Sil-Pad 400 is non-toxic and resists damage from cleaning agents.
TO-220 Thermal Performance (C/W) 0.007" TO-220 Thermal Performance (C/W) 0.009" Thermal Impedance (C-in2/W) 0.007" (1) Thermal Impedance (C-in2/W) 0.009" (1)
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.

Power supplies Power semiconductors Automotive electronics Motor controls
Sheet form, die-cut parts and roll form; with or without pressure sensitive adhesive
SIL-PAD

SP400 0.007 AC 12/250 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side; or 00 = no adhesive Standard thicknesses available: 0.007", 0.009" SP400 = Sil-Pad 400 Material
Section B
Section C
Section D
Section A
57
Sil-Pad 800
High Performance Insulator for Low-Pressure Applications Features and Benefits

Thermal impedance: 0.45C-in2/W (@50 psi) High value material Smooth and highly compliant surface Electrically isolating
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Elongation (%45 to Warp and Fill) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi)

IMPERIAL VALUE Gold Fiberglass 0.005 91 20 1700 -76 to 356 3000 6.0 1010 V-O 1.6 10 3.56 0.92 25 3.01 0.60 METRIC VALUE Gold Fiberglass 0.127 91 20 12 -60 to 180 3000 6.0 1010 V-O 1.6 50 2.45 0.45 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 100 2.05 0.36 200 1.74 0.29
The Sil-Pad 800 family of thermally conductive insulation materials is designed for applications requiring high thermal performance and electrical isolation.These applications also typically have low mounting pressures for component clamping. Sil-Pad 800 material combines a smooth and highly compliant surface characteristic with high thermal conductivity.These features optimize the thermal resistance properties at low pressure. Applications requiring low component clamping forces include discrete semiconductors (TO-220,TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly but apply a limited amount of force to the semiconductor.The smooth surface texture of Sil-Pad 800 minimizes interfacial thermal resistance and maximizes thermal performance.

Power supplies Automotive electronics Motor controls Power semiconductors
SIL-PAD

SP800 0.005 AC 1212 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.005" SP800 = Sil-Pad 800 Material
Section C
Section A
Section B
58
Section D
Sil-Pad 900S
High Performance Insulator for Low-Pressure Applications Features and Benefits

Thermal impedance: 0.61C-in2/W (@50 psi) Electrically isolating Low mounting pressures Smooth and highly compliant surface General-purpose thermal interface material solution
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Elongation (%45 to Warp and Fill) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (1)
TYPICAL PROPERTIES OF SIL-PAD 900S

IMPERIAL VALUE Pink Fiberglass 0.009 92 20 1300 -76 to 356 5500 6.0 1010 V-O 1.6 10 3.96 0.95 25 3.41 0.75 METRIC VALUE Pink Fiberglass 0.229 92 20 9 -60 to 180 5500 6.0 1010 V-O 1.6 50 2.90 0.61 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 100 2.53 0.47 200 2.32 0.41
The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation.These applications also typically have low mounting pressures for component clamping. Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity.These features optimize the thermal resistance properties at low pressures. Applications requiring low component clamping forces include discrete semiconductors (TO-220,TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor.The smooth surface texture of Sil-Pad 900S minimizes interfacial thermal resistance and maximizes thermal performance.

SIL-PAD

SP900S 0.009 AC 00 ACME 951753 Rev B
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.009" SP900S = Sil-Pad 900S Material
Section A
Section B
Section C
Section D
59
Sil-Pad 980
High Cut-Through Resistant, Electrically Insulating,Thermally Conductive Material Features and Benefits
Thermal impedance: 1.07C-in2/W (@50 psi) Excellent cut-through resistance Use in screw-mounted applications with cut-through problems
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Breaking Strength (lbs/inch) / (kN/m) Elongation (%45 to Warp and Fill) Cut-Through (lbs) / (kg) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K)

IMPERIAL VALUE Mauve Fiberglass 0.009 95 140 10 750 -40 to 302 4000 6.0 1010 V-O 1.2 10 5.48 1.51 25 5.07 1.22 METRIC VALUE Mauve Fiberglass 0.229 95 26 10 340 -40 to 150 4000 6.0 1010 V-O 1.2 50 4.52 1.07 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 100 4.04 0.89 200 3.56 0.53
In addition to excellent heat transfer and dielectric properties, Sil-Pad 980 is specially formulated for high resistance to crushing and cut-through typically found in high-pressure applications where surface imperfections such as burrs and dents are inherently common (e.g. heavily-machined metal surfaces manufactured from extrusions or castings). With a field-proven history of reliability, Sil-Pad 980 is Bergquist's best material for cut-through resistance in screw-mounted and other applications with cut-through problems.
THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (1)

Silicone-sensitive assemblies Telecommunications Automotive electronics
SIL-PAD

SP980 0.009 AC 00 ACME 951753 Rev B
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.009" SP980 = Sil-Pad 980 Material
Section B
Section C
60
Section D
Section A
Sil-Pad 1100ST
Affordable, Electrically Insulating,Thermally Conductive, Soft Tack Elastomeric Material Features and Benefits
Inherent tack on both sides for exceptional thermal performance and easy placement Re-positionable for higher utilization, ease of use and assembly error reduction Lined on both sides for ease of handling prior to placement in high volume assemblies Exhibits exceptional thermal performance even at a low mounting pressure Fiberglass reinforced Value alternative to Sil-Pad 1500ST
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Inherent Surface Tack (1or 2 sided) Hardness (Shore 00) (1) Breaking Strength (lb/inch) / (kN/m) Elongation (% - 45 to Warp and Fill) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE
VS.
TYPICAL PROPERTIES OF SIL-PAD 1100ST

IMPERIAL VALUE Yellow Fiberglass 0.012 2 85 2.6 16 220 -76 to 356 5000 5.0 1010 V-O 1.1 PRESSURE 10 2.72 0.75 25 2.71 0.71 50 2.68 0.66 100 2.62 0.61 200 2.23 0.57 METRIC VALUE Yellow Fiberglass 0.305 2 85 0.5 16 1.5 -60 to 180 5000 5.0 1010 V-O 1.1 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (2)
1) Thirty second delay value Shore 00 hardness scale. 2) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Sil-Pad 1100ST (Soft Tack) is a fiberglassreinforced thermal interface material featuring inherent tack on both sides.The material exhibits excellent thermal performance at low mounting pressures.The material is supplied on two liners for exceptionally easy handling prior to auto-placement in high-volume assemblies.The material is ideal for placement between an electronic power device and its heat sink.

Automotive ECMs Power supplies Motor controls Between an electronic power device and its heat sink
Sheet form, die-cut parts and roll form Top and bottom liners
SIL-PAD
Standard Options
61
Sil-Pad 1200
Exceptional Performance,Thermally Conductive Elastomeric Material Features and Benefits

Thermal Impedance: 0.53 C-in /W (@ 50 psi)
2

PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness Bulk Rubber (Shore 00) Elongation (% - 45 to warp and fill) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE
VS
IMPERIAL VALUE Black Fiberglass 0.009 to 0.016 80 20 1300 -76 to 356 6000 8.0 10
9
METRIC VALUE Black Fiberglass 0.229 to 0.406 80 20 9 -60 to 180 6000 8.0 10
9
TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470
Exceptional thermal performance at lower application pressures Smooth and non-tacky on both sides for easy re-positioning, ease of use and assembly error reduction Superior breakdown voltage and surface wet out values Designed for applications where electrical isolation is critical Excellent cut-through resistance, designed for screw and clip mounted applications
V-O 1.8 10 2.82 0.71 25 2.64 0.62
V-O 1.8 50 2.41 0.53
PRESSURE 100 2.13 0.47 200 1.90 0.41
Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (2)
1)This is the measured thermal conductivity of the Sil-Pad Compound. 2) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.

Automotive electronics control modules Motor controls Sil-Pad 1200 is a silicone based, fiberglassreinforced thermal interface material featuring a smooth, highly compliant surface.The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. Sil-Pad 1200 exhibits exceptional thermal performance at low and high application pressures.The material is ideal for placement between electronic power devices and a heatsink for screw and clip mounted applications. Discrete devices Power supplies Audio amplifiers Telecommunications
Sheet form, slit-to-width roll form Die-cut parts 9, 12 and 16 mil thicknesses Adhesive coating We produce thousands of specials and customs. Tooling charges vary depending on tolerances and complexity of the part.
SIL-PAD

SP1200 0.009 AC
Standard Options
___ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12' x 250" rolls or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.009", 0.012", 0.016" SP1200 = Sil-Pad 1200 Material
62
Sil-Pad A1500
Electrically Insulating,Thermally Conductive Elastomeric Material Features and Benefits

Thermal impedance: 0.42C-in2/W (@50 psi) Elastomeric compound coated on both sides
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Breaking Strength (lbs/inch) / (kN/m) Elongation (% - 45 to Warp and Fill) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K)
TYPICAL PROPERTIES OF SIL-PAD A1500

IMPERIAL VALUE Green Fiberglass 0.010 80 65 40 -76 to 356 6000 7.0 1011 V-O 2.0 10 3.03 0.59 25 2.62 0.50 METRIC VALUE Green Fiberglass 0.254 80 12 40 -60 to 180 6000 7.0 1011 V-O 2.0 50 2.21 0.42 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 100 1.92 0.34 200 1.78 0.31
Bergquist Sil-Pad A1500 is a silicone-based, thermally conductive and electrically insulating material. It consists of a cured silicone elastomeric compound coated on both sides of a fiberglass reinforcement layer. Sil-Pad A1500 performs well under clamping pressure up to 200 psi and is an excellent choice for high performance applications requiring electrical isolation and cut-through resistance.

SIL-PAD
Sheet form, die-cut parts, and roll form With or without pressure sensitive adhesive

SPA1500 0.010 AC 12/250 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.010" SPA1500 = Sil-Pad A1500 Material
Section B
Section C
Section D
Section A
63
Sil-Pad 1500ST
Electrically Insulating,Thermally Conductive, Soft Tack Elastomeric Material Features and Benefits
Thermal impedance: 0.23C-in2/W (@50 psi) Naturally tacky on both sides Pad is repositionable Excellent thermal performance Auto-placement and dispensable
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore 00) Breaking Strength (lbs/inch) / (kN/m) Elongation (% - 45 to Warp and Fill) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi)
TYPICAL PROPERTIES OF SIL-PAD 1500ST

IMPERIAL VALUE Blue Fiberglass 0.008 75 1.9 22 238 -76 to 356 3000 6.1 1011 V-O 1.8 10 1.54 0.37 25 1.52 0.28 METRIC VALUE Blue Fiberglass 0.203 75 0.34 22 1.6 -60 to 180 3000 6.1 1011 V-O 1.8 50 1.51 0.23 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L. 94 ASTM D5470 100 1.49 0.21 200 1.46 0.20
Bergquist Sil-Pad 1500ST (Soft Tack) is a fiberglass reinforced thermal interface material that is naturally tacky on both sides. Sil-Pad 1500ST exhibits superior thermal performance when compared to the competitors thermal interface materials. Sil-Pad 1500ST is supplied in sheet or roll form for exceptional auto-dispensing and auto-placement in high volume assemblies. Sil-Pad 1500ST is intended for placement between an electronic power device and its heat sink.

Power supplies Automotive electronics Motor controls
Sheet form, die-cut parts and slit-to-width roll form
SIL-PAD

SP1500ST 0.008 02 1012 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls, or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.008" SP1500ST = Sil-Pad 1500ST Material
Section A
Section B
Section C
64
Section D
Sil-Pad 2000
Higher Performance, High Reliability Insulator Features and Benefits

Thermal impedance: 0.33C-in2/W (@50 psi) Optimal heat transfer High thermal conductivity: 3.5 W/m-K
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W)

IMPERIAL VALUE White Fiberglass 0.010 to 0.020 90 -76 to 392 4000 4.0 1011 V-O 3.5 10 2.61 0.57 25 2.32 0.43 METRIC VALUE White Fiberglass 0.254 to 0.508 90 -60 to 200 4000 4.0 1011 V-O 3.5 50 2.02 0.33 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470 100 1.65 0.25 200 1.37 0.20
Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding aerospace and commercial applications. Sil-Pad 2000 is a silicone elastomer formulated to maximize the thermal and dielectric performance of the filler/binder matrix.The result is a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high-reliability electronic packaging applications.

Power supplies Power semiconductors Avionics Motor controls Aerospace
Sheet form, die-cut parts With or without pressure sensitive adhesive

SP2000 0.010 AC 00 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.010", 0.015", 0.020" SP2000 = Sil-Pad 2000 Material
SIL-PAD
Section C
Section D
Section A
Section B
65
Sil-Pad A2000
Higher Performance, High Reliability Insulator Features and Benefits

Thermal impedance: 0.32C-in2/W (@50 psi) Optimal heat transfer High thermal conductivity: 3.0 W/m-K
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Heat Capacity (J/g-K) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi)
TYPICAL PROPERTIES OF SIL-PAD A2000

IMPERIAL VALUE White Fiberglass 0.015 to 0.020 90 1.0 -76 to 392 4000 7.0 1011 V-O 3.0 10 2.05 0.53 25 1.94 0.40 METRIC VALUE White Fiberglass 0.381 to 0.508 90 1.0 -60 to 200 4000 7.0 1011 V-O 3.0 50 1.86 0.32 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM E1269 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470 100 1.79 0.28 200 1.72 0.26
Sil-Pad A2000 is a conformable elastomer with very high thermal conductivity that acts as a thermal interface between electrical components and heat sinks. Sil-Pad A2000 is for applications where optimal heat transfer is a requirement. This thermally conductive silicone elastomer is formulated to maximize the thermal and dielectric performance of the filler/binder matrix.The result is a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high reliability electronic packaging applications.
TO-220 Thermal Performance (C/W) 0.015" Thermal Impedance (C-in2/W) 0.015" (1)

Motor drive controls Avionics High-voltage power supplies Power transistor / heat sink interface
SIL-PAD

SPA2000 0.015 00 1012 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.015", 0.020" SPA2000 = Sil-Pad A2000 Material
Section A
Section B
Section C
66
Section D
Sil-Pad K-4
The Original Polyimide-Based Insulator Features and Benefits

Thermal impedance: 0.48C-in2/W (@50 psi) Withstands high voltages High dielectric strength Very durable
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Breaking Strength (lbs/inch) / (kN/m) Elongation (%) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K)
TYPICAL PROPERTIES OF SIL-PAD K-4

IMPERIAL VALUE Gray Polyimide 0.006 90 30 40 5000 -76 to 356 6000 5.0 1012 VTM-O 0.9 10 3.66 1.07 25 3.43 0.68 METRIC VALUE Gray Polyimide 0.152 90 5 40 34 -60 to 180 6000 5.0 1012 VTM-O 0.9 50 3.13 0.48 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470 100 2.74 0.42 200 2.42 0.38
Sil-Pad K-4 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. Sil-Pad K-4 combines the thermal transfer properties of well-known Sil-Pad rubber with the physical properties of a film. Sil-Pad K-4 is a durable insulator that withstands high voltages and requires no thermal grease to transfer heat. Sil-Pad K-4 is available in customized shapes and sizes.

Power supplies Power semiconductors Motor controls
SIL-PAD

SPK4 0.006 00 12/250 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.006" SPK4 = Sil-Pad K4 Material
Section A
Section B
Section C
Section D
67
Sil-Pad K-6
The Medium Performance Polyimide-Based Insulator Features and Benefits

Thermal impedance: 0.49C-in2/W (@50 psi) Physically strong dielectric barrier against cut-through Medium performance film

IMPERIAL VALUE Bluegreen Polyimide 0.006 90 30 40 5000 -76 to 356 6000 4.0 1012 VTM-O 1.1 10 3.24 0.82 25 3.03 0.62 METRIC VALUE Bluegreen Polyimide 0.152 90 5 40 34 -60 to 180 6000 4.0 1012 VTM-O 1.1 50 2.76 0.49 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470 100 2.45 0.41 200 2.24 0.36
Sil-Pad K-6 is a medium performance, filmbased thermally conductive insulator.The film is coated with a silicone elastomer to deliver high performance and provide a continuous, physically strong dielectric barrier against cut-through and resultant assembly failures.

SIL-PAD

SPK6 0.006 AC 12/250 NA
Standard Options
Section E
Section A
Section B
Section C
68
Section D
Sil-Pad K-10
The High Performance Polyimide-Based Insulator Features and Benefits

Thermal impedance: 0.41C-in2/W (@50 psi) Tough dielectric barrier against cut-through High performance film Designed to replace ceramic insulators

IMPERIAL VALUE Beige Polyimide 0.006 90 30 40 5000 -76 to 356 6000 3.7 1012 VTM-O 1.3 10 2.35 0.86 25 2.19 0.56 METRIC VALUE Beige Polyimide 0.152 90 5 40 34 -60 to 180 6000 3.7 1012 VTM-O 1.3 50 2.01 0.41 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470 100 1.87 0.38 200 1.76 0.33
Sil-Pad K-10 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance. Sil-Pad K-10 is designed to replace ceramic insulators such as Beryllium Oxide, Boron Nitride and Alumina. Ceramic insulators are expensive and they break easily. Sil-Pad K-10 eliminates breakage and costs much less than ceramics.

SIL-PAD

SPK10 0.006 AC 1212 NA
Standard Options
Section E
Section A
Section B
Section C
Section D
69
Q-Pad II
Foil-Format Grease Replacement for Maximum Heat Transfer Features and Benefits
Thermal impedance: 0.22C-in2/W (@50 psi) Maximum heat transfer Aluminum foil coated both sides Designed to replace thermal grease
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (1)
TYPICAL PROPERTIES OF Q-PAD II

IMPERIAL VALUE Black Aluminum 0.006 93 -76 to 356 Non-Insulating NA 10 2 V-O 2.5 10 2.44 0.52 25 1.73 0.30 METRIC VALUE Black Aluminum 0.152 93 -60 to 180 Non-Insulating NA 10 2 V-O 2.5 50 1.23 0.22 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470 100 1.05 0.15 200 0.92 0.12
Q-Pad II is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber.The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. Q-Pad II is the ideal thermal interface material to replace messy thermal grease compounds. Q-Pad II eliminates problems associated with grease such as contamination of reflow solder or cleaning operations. Unlike grease, Q-Pad II can be used prior to these operations. Q-Pad II also eliminates dust collection which can cause possible surface shorting or heat buildup.

Between a transistor and a heat sink Between two large surfaces such as an L-bracket and the chassis of an assembly Between a heat sink and a chassis Under electrically isolated power modules or devices such as resistors, transformers and solid state relays
SIL-PAD
Standard Options
70
Q-Pad 3
Glass-Reinforced Grease Replacement Thermal Interface Features and Benefits

Thermal impedance: 0.35C-in2/W (@50 psi) Eliminates processing constraints typically associated with grease Conforms to surface textures Easy handling May be installed prior to soldering and cleaning without worry
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (1)
TYPICAL PROPERTIES OF Q-PAD 3

IMPERIAL VALUE Black Fiberglass 0.005 86 -76 to 356 Non-Insulating NA 10 2 V-O 2.0 10 2.26 0.65 25 1.99 0.48 METRIC VALUE Black Fiberglass 0.127 86 -60 to 180 Non-Insulating NA 10 2 V-O 2.0 50 1.76 0.35 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470 100 1.53 0.24 200 1.30 0.16
Bergquist Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. Q-Pad 3 may be installed prior to soldering and cleaning without worry.When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables Q-Pad 3 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.

Between a transistor and a heat sink Between two large surfaces such as an L-bracket and the chassis of an assembly Between a heat sink and a chassis Under electrically isolated power modules or devices such as resistors, transformers and solid state relays
SIL-PAD

Q3 0.005 AC 12/250 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.005" Q3 = Q-Pad 3 Material
Section A
Section B
Section C
Section D
71
Poly-Pad 400
Polyester-Based,Thermally Conductive Insulation Material Features and Benefits

Thermal impedance: 1.13C-in2/W (@50 psi) Polyester based For applications requiring conformal coatings Designed for silicone-sensitive standard applications
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Breaking Strength (lbs/inch)/(kN/m) Elongation(% - 45 to Warp and Fill) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) THERMAL Thermal Conductivity (W/m-K) Flame Rating THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W)
TYPICAL PROPERTIES OF POLY-PAD 400

IMPERIAL VALUE Tan Fiberglass 0.009 90 100 10 7000 -4 to 302 2500 5.5 1011 0.9 V-O 10 5.85 1.62 25 5.61 1.35 METRIC VALUE Tan Fiberglass 0.229 90 18 10 48 -20 to 150 2500 5.5 1011 0.9 V-O 50 5.13 1.13 100 4.59 0.86 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 ASTM D5470 U.L. 94 200 4.12 0.61
Poly-Pad 400 is a fiberglass-reinforced insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive applications. Poly-Pads are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (telecomm and certain aerospace applications). Poly-Pads are constructed with ceramic-filled polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad family offers a complete range of performance characteristics to match individual applications.

SIL-PAD
Sheet form, die-cut parts and roll form With or without pressure sensitive adhesive We produce thousands of specials.Tooling charges vary depending on tolerances and the complexity of the part.

PP400 0.009 00 1212 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.009" PP400 = Poly-Pad 400 Material
Section A
Section B
Section C
72
Section D
Poly-Pad 1000

Thermal impedance: 0.82C-in2/W (@50 psi) Polyester based For applications requiring non-silicone conformal coatings Designed for silicone-sensitive applications requiring high performance
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Breaking Strength (lbs/inch) / (kN/m) Elongation (%) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (1)
TYPICAL PROPERTIES OF POLY-PAD 1000

IMPERIAL VALUE Yellow Fiberglass 0.009 90 100 10 7000 -4 to 302 2500 4.5 1011 1.2 10 4.70 1.30 25 4.25 1.02 METRIC VALUE Yellow Fiberglass 0.229 90 18 10 48 -20 to 150 2500 4.5 1011 1.2 50 3.74 0.82 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 ASTM D5470 100 3.27 0.61 200 2.89 0.43
Poly-Pad 1000 is a fiberglass-reinforced insulator coated with a filled polyester resin. The material offers superior thermal resistance for high performance applications. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive applications. Poly-Pads are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (telecomm and certain aerospace applications). Poly-Pads are constructed with ceramic-filled polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad family offers a complete range of performance characteristics to match individual applications.

SIL-PAD

PP1000 0.009 00 1212 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.009" PP1000 = Poly-Pad 1000 Material
Section A
Section B
Section C
Section D
73
Poly-Pad K-4

Thermal impedance: 0.95C-in2/W (@50 psi) Polyester based For applications requiring non-silicone conformal coatings Designed for silicone-sensitive applications Excellent dielectric and physical strength
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Hardness (Shore A) Breaking Strength (lbs/inch) / (kN/m) Elongation (%) Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (1) 0.9 10 5.64 1.55 25 5.04 1.21 0.9 50 4.34 0.95 ASTM D5470 100 3.69 0.70 200 3.12 0.46
TYPICAL PROPERTIES OF POLY-PAD K-4

IMPERIAL VALUE Tan Polyimide 0.006 90 30 40 5000 -4 to 302 6000 5.0 1012 V-O METRIC VALUE Tan Polyimide 0.152 90 5 40 34 -20 to 150 6000 5.0 1012 V-O TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L.94
Poly-Pad K-4 is a composite of film coated with a polyester resin.The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive applications. Poly-Pads are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (telecomm and certain aerospace applications). Poly-Pads are constructed with ceramic-filled polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad family offers a complete range of performance characteristics to match individual applications.

Power supplies Motor controls Power semiconductors
SIL-PAD

PPK4 0.006 00 12/250 NA
Standard Options
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.006" PPK4 = Poly-Pad K-4 Material
Section C
Section A
Section B
Section D
74
Section E
Poly-Pad K-10

Thermal impedance: 0.60C-in2/W (@50 psi) Polyester based For applications requiring non-silicone conformal coatings Designed for silicone-sensitive applications Excellent dielectric strength and thermal performance TYPICAL PROPERTIES OF POLY-PAD K-10
PROPERTY IMPERIAL VALUE Color Yellow Reinforcement Carrier Polyimide Thickness (inch) / (mm) 0.006 Hardness (Shore A) 90 Breaking Strength (lbs/inch) / (kN/m) 30 Elongation (%) 40 Tensile Strength (psi) / (MPa) 5000 Continuous Use Temp (F) / (C) -4 to 302 ELECTRICAL Dielectric Breakdown Voltage (Vac) 6000 Dielectric Constant (1000 Hz) 3.7 Volume Resistivity (Ohm-meter) 1012 Flame Rating V-O THERMAL Thermal Conductivity (W/m-K) 1.3 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 TO-220 Thermal Performance (C/W) 3.76 Thermal Impedance (C-in2/W) (1) 1.04 METRIC VALUE Yellow Polyimide 0.152 90 5 40 34 -20 to 150 6000 3.7 1012 V-O 1.3 25 3.35 0.80 50 2.75 0.60 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470 100 2.30 0.43 200 2.03 0.30
Poly-Pad K-10 is a composite of film coated with a polyester resin.The material offers superior thermal performance for your most critical applications with a thermal resistance of 0.2C-in2/W as well as excellent dielectric strength. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive applications. Poly-Pads are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (telecomm and certain aerospace applications). Poly-Pads are constructed with ceramic-filled polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad family offers a complete range of performance characteristics to match individual applications.

Power supplies Motor controls Power semiconductors
SIL-PAD

PPK10 0.006 AC 1212 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.006" PPK10 = Poly-Pad K-10 Material
Section A
Section B
Section C
Section D
75
Sil-Pad Tubes
Silicone-Based,Thermally Conductive Tubes Features and Benefits

Thermal conductivity: SPT 400 0.9 W/m-K SPT 1000 1.2 W/m-K For clip-mounted plastic power packages
PROPERTY Color Thickness / Wall (inch) / (mm) Hardness (Shore A) Breaking Strength (lbs/inch) / (kN/m) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) Thermal Impedance (C-in /W) (1)
2
TYPICAL PROPERTIES OF SIL-PAD TUBE 400

IMPERIAL VALUE Gray/Green 0.012 80 6 -76 to 356 5000 5.5 1011 V-O 0.9 0.6 IMPERIAL VALUE Brown 0.012 80 6 -76 to 356 5000 4.5 1011 V-O 1.2 0.4 METRIC VALUE Gray/Green 0.305 80 1 -60 to 180 5000 5.5 1011 V-O 0.9 0.6 METRIC VALUE Brown 0.30 80 1 -60 to 180 5000 4.5 1011 V-O 1.2 0.4 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470 ASTM D5470 TEST METHOD Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470 ASTM D5470
TYPICAL PROPERTIES OF SIL-PAD TUBE 1000 SPT 400 and SPT 1000 (Sil-Pad Tubes) provide thermally conductive insulation for clipmounted plastic power packages. Sil-Pad Tubes are made of silicone rubber with high thermal conductivity. Sil-Pad Tube 1000 is best suited for higher thermal performance. Sil-Pad Tube 400 is ideal for applications requiring average thermal conductivity and economy. Sil-Pad Tube 400 and Sil-Pad Tube 1000 are designed to meet VDE, U.L. and TUV agency requirements.
PROPERTY Color Thickness / Wall (inch) / (mm) Hardness (Shore A) Breaking Strength (lbs/inch) / (kN/m) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating THERMAL Thermal Conductivity (W/m-K) Thermal Impedance (C-in2/W) (1)
SIL-PAD

Clip-mounted power semiconductors TO-220,TO-218,TO-247 and TO-3P
Standard Dimensions
A = Wall Thickness: .305 mm (.012") + .10 mm/ -0.0 mm (+.004" / -0.0") B = Inner Diameter: 11 mm (.433") or 13.5 mm (.532") 1.0 mm ( .039") C = Length: 25 mm (.985") or 30 mm (1.18") +3.18 mm / -0.0 mm (+ .125" / - 0.0") Special lengths are available. For more information, contact a Bergquist Sales Representative. Ordering Procedure: Sample: SPT 400 ___ - ___ - ___ A B C
C A B
TO-220,TO-218,TO-247 and TO-3P
76
Sil-Pad Shield
Bonded Laminate of Sil-Pad with a Copper Shield Features and Benefits

Bonded laminate Electrically isolating Copper shield between layers of Sil-Pad Pre-tinned 60/40 solder point for easy grounding TYPICAL PROPERTIES OF SIL-PAD SHIELD
PROPERTY Thickness / Total (inches) Shield / Copper Thickness (inches) Approx.Thermal Resistance (TO-3) (C/W) Min. Breakdown Voltage Between Device and Copper (Volts) Capacitance @ 1000 Hz and 5 Volts (pF) Dissipation Factor @ 1000 Hz and 5 Volts (Power Factor) Dielectric Constant @ 1000 Hz and 5 Volts Continuous Use Temp. (C) Recommended Torque (TO-3) (inch-pounds) VALUE 0.019 0.0015 0.85 - 1.0 4500 50 0.0155 5.5 -60 to 180 6-8 TEST METHOD *** *** *** ASTM D149 *** ASTM D150 ASTM D150 *** ***
PROBLEM: Radio Frequency Interference (RFI) is produced by heat sink current.The capacitance between a TO-3 encapsulated transistor and its heat sink is typically 100pf when a mica or other insulating washer is used. A power supply constructed with a standard insulator and a grounded heat sink can be expected to produce about 10 times more interference than is permitted. SOLUTION: 1.The use of chokes, filters and LC networks which have to be designed into the circuitry. OR 2. Constructing a shield between the transistor and its heat sink by replacing the mica insulator with a Sil-Pad Shield (see illustration).

Switch mode power supplies EMI / RFI shield between PCBs
Sil-Pad Shield is available in many custom configurations to meet special requirements.Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad Shield is a laminate of copper with Sil-Pad thermally conductive insulators. Sil-Pad Shield provides: Shielding effectiveness of 50dB or higher Good thermal transfer Reduced labor costs due to the elimination of having to apply thermal grease
SIL-PAD
77
Bond-Ply and Liqui-Bond Adhesives

Bond-Ply Adhesive Tapes

Available in a pressure sensitive adhesive or laminating format, the Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion.
Liqui-Bond Liquid Adhesives

Bergquist Liqui-Bond liquid adhesives are high performance, thermally conductive, liquid adhesive materials.These form-in-place elastomers are ideal for coupling hot electronic components mounted on PC boards with an adjacent metal case or heat sink.
Typical Bond-Ply Applications
Typical Liqui-Bond Applications
Features
High performance, thermally conductive, pressure sensitive adhesive Material immediately bonds to the target surface Bond strength increases over time when repeatedly exposed to high continuous-use temperatures
Features
Excellent low and high temperature mechanical and chemical stability
Benefits
Before cure, Liqui-Bond flows under pressure like a grease. After cure, it bonds the components, eliminating the need for mechanical fasteners. Additional benefits include: Low modulus provides stress-absorbing flexibility Supplied as a one-part material with an elevated temperature curing system Offers infinite thickness with little or no stress during displacement Eliminates need for specific pad thickness and die-cut shapes for individual applications
Benefits
Provide an excellent dielectric barrier Excellent wet-out to most types of component surfaces including plastic Bond-Ply 400 is unreinforced to increase conformance and wet-out on low surface energy materials Eliminates need for screws, clip mounts or fasteners
Options Options
Supplied in sheet, die-cut, roll and tabulated forms Available in thickness range of 3 to 11 mil The growing Liqui-Bond family offers a variety of choices to meet the customers performance, handling and process needs.
BOND-PLY
Applications
Liqui-Bond products are intended for use in thermal interface applications where a structural bond is a requirement.This material is formulated for high cohesive and adhesive strength and cures to a low modulus.Typical applications include: Automotive electronics Telecommunications Computer and peripherals Between any heat-generating semiconductor and a heat sink
Custom coated thickness
Applications
Attach a heat sink to a graphics processing unit Attach a heat spreader to a motor control PCB Attach a heat sink to a power converter PCB Attach a heat sink to a drive processor
78

Q: What is the primary difference between the A:
Bond-Ply 660B and Bond-Ply 100 products? Bond-Ply 660B utilizes a dielectric film, replacing the fiberglass inherent in our Bond-Ply 100 series products.The addition of the film allows for high dielectric performance without additional product thickness.
Q: What application pressure is required to optimize

bond strength with Bond-Ply?
A: The answer to this varies from application to application, depending upon surface roughness and flatness. In general, pressure, temperature, and time are the primary variables associated with increasing surface contact or wet-out. Increasing the application time and/or pressure will significantly increase surface contact. Natural wet-out will continue to occur with Bond-Ply materials.This inherent action often increases bond strength by more than 2x within the first 24 hours.
Q: How should I size my interface dimensions for Bond-Ply? A: Bond-Ply product testing has been completed on various interface
materials.These tests have demonstrated that improper surface wet-out is the single largest variable associated with maximizing bond strength and heat transfer. Bergquist has found that reducing the size of the interface pad to roughly 80% of the total interface area actually improves the overall bonding performance while offering significant improvements in total package cooling. Bergquist offers three standard thicknesses for Bond-Ply 100 allowing each application to be optimized in three dimensions.
Q: Will Bond-Ply adhere to plastic packages? A: Adhesive performance on plastic packages is primarily a function
of surface contact or wet-out. If surface contaminants such as plastic mold release oils are present, this will prevent contact and/or bonding to the surface. Make sure all surfaces are clean and dry prior to applying Bond-Ply materials.
Q: How are one-part Liqui-Bond adhesives cured? A: One-part Liqui-Bond requires heat to cure and bond in the
application. Altering the bond line temperature and time can control the cure schedule. Component fixturing may be required to maintain placement through cure.
Bond-Ply Comparison Data
7.0 6.5 6.0 5.5 5.0

Liqui-Bond SA 1000 Liqui-Bond SA 1800 Liqui-Bond SA 2000
BOND-PLY
4.5 4.0
Bond-Ply 100 (0.011 ) Bond-Ply 100 (0.008 ) Bond-Ply 660P
3.5
79
Bond-Ply 100
Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape Features and Benefits
Thermal impedance: 0.52C-in2/W (@50 psi) High bond strength to a variety of surfaces Double-sided, pressure sensitive adhesive tape High performance, thermally conductive acrylic adhesive Can be used instead of heat-cure adhesive, screw mounting or clip mounting
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Temp. Resistance, 30 sec. (F) / (C) Elongation (%45 to Warp & Fill) Tensile Strength (psi) / (MPa) CTE (ppm) Glass Transition (F) / (C) Continuous Use Temp (F) / (C) ADHESION Lap Shear @ RT (psi) / (MPa) Lap Shear after 5 hr @ 100C Lap Shear after 2 min @ 200C Static Dead Weight Shear (F) / (C) ELECTRICAL Dielectric Breakdown Voltage - 0.005" (Vac) Dielectric Breakdown Voltage - 0.008" (Vac) Dielectric Breakdown Voltage - 0.011" (Vac) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Initial Assembly Pressure (psi for 5 seconds) TO-220 Thermal Performance (C/W) 0.005" TO-220 Thermal Performance (C/W) 0.008" TO-220 Thermal Performance (C/W) 0.011" Thermal Impedance (C-in2/W) 0.005" (1) Thermal Impedance (C-in2/W) 0.008" (1) Thermal Impedance (C-in2/W) 0.011" (1) 10 5.17 5.40 6.59 0.56 0.82 1.03 25 4.87 5.35 6.51 0.54 0.80 1.02
TYPICAL PROPERTIES OF BOND-PLY 100

IMPERIAL VALUE White Fiberglass 0.005, 0.008, 0.011 392 70 900 325 -22 -22 to 248 100 200 200 302 METRIC VALUE White Fiberglass 0.127, 0.203, 0.279 200 70 6 325 -30 -30 to 120 0.7 1.4 1.4 150 VALUE 3000 6000 8500 V-O 0.8 50 4.49 5.28 6.51 0.52 0.78 1.01 TEST METHOD Visual ASTM D374 ASTM D412 ASTM D412 ASTM D3386 ASTM D1356 ASTM D1002 ASTM D1002 ASTM D1002 PSTC#7 TEST METHOD ASTM D149 ASTM D149 ASTM D149 U.L.94 ASTM D5470 100 4.18 5.22 6.50 0.50 0.77 1.00 200 4.10 5.20 6.40 0.50 0.75 0.99

Mount heat sink onto BGA graphic processor or drive processor Mount heat spreader onto power converter PCB or onto motor control PCB
Sheet form, roll form and die-cut parts Shelf Life: The double-sided, pressure sensitive adhesive used in Bond-Ply products requires the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a 6-month shelf life at a maximum continuous storage temperature of 35C or 3-month shelf life at a maximum continuous storage temperature of 45C, for maintenance of controlled adhesion to the liner.The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60C.

BP100 0.008 00 1112 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 1112 = 11" x 12" sheets,11250 = 11" x 250' rolls or 00 = custom configuration 00 = No adhesive Standard thicknesses available: 0.005", 0.008", 0.011" BP100 = Bond-Ply 100 Material
Section C
Section A
Section B
BOND-PLY
80
Section D
Bond-Ply 400
Thermally Conductive, Un-Reinforced, Pressure Sensitive Adhesive Tape Features and Benefits
Thermal impedance: 0.87C-in2/W (@50 psi) Easy application Eliminates need for external hardware (screws, clips, etc.) Available with easy release tabs
PROPERTY Color Thickness (inch) / (mm) Glass Transition (F) / (C) Continuous Use Temp (F) / (C) ADHESION Lap Shear @ RT (psi) / (MPa) Lap Shear after 5 hr @ 100C Lap Shear after 2 min @ 200C ELECTRICAL Dielectric Breakdown Voltage (Vac) Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Initial Assembly Pressure (psi for 5 seconds) TO-220 Thermal Performance (C/W) 0.005" Thermal Impedance (C-in2/W) (1) 10 5.4 25 5.4
TYPICAL PROPERTIES OF BOND-PLY 400

IMPERIAL VALUE White 0.005 to 0.010 -22 -22 to 248 100 200 200 METRIC VALUE White 0.127 to 0.254 -30 -30 to 120 0.7 1.4 1.4 VALUE 3000 V-O 0.4 50 5.4 0.87 TEST METHOD Visual ASTM D374 ASTM E1356 ASTM D1002 ASTM D1002 ASTM D1002 TEST METHOD ASTM D149 U.L.94 ASTM D5470 100 5.4 200 5.4
Bergquist Bond-Ply 400 is an un-reinforced, thermally conductive, pressure sensitive adhesive tape.The tape is supplied with protective topside tabs and a carrier liner. Bond-Ply 400 is designed to attain high bond strength to a variety of low energy surfaces, including many plastics, while maintaining high bond strength with long term exposure to heat and high humidity.
Shelf Life: The double-sided pressure sensitive adhesive used in Bond-Ply products requires the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a 6-month shelf life at a maximum continuous storage temperature of 35C, or 3-month shelf life at a maximum continuous storage temperature of 45C, for maintenance of controlled adhesion to the liner. The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60C.

Secure: Heat sink onto BGA graphic processor Heat sink to computer processor Heat sink onto drive processor Heat spreader onto power converter PCB Heat spreader onto motor control PCB

BP400 0.005 00 11/250 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 11/250 = 11" x 250' rolls or 00 = custom configuration 00 = No adhesive Standard thicknesses available: 0.005", 0.010" BP400 = Bond-Ply 400 Material
Section C
Section A
Section B
Section D
BOND-PLY
Die-cut parts (supplied on rolls with easy release, protective tabs)
81
Bond-Ply 660P
Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape Features and Benefits
Thermal impedance: 0.87C-in2/W (@50 psi) Highly puncture resistant Polyimide reinforcement carrier Double-sided pressure sensitive adhesive tape Provides a mechanical bond, eliminating the need for mechanical fasteners or screws Bond-Ply 660P is a thermally conductive, electrically insulating, double sided pressure sensitive adhesive tape.The tape consists of a high performance, thermally conductive acrylic adhesive coated on both sides of a Polyimide film. Use Bond-Ply 660P in applications to replace mechanical fasteners or screws.
PROPERTY Color Reinforcement Carrier Thickness (inch) / (mm) Glass Transition (F) / (C) Continuous Use Temp (F) / (C) ADHESION Lap Shear @ RT (psi) / (MPa) Lap Shear after 5 hr @ 100C Lap Shear after 2 min @ 200C ELECTRICAL Dielectric Breakdown Voltage (kVAC) Flame Rating THERMAL Post-Cured Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Initial Assembly Pressure (psi for 5 seconds) TO-220 Thermal Performance (C/W) Thermal Impedance (C-in2/W) (1) 10 5.48 0.83 25 5.47 0.82
TYPICAL PROPERTIES OF BOND-PLY 660P

IMPERIAL VALUE Light Brown Polyimide Film 0.008 -22 -22 to 248 100 200 200 METRIC VALUE Light Brown Polyimide Film 0.203 -30 -30 to 120 0.7 1.4 1.4 VALUE 6000 V-O 0.4 50 5.15 0.81 TEST METHOD Visual ASTM D374 ASTM E1356 ASTM D1002 ASTM D1002 ASTM D1002 TEST METHOD ASTM D149 U.L.94 ASTM D5470 100 5.05 0.80 200 5.00 0.79

Heat sink onto BGA graphic processor Heat sink onto drive processor Heat spreader onto power converter PCB Heat spreader onto motor control PCB
Roll form and die-cut parts The material as delivered will include a continuous base liner with differential release properties to allow for simplicity in roll packaging and application assembly.
Shelf Life: The double-sided pressure sensitive adhesive used in Bond-Ply products requires the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a 6-month shelf life at a maximum continuous storage temperature of 35C, or 3-month shelf life at a maximum continuous storage temperature of 45C, for maintenance of controlled adhesion to the liner. The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60C.

BP660P 0.008 00 12/250 NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 1212 = 12" x 12" Sheets, 12/250 = 12" x 250' rolls or 00 = custom configuration
Section A
Section B
Section C
Section D
BOND-PLY
00 = No adhesive Standard thicknesses available: 0.008" BP660P = Bond-Ply 660P Material
82
Liqui-Bond SA 1000 (One-Part)
Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits

High thermal performance Eliminates need for mechanical fasteners Low viscosity for ease of screening or stenciling Can achieve a very thin bond line Mechanical and chemical stability Maintains structural bond in severe-environment applications Heat cure TYPICAL PROPERTIES OF LIQUI-BOND SA 1000
PROPERTY AS SUPPLIED Color Viscosity (cps) (1) Density (g/cc) Shelf Life @ 10C (months) PROPERTY AS CURED - PHYSICAL Hardness (Shore A) Continuous Use Temp (F) / (C) Shear Strength (psi) / (MPa) PROPERTY AS CURED - ELECTRICAL Dielectric Strength (V/mil) / (V/mm) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating PROPERTY AS CURED - THERMAL Thermal Conductivity (W/m-K) CURE SCHEDULE Pot Life @ 25C (hours) (2) Cure @ 125C (minutes) (3) Cure @ 150C (minutes) (3) IMPERIAL VALUE Black 125,000 2.4 6 75 -76 to 392 200 250 5.5 1010 V-O 1.0 10 20 10 METRIC VALUE Black 125,000 2.4 6 75 -60 to 200 1.4 10,000 5.5 1010 V-O 1.0 10 20 10 TEST METHOD Visual ASTM D2196 ASTM D792 ASTM D2240 ASTM D1002 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470
1) Brookfield RV, Heli-path, Spindle TF @ 20 rpm, 25C. 2) Based on 1/8" diameter bead. 3) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent.
Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains its structure even in severeenvironment applications. Liqui-Bond SA 1000 features excellent low and high-temperature mechanical and chemical stability.The materials mild elastic properties assist in relieving CTE stresses during thermal cycling. Liqui-Bond SA 1000 contains no cure by-products, cures at elevated temperatures and requires refrigeration storage at 10C.The material is available in both tube and mid-sized container forms.

PCBA to housing Discrete component to heat spreader
With or without glass beads

LBSA1000 00 00 30cc NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 30cc = 30.0cc, 600cc = 600.0cc (ml) Pail: 0.85G = 0.85-gallon, 5G = 5-gallon 00 = No adhesive 00 = No spacer beads 07 = 0.007" spacer beads LBSA1000 = Liqui-Bond SA 1000 Liquid Adhesive Material
Section B
Section C
Section D
Section A
BOND-PLY
83
Liqui-Bond SA 1800 (One-Part)

High thermal conductivity: 1.8 W/m-K Eliminates need for mechanical fasteners Low viscosity for ease of screening or stenciling Maintains structural bond in severeenvironment applications Heat cure TYPICAL PROPERTIES OF LIQUI-BOND SA 1800
PROPERTY AS SUPPLIED Color Viscosity (cps) (1) Density (g/cc) Shelf Life @ 10C (months) PROPERTY AS CURED - PHYSICAL Hardness (Shore A) Continuous Use Temp (F) / (C) Shear Strength (psi) / (MPa) PROPERTY AS CURED - ELECTRICAL Dielectric Strength (V/mil) / (V/mm) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating PROPERTY AS CURED - THERMAL Thermal Conductivity (W/m-K) CURE SCHEDULE Pot Life @ 25C (hours) (2) Cure @ 125C (minutes) (3) IMPERIAL VALUE Black 125,000 2.8 6 80 -76 to 392 200 250 6.0 1011 V-O 1.8 10 20 10 METRIC VALUE Black 125,000 2.8 6 80 -60 to 200 1.4 10,000 6.0 1011 V-O 1.8 10 20 10 TEST METHOD Visual ASTM D2196 ASTM D792 ASTM D2240 ASTM D1002 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470
Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer.The adhesive is supplied as a one-part liquid component, offered in a tube or mid-size container. Liqui-Bond SA 1800 features a combination of high thermal conductivity with a low viscosity which allows for ease of screen or stencil application.This material is also ideal for high volume automated pattern dispensing. Liqui-Bond SA 1800s low viscosity allows the material to achieve a very thin bond line, producing excellent thermal performance and a high shear strength. Liqui-Bond SA 1800s mild elastic properties assist in relieving CTE stresses during thermal cycling.The material cures at elevated temperatures and requires refrigeration storage at 10C. Liqui-Bond SA 1800 is available with optional glass beads to provide a consistent stand-off and ensure dielectric integrity.
Cure @ 150C (minutes) (3)

PCB assembly to housing Discrete component to heat spreader

LBSA1800 00 00 30cc NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 30cc = 30.0cc, 600cc = 600.0cc (ml) Pail: 0.85G = 0.85-gallon, 5G = 5-gallon 00 = No adhesive 00 = No spacer beads 07 = 0.007" spacer beads LBSA1800 = Liqui-Bond SA 1800 (One-Part) Liquid Adhesive Material
Section C
Section A
Section B
BOND-PLY
84
Section D
Liqui-Bond SA 2000

High thermal conductivity: 2.0 W/m-K Eliminates need for mechanical fasteners One-part formulation for easy dispensing Mechanical and chemical stability Maintains structural bond in severe-environment applications Heat cure TYPICAL PROPERTIES OF LIQUI-BOND SA 2000
PROPERTY AS SUPPLIED Color Viscosity (cps) (1) Density (g/cc) Shelf Life @ 10C (months) PROPERTY AS CURED - PHYSICAL Hardness (Shore A) Continuous Use Temp (F) / (C) Shear Strength (psi) / (MPa) PROPERTY AS CURED - ELECTRICAL Dielectric Strength (V/mil) / (V/mm) Dielectric Constant (1000 Hz) Volume Resistivity (Ohm-meter) Flame Rating PROPERTY AS CURED - THERMAL Thermal Conductivity (W/m-K) CURE SCHEDULE Pot Life @ 25C (hours) (2) Cure @ 125C (minutes) (3) Cure @ 150C (minutes) (3) IMPERIAL VALUE Yellow 200,000 2.4 6 80 -76 to 392 200 250 6.0 1011 V-O 2.0 24 20 10 METRIC VALUE Yellow 200,000 2.4 6 80 -60 to 200 1.4 10,000 6.0 1011 V-O 2.0 24 20 10 TEST METHOD Visual ASTM D2196 ASTM D792 ASTM D2240 ASTM D1002 ASTM D149 ASTM D150 ASTM D257 U.L.94 ASTM D5470
Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either tube or mid-sized container form. Liqui-Bond SA 2000 features excellent low and high-temperature mechanical and chemical stability.The materials mild elastic properties assist in relieving CTE stresses during thermal cycling. Liqui-Bond SA 2000 cures at elevated temperatures and requires refrigeration storage at 10C.

PCBA to housing Discrete component to heat spreader

LBSA2000 00 00 30cc NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 30cc = 30.0cc, 600cc = 600.0cc (ml) Pail: 0.85G = 0.85-gallon, 5G = 5-gallon
Section C
Section A
Section B
Section D
BOND-PLY
00 = No adhesive 00 = No spacer beads 07 = 0.007" spacer beads LBSA2000 = Liqui-Bond SA 2000 Liquid Adhesive Material
85
Solutions for Surface Mount Applications

Hi-Flow
The Hi-Flow family of phase change materials offers an easy-to-apply thermal interface for many surface mount packages. At the phase change temperature, Hi-Flow materials change from a solid and flow with minimal applied pressure.This characteristic optimizes heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly used to replace messy thermal grease. Bergquist phase change materials are specially compounded to prevent pump-out of the interface area, which is often associated with thermal grease. Typical applications for Hi-Flow materials include: Pentium, Athlon, Core 2 Duo and other high performance CPUs DC/DC converters Power modules Hi-Flow materials are manufactured with or without film or foil carriers. Custom shapes and sizes for non-standard applications are also available.
Power Device Thermal Clad
Hi-Flow
High Power Application Hi-Flow with Thermal Clad

Processor Hi-Flow
Heat Spreader
Heat Spreader FR-4 Board
High Power Application Hi-Flow without Thermal Clad
Sil-Pad
Sil-Pad is the benchmark in thermal interface materials.The Sil-Pad family of materials are thermally conductive and electrically insulating. Available in custom shapes, sheets, and rolls, Sil-Pad materials come in a variety of thicknesses and are frequently used in SMT applications such as: Interface between thermal vias in a PCB, and a heat sink or casting Heat sink interface to many surface mount packages
Power Device Sil-Pad or Bond-Ply FR-4 Heat Spreader
ORDERING
Mid Power Application with Bond-Ply or Sil-Pad
Pentium is a registered trademark of Intel Corporation. Athlon is a registered trademark of Advanced Micro Devices, Inc.
86
Where Thermal Solutions Come Together

Bond-Ply and Liqui-Bond
The Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply is available in a pressure sensitive adhesive or laminating format. Bond-Ply provides for the mechanical decoupling of bonded materials with mismatched thermal coefficients of expansion. Liqui-Bond is a high thermal performance liquid silicone adhesive that cures to a solid bonding elastomer.Typical applications include: Bonding bus bars in a variety of electronic modules and sub assemblies Attaching a metal-based component to a heat sink Bonding a heat sink to a variety of ASIC, graphic chip, and CPU packages Bonding flexible circuits to a rigid heat spreader or thermal plane Assembly tapes for BGA heat spreader Attaching PCB assemblies to housings
Gap Pad and Gap Filler

Gap Pad and Gap Filler product families are highly conformable, thermally conductive materials in pad or liquid dispensable format.Varying degrees of thermal conductivity and compression deflection characteristics are available.Typical applications include: On top of a semiconductor package such as a QFP or BGA. Often times, several packages with varying heights can use a common heat sink when utilizing Gap Pad Between a PCB or substrate and a chassis, frame, or other heat spreader Areas where heat needs to be transferred to any type of heat spreader For interfacing pressure sensitive devices Filling various gaps between heat-generating devices and heat sinks or housings Gap Pads are available in thickness of 0.010" to 0.250", and in custom shapes, with or without adhesive. Gap Fillers are available in cartridge or kit form.
Heat Spreader
Power Device
Gap Pad or Gap Filler
FR-4 Board
Lower Power Application with Gap Pad
Top Efficiency In Thermal Materials For Todays Changing Technology.

Contact Bergquist for additional information regarding our Thermal Solutions.We are constantly innovating to offer you the greatest selection of options and flexibility to meet todays changing technology.
ORDERING
87
Ordering Information
Ordering Procedure:
The last 2 or 3 digits define the part number selected.The foot print and dimensions are shown on pages 87-95.
Typical Configuration Tolerances:

Roll width: 0.06" (1.6mm) for standard widths (2", 4", 6", etc.) Sil-Pad sheet: -0.06" / +0.25" (-1.6mm / +6.4mm) Gap Pad sheet: -0.0" / +0.40" (-0.0mm / +10.0mm) Typical Sil-Pad roll length: 250' - 300' Typical number of splices per roll: 3 Typical butt splice: 2-sided colored tape Material thickness tolerances: Sil-Pad 0.001" (0.0254mm) Gap Pad VO 5% Gap Pad S-Class 10%
Special Shapes:
For applications requiring non-standard or custom Sil-Pad configurations, contact your Bergquist Sales Representative.We produce thousands of custom die shapes and designs.
Tolerances:
Typical converting tolerances are held on length (L), width (W), hole diameter and hole location for most materials as noted below:
Note: Tighter tolerances are available per factory review.
Sheets:
Standard sheet size for most materials is 12" x 12", with or without adhesive as specified on the individual data sheet.When ordering sheets, please specify material type, thickness and include all dimensions. Contact Bergquist Sales if other sizes are required.
TYPICAL SIL-PAD / HI-FLOW TOLERANCES

Part (1) Length and Width Rule Defined Hole Location Dimension Tolerance Features (2) & Diameter <6" 0.010" (0.25mm) 0.010" (0.25mm) 0.005" (0.13mm) 6" - 12" 0.015" (0.38mm) 0.015" (0.38mm) 0.010" (0.25mm) >12" Material Thickness 10 mil 15 mil 20 mil 30 mil 40 mil 50 mil 60 mil 70 mil 80 mil 100 mil 125 mil 140 mil 160 mil 200 mil 225 mil 250 mil 0.020" (0.51mm) 0.020" (0.51mm) 0.020" (0.51mm)
Note: Sil-Pad A2000 maximum sheet size is 10" x 12". Gap Pad standard sheet size is 8" x 16".
TYPICAL GAP PAD TOLERANCES

Length and Width Tolerance 0.015" (0.38mm) 0.015" (0.38mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.035" (0.89mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.050" (1.27mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.075" (1.91mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.125" (3.17mm) 0.160" (4.06mm) 0.160" (4.06mm)
(3)
Hole Location & Diameter 0.015" (0.38mm) 0.015" (0.38mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.035" (0.89mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.050" (1.27mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.075" (1.91mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.125" (3.17mm) 0.160" (4.06mm) 0.160" (4.06mm)
Rolls:
Sil-Pad materials are available in roll form, with or without adhesive, with the exception of Sil-Pad 1750 and Sil-Pad 2000. Hi-Flow materials are available in roll form. Certain Gap Pad materials are available in roll form. Please contact Bergquist Sales for more information.
Color Matching:
Bergquist identifies product color as a reference product characteristic and/or specification for Sil-Pad and Gap Pad products. Slight color variation is normal across lot-to-lot splicing due to the different variations in natural colorants used to achieve the desired hue and shade in these products. Bergquist continues to monitor and control incoming raw material specifications and production processes to ensure the highest possible consistency of quality and product performance. If you have any questions regarding color matching, please contact Bergquist Product Management.
ORDERING
(1) Material thicknesses: <6" (152.4mm), 6-12" (152.4-304.8mm), >12" (304.8mm). (2) Rule defined by geometry can be notches, internal shapes not created by a punch or cutouts that are created by a rule and not a punch. (3) Gap Pad VO materials have a Sil-Pad Side / Cutline tolerance of parts on the liner to within 0.020" (0.51mm) typically, Gap Pad may deform to the standard tolerances when handled or removed from the liner. Note: Dependent upon material and application requirements, tighter tolerances may be feasible and available. Please contact Bergquist Sales for these requests and additional information regarding tolerances.
88
Ordering Information
Adhesives:
Bergquist adhesives include: (AC) - Unloaded (ACA) - Unloaded, Low Tack (TAC) - Loaded (Thermally Enhanced) ACRYLIC: (AAC) - Unloaded (TAAC) - Thermally Loaded (EAAC) - Thermally Enhanced THICKNESS: 0.0005" - 0.001", (12-25m) (adhesive only) Note: For non-symmetrical parts, please indicate on print which side the adhesive is on. Peel Strength: See data below. POL = Peel-Off Liner (force per unit width of the liner to the adhesive). QS = Quick Stick (simulated force per unit width of the adhesive to the heat sink). g/in = Grams per inch. TYPICAL ADHESIVE PROPERTIES
ADHESIVE Silicone AC Silicone ACA Silicone TAC Acrylic AAC Acrylic TAAC Acrylic EAAC POL 50-150 g/in 5-70 g/in 50-150 g/in 5-70 g/in 5-70 g/in 5-60 g/in QS 50-150 g/in 5-150 g/in 50-150 g/in 100-800 g/in 100-400 g/in 100-200 g/in
PSA Characteristics: Standard pressure sensitive adhesive (AC) coated on one side of a Sil-Pad will increase the thermal resistance (per ASTM D5470) by 0.2C-in 2/W. Standard pressure sensitive adhesive on 2 sides increases the thermal impedance by 0.4C-in 2/W. Thermally conductive pressure sensitive adhesive (TAC) on one side increases the thermal resistance by 0.05C-in 2/W and on two sides by 0.1C-in 2/W. The effect of AC and TAC on the thermal impedance in an application will vary. In low-pressure applications, the pressure sensitive adhesive will wet-out the interface easier and eliminate the interfacial thermal resistance.
SILICONE:
Note: Bergquist adhesives are designed for ease of application during assembly. If an automated dispensing method is preferred, Bergquist will recommend manufacturers of automated dispensing equipment upon request. Please contact Bergquist Sales for more information on this subject. Note: Bergquist cannot be responsible for dispensing equipment selection and/or performance of specific materials on said equipment. It is the customers responsibility to determine the suitability and compatibility of the specific Bergquist material with the selected equipment.
U.L. Recognition:
For information regarding the U.L. (Underwriters Laboratories, Inc.) recognition status of Bergquist Sil-Pad, Gap Pad and Hi-Flow materials, the U.L. web site provides the most current information. Using the URL: http://www.ul.com, select Online Certification Directory. You may then enter one of the following file numbers for the applicable Bergquist file: QMFZ2.E59150: Plastics Component. This category includes all Sil-Pad, Gap Pad and Hi-Flow materials. QOQW2.E81718: Polymeric Adhesive Systems, Electrical Equipment Component. This category includes Bond-Ply adhesive only. In each group there is a Guide Information section which gives a detailed description of the categories listed and all recognized materials will be listed with supporting data.
Note: These values are typical after the material has aged for 2-3 weeks and are significantly different immediately after coating. Upon completion of coating, QS is 250-500 g/in and POL is 3-20 g/in for all silicone adhesives.
Shelf Life: Silicone Adhesives: Six (6) months from date of manufacture when stored in original packaging at 70F (21C) and 50% relative humidity. Acrylic Adhesives: One (1) year from date of manufacture when stored in original packaging at 70F (21C) and 50% relative humidity. Peel adhesion data is available upon request. Please contact Bergquist Sales for more information.
ORDERING
89
Sil-Pad Configurations
Imperial Measurements
4 Lead TO-66 Part Number Suffix -84 "A" 1.312 "B" .762 "C" .140 "D" .062 "E" .960 "F" .200 "G" .100
Plastic Power
Part Number Suffix "A" .710 .750 .437 .687 .855 .750 .610 .855 .750 .437 .750 .750 .750 .500 1.125 1.410 .860 .866 .750
"B" .500 .500 .312 .562 .630 .500 .560 .562 .500 .312 .410 .600 .600 .385 .625 .810 .740 .650 .800
Dimensions "C" .160 .140 .218 .230 .187 .245 .218 .187 .140 .225 .240 .240 .170 .200 .355 .200 .217 .150
"D" .141 093 .125 .093 .147 .125 .125 .125 .122 .156 .150 .115 .120 .145 .147 .160 .142 .160 Various Various Various Various Various Various Various Various Various TO-3P Various Various Various Various Various Various Various Various Various
Part Number Suffix -104 -107 -110 -114 -116 -117 -118 -119 -120 -122 -126 -128 -131 -132 -133 -134 -136 -137 -138
"A" 1.000 .810 .984 .827 .855 .827 .748 .437 .728 1.140 .945 .984 .709 .472 .866 .945 1.250 1.250 1.250
Dimensions "B" "C" .750 .910 .787 .945 .630 .709 .551 .311 .472 .810 .748 1.654 .512 .315 .709 .709 1.000 1.000 1.000 .300 .170 .197 .228 .256 .217 .142 .157 .355 .256 .315 .177 .157 .256 .228 .258 .258
"D" .140 .147 .150 .122 .126 .126 .110 .098 .147 .162 .157 .122 .126 .126 .126 .127 .148
TO-220
Various -35 (Clip Mount) -43 TO-126 -50 Various -51 Various -52 TO-220 -54 TO-202 -55 Various -56 TO-220 -58 TO-126 -60 Various -61 TO-220 -62 Various -63 Various -64 TO-218 -68 Various -70 Various -90 Various -102 Various -103 Power Module
Part Number Suffix "A" -67 -101 1.500 2.500
"B" .900 2.000
"C" .150 .344
Dimensions "D" 1.200 1.812
"E" .450 1.000
"F" .075 .156
Plastic Power
Part Number Suffix "A" -57 -89 .910 .983
"B" .500 .750
"C" .200 .432
Dimensions "D" .125 .156 Dimensions "D" .141
"E" .580 .665
"F" .046 .101
"G" .265 .217
Plastic Power
Part Number Suffix "A" -66 1.000
"B" .500
"C" .200
"E" .626
"F" .046
"G" .219
"H" .032
Power Part Number Resistors Suffix "A" RH-25 RH-50 RH-5 RH-10 RH-25 RH-50 -94 -95 -96 -97 -98 -99 1.187 2.093 .725 .805 1.150 1.965
"B" 1.205 1.265 .771 .890 1.180 1.236
"C" .234 .265 .140 .127 .231 .198
Dimensions "D" .469 .530 .280 .250 .425 .404 Dimensions "D" .125 .125 .125 .125 .125 .125 .125 Dimensions "D" .500 0.500 0.488 0.490
"E" .212 .210 .140 .130 .190 .132
"F" .156 .255 .156 .190 .270 .263
"G" .719 1.563 .445 .551 .688 1.569 # of Holes 2 3 4 5 6 7 8
"H" .781 .845 .491 .630 .800 .972
"I" .140 .140 .093 .121 .147 .130
TO-220 Part Number Multiples Suffix "A" 2 Parts 3 Parts -34 -36 -37 -38 -39 -40 -41 1.000 1.500 2.000 2.500 3.000 3.500 4.000
"B" .750 .750 .750 .750 .750 .750 .750
"C" .187 .187 .187 .187 .187 .187 .187
"E" .250 .250 .250 .250 .250 .250 .250
"F" .500 .500 .500 .500 .500 .500 .500
ORDERING
Power Module
Part Number Suffix "A" -108 -140 -141 -142 4.600 4.598 2.279 2.280
"B" 2.400 2.402 2.402 1.450
"C" 2.125 2.098 2.102 1.270
"E" 1.800 1.799 0.650 0.650
"F" .125 0.150 0.150 0.130
90
C D-DIA E
Multiwatt
Part Number Suffix -124 -125
"A" .872 .866
"B" .790 .787
Dimensions "C" .160 .157
"D"
"E"
.148 .118 x 45 .154 .079 x 45
Multi-Lead TO-66
Part Number Suffix -93
"A" 1.350
"B" .800
"C" .140
"D" .400 Part Number Suffix
"E" .960
"F" .480
Diode Washer
Part Number Suffix -19 -20 -21 -22 -25 -26 -27 -28 -32 Suffix -08
Dimensions "A" "B" .510 .510 .800 .625 1.000 .812 .812 1.000 1.500 "A" 1.063 .140 .200 .260 .200 .260 .145 .115 .140 .500 Various Various Various DO-8 Various Various Various Various Various "C" .190
Dimensions "A" "B" .360 .750 .800 .875 1.180 1.250 1.500 .512 .591 .260 .125 .190 .313 .515 .380 .200 .161 .217
Various DO-4 DO-5 DO-4 (oversized) DO-5 (oversized) Various Various Various Various Part Number TO-36
-75 -76 -77 -78 -79 -80 -81 -82 -111
Dimensions "B" .690
Small Power Devices TO-5, 3 Holes TO-18, 3 Holes TO-18, 4 Holes TO-5, 4 Holes TO-5, 3 Holes TO-5, 4 Holes
Part Number Suffix -09 -12 -13 -33 -44 -45 Part Number Suffix -46 -47 -48
"A" .360 .250 .250 .360 .390 .390
Dimensions "B" .200 .100 .100 .200 .200 .200 Dimensions "B" 1.250 1.125 1.000 "B" .787 .650 .787 .787
"C" .040 .036 .036 .040 .040 .040
Rectifier
"A" 1.250 1.125 1.000 "A" .984 .865 1.260 .984
"C" .200 .140 .187
TIP Packages Clip Mount TIP-36 Plastic Tip TO-3P Plastic Clip Power Module
Part Number Suffix -42 -53 -65 -73 Part Number Suffix -100 -123
Dimensions "C" "D"
"E" .205
.650 .984 .708
.140 .142 .142 Dimensions "D" .305 .157
.205 .205 .205
"A" 2.510 1.614
"B" 1.260 1.102
"C" .630 .551
"E" 1.900 1.220
"F" .205 .118
"G" .205 .118
SIP Package
C
"A" 1.450
"B" .838
"C" .612
Dimensions "D" .245
"E" .960
"F" .170
"G" .120
D
B A
E F RAD (TYP)
ORDERING
Quarz
"A" .472 "A" 1.350
Dimensions "B" "C" .197 "B" .642 .193 "C" .321
"D" .031 Dimensions "D" .195 "E" .960 "F" .060 "G" .125
B C D A (2) G Dia
Power Module
91
TO-3 & TO-66 Part Number Style Suffix "A" -02 -03 -04 -05 -06 -07 -10 -11 -15 -16 -17 -18 -23 -24 -29 -30 -31 -59 Leadless -112 -113 -127 -129 -135
I
"B" 1.250 1.050 1.140 1.140 1.140 1.250 1.000 .762 1.250 1.560 1.140 1.050 1.100 1.187 1.065 .700 .825 1.140 1.248 1.051 .819 1.063 1.142 "B" 1.140
"C" .140 .140 .122 .140 .165 .165 .140 .140 .140 .122 .140 .140 .156 .156 .140 .140 .140 .165 .165 .165 .165 .138 .165 "C" .140
Dimensions "D" .093 .080 .062 .093 .062 .094 .075 .062 .046 .062 .046 .140 .062 .062 .046 .062 .062 .063 .079 .063 .059 .142 "D" .093
"E" 1.187 1.187 1.187 1.187 1.187 1.187 .960 .960 1.187 1.187 1.187 1.187 1.187 1.187 1.187 .960 .960 1.187 1.185 1.185 .909 1.181 1.187
"F" .430 .430 .430 .430 .430 .430 .200 .200 .430 .430 .430 .430 .430 .430 .430 .200 .200 .429 .429 .236 .433 .429 "F" .430
"G" .072 .072 .072 .072 .072 .072 .100 .100 .072 .072 .072 .072 .072 .072 .072 .100 .100 .073 .073 .061 .071 ..072 "G" .400 "H" .155 "I" .718
1.780 1.563 1.650 1.650 1.650 1.780 1.440 1.312 1.780 2.070 1.650 1.563 1.593 1.700 1.650 1.250 1.375 1.650 1.780 1.563 1.307 1.654 1.650
3 Lead TO-3
Dimensions "E" 1.187
F DIA. A
4 Lead TO-3
"B" 1.050 1.050
"C" .156 .156
Dimensions "D" .080 .063
"E" 1.170 1.187
"F" .470 .470
"G" 72 72
D DIA. (4) B C DIA. (2)
18 E G
8 Lead TO-3
"B" 1.187
"C" .156
Dimensions "D" .060
"E" 1.187
"F" 40
"G" .500
10 Lead Part Number TO-3 Suffix "A" -91 1.650
"B" 1.140
"C" .165
Dimensions "D" .040
"E" 1.187
"F" .593
"G" .500
"H" 32.7
3 Lead TO-66
"B" .750
"C" .156
Dimensions "D" .100
"E" .960
"F" .200
"G" .100
"H" .200
9 Lead TO-66
"B" 1.000
"C" .140
Dimensions "D" .055
"E" .960
"F" .480
"G" .325
"H" 36
ORDERING
Power Module
"B" .480
"C" .165
Dimensions "D" 1.197
"E" .240
B C - DIA. (2)
92
Hi-Flow 225 Configurations
Imperial Measurements Hi-Flow 225U Tab Configurations

("B") MATERIAL
LINER -.500+.030 PSA STRIP LINER .080+.000 .040
Part Number Suffix -143 -144 -145
A 1.500 1.378 1.250 1.000 .700 .500 .300
Dimensions ( .015) B C 1.500 1.378 1.250 1.000 .700 .500 1.000 2.500 2.378 2.250 2.000 1.700 1.500 2.000
Min. Pcs/Roll 5000 5000 5000 7500 10000 15000 22500
("B")
-146 -147 -148 -149
("A")
("A")
("C")
Hi-Flow 225UT/565U/565UT Tab Configurations

.750+.063 COLORED PSA TAPE LINER .500+.030 MATERIAL ("B") .250+.125 LINER PSA STRIP CLEAR PSA TAPE .750+.063
A 1.650 1.500 1.375 1.250 1.000 .700 .500
Dimensions ( .015) B C 1.650 1.500 1.375 1.250 1.000 .700 .500 2.650 2.500 2.375 2.250 2.000 1.700 1.500
Min. Pcs/Roll 3000 5000 5000 5000 7500 10000 15000
("B")
-153 -154 -155 -156
("A")
("A")
("C")
ORDERING
93
Metric Measurements
4 Lead TO-66 Part Number Suffix "A" -84 33.32 "B" 19.35 "C" 3.56 Dimensions "D" 1.57 "E" 24.38 "F" 5.08 "G" 2.54
Plastic Power
Part Number Suffix "A" 18.03 19.05 11.10 17.45 21.72 19.05 15.49 21.72 19.05 11.10 19.05 19.05 19.05 12.70 28.58 35.81 21.84 22.00 19.05
"B" 12.70 12.70 7.92 14.27 16.00 12.70 14.22 14.27 12.70 7.92 10.41 15.24 15.24 9.78 15.88 20.57 18.80 16.51 20.32
Dimensions "C" 4.06 3.56 5.54 5.84 4.75 6.22 5.54 4.75 3.56 5.72 6.10 6.10 4.32 5.08 9.02 5.08 5.51 3.81
"D" 3.58 2.36 3.18 2.36 3.73 3.18 3.18 3.18 3.10 3.96 3.81 2.92 3.05 3.68 3.73 4.06 3.61 4.06 Various Various Various Various Various Various Various Various Various TO-3P Various Various Various Various Various Various Various Various Various
Part Number Suffix -104 -107 -110 -114 -116 -117 -118 -119 -120 -122 -126 -128 -131 -132 -133 -134 -136 -137 -138
"A" 25.40 20.57 24.99 21.01 21.72 21.01 19.00 11.10 18.49 28.96 24.00 24.99 18.01 11.99 22.00 24.00 31.75 31.75 31.75
Dimensions "B" "C" 19.05 23.11 19.99 24.00 16.00 18.01 14.00 7.90 11.99 20.57 19.00 42.01 13.00 8.00 18.01 18.01 25.40 25.40 25.40 7.62 4.32 5.00 5.79 6.50 5.51 3.61 3.99 9.02 6.50 8.00 4.50 3.99 6.50 5.79 6.55 6.55
"D" 3.56 3.73 3.81 3.10 3.20 3.20 2.79 2.49 3.73 4.11 3.99 3.10 3.20 3.20 3.20 3.23 3.76
Various -35 (Clip Mount) -43 TO-126 -50 TO-220 Various -51 Various -52 TO-220 -54 TO-202 -55 Various -56 TO-220 -58 TO-126 -60 Various -61 TO-220 -62 Various -63 Various -64 TO-218 -68 Various -70 Various -90 Various -102 Various -103 Power Module Number Suffix -67 -101
"A" 38.10 63.50
"B" 22.86 50.80
Dimensions "C" "D" 3.81 8.74 30.48 46.02
"E" 11.43 25.40
"F" 1.90 3.96
Plastic Power
"B" 12.70 19.05 "B" 12.70
"C" 5.08 10.97 "C" 5.08
Dimensions "D" 3.18 3.96
"E" 14.73 16.89
"F" 1.17 2.57 "F" 1.17
"G" 6.73 5.51 "G" 5.56 "H" 0.81
Plastic Power
Dimensions "D" "E" 3.58 15.90
Power Part Number Resistors Suffix "A" RH-25 RH-50 RH-5 RH-10 RH-25 RH-50 -94 -95 -96 -97 -98 -99 30.15 53.16 18.42 20.45 29.21 49.91
"B" 30.61 32.13 19.58 22.61 29.97 31.39
"C" 5.94 6.73 3.56 3.23 5.87 5.03
"D" 11.91 13.46 7.11 6.35 10.80 10.26
Dimensions "E" 5.38 5.33 3.56 3.30 4.83 3.35
"F" 3.96 6.48 3.96 4.83 6.86 6.68
"G" 18.26 39.70 11.30 14.00 17.48 39.85
"H" 19.84 21.46 12.47 16.00 20.32 24.69
"I" 3.56 3.56 2.36 3.07 3.73 3.30
TO-220 Part Number Multiples Suffix "A" 2 Parts 3 Parts -34 -36 -37 -38 -39 -40 -41 25.40 38.10 50.80 63.50 76.20 88.90 101.60
"B" 19.05 19.05 19.05 19.05 19.05 19.05 19.05
Dimensions "C" "D" 4.75 4.75 4.75 4.75 4.75 4.75 4.75 3.18 3.18 3.18 3.18 3.18 3.18 3.18
"E" 6.35 6.35 6.35 6.35 6.35 6.35 6.35
"F" 12.70 12.70 12.70 12.70 12.70 12.70 12.70
# of Holes 2 3 4 5 6 7 8
ORDERING
Power Module
Part Number Suffix "A" -108 -140 -141 -142 116.84 116.8 57.90 57.91
"B" 60.96 61.00 61.00 36.83
Dimensions "C" "D" 53.97 53.30 53.40 32.26 12.70 12.70 12.40 12.45
"E" 45.72 45.70 16.50 16.50
"F" 3.18 3.80 3.80 3.30
94
C D-DIA E
Multiwatt
"B" 20.07 19.99
Dimensions "C" 4.06 3.99
"D" 3.76 3.91
" E" 3.0 x 45 2.0 x 45
Metric Measurements
MultiLead TO-66
"B" 20.32
"C" 3.56 Dimensions "B" 3.56 5.08 6.60 5.08 6.60 3.68 2.92 3.56 12.70
Dimensions "D" 10.16
"E" 24.38
"F" 12.19 Part Number Suffix Dimensions "B" 6.60 3.18 4.83 7.95 13.08 9.65 5.08 4.09 5.51
Diode Washer
Part Number Suffix -19 -20 -21 -22 -25 -26 -27 -28 -32 Part Number Suffix -08
"A" 12.95 12.95 20.32 15.88 25.40 20.62 20.62 25.40 38.10 "A" 27.00
"A" 9.14 19.05 20.32 22.23 29.97 31.75 38.10 13.00 15.01
Various DO-4 DO-5 DO-4 (oversized) DO-5 (oversized) Various Various Various Various TO-36
Various Various Various DO-8 Various Various Various Various
-75 -76 -77 -78 -79 -80 -81 -82 -111
Dimensions "B" 17.53
"C" 4.83
Small Power Devices TO-5, 3 Holes TO-18, 3 Holes TO-18, 4 Holes TO-5, 4 Holes TO-5, 3 Holes TO-5, 4 Holes
Part Number Suffix -09 -12 -13 -33 -44 -45 Part Number Suffix -46 -47 -48
"A" 9.14 6.35 6.35 9.14 9.91 9.91
Dimensions "B" 5.08 2.54 2.54 5.08 5.08 5.08
"C" 1.02 0.91 0.91 1.02 1.02 1.02
Rectifier
Dimensions "A" "B" 31.75 28.58 25.40 31.75 28.58 25.40
"C" 5.08 3.56 4.75 Dimensions "C" 16.51 24.99 17.98 Dimensions "D" 7.75 3.99 Dimensions "D" 6.22
TIP Packages Clip Mount TIP-36 Plastic Tip TO-3P Plastic Clip Power Module
Part Number Suffix -42 -53 -65 -73
"A" 24.99 21.97 32.00 24.99
"B" 19.99 16.51 19.99 19.99
"D" 3.56 3.61 3.61
"E" 5.21 5.21 5.21 5.21
"A" 63.75 41.00
"B" 32.00 27.99 "B" 21.29
"C" 16.00 14.00 "C" 15.54
"E" 48.26 30.99 "E" 24.38
"F" 5.21 3.00 "F" 4.32
"G" 5.21 3.00 "G" 3.05
SIP Package
D
B
Power Module
"B" 5.00
"C" 4.90
Dimensions "D" 0.79
ORDERING
A
E F RAD (TYP)
Power Module
"B" 16.31
"C" 8.15
Dimensions "D" 4.95
"E" 24.38
"F" 1.52
"G" 3.18
B C D A (2) G Dia
95
Metric Measurements
TO-3 Style
Part Number Suffix -02 -03 -04 -05 -06 -07 -10 -11 -15 -16 -17 -18 -23 -24 -29 -30 -31 -59 Leadless -112 -113 -127 -129 -135
"A" 45.21 39.70 41.91 41.91 41.91 45.21 36.58 33.32 45.21 52.58 41.91 39.70 40.46 43.18 41.91 31.75 34.92 41.91 45.21 39.70 33.20 42.01 41.91
"B" 31.75 26.67 28.96 28.96 28.96 31.75 25.40 19.35 31.75 39.62 28.96 26.67 27.94 30.15 27.05 17.78 20.96 28.96 31.70 26.70 20.80 27.00 29.01
"C" 3.56 3.56 3.10 3.56 4.19 4.19 3.56 3.56 3.56 3.10 3.56 3.56 3.96 3.96 3.56 3.56 3.56 4.19 4.19 4.19 4.19 3.51 4.19
Dimensions "D" 2.36 2.03 1.57 2.36 1.57 2.39 1.90 1.57 1.17 1.57 1.17 3.56 1.57 1.57 1.17 1.57 1.57 1.60 2.01 1.60 1.50 3.61
"E" 30.15 30.15 30.15 30.15 30.15 30.15 24.38 24.38 30.15 30.15 30.15 30.15 30.15 30.15 30.15 24.38 24.38 30.15 30.10 30.10 23.09 30.00 30.15
"F" 10.92 10.92 10.92 10.92 10.92 10.92 5.08 5.08 10.92 10.92 10.92 10.92 10.92 10.92 10.92 5.08 5.08 10.90 10.90 5.99 11.00 10.90
"G" 1.83 1.83 1.83 1.83 1.83 1.83 2.54 2.54 1.83 1.83 1.83 1.83 1.83 1.83 1.83 2.54 2.54 1.85 1.85 1.55 1.80 1.83
3 Lead TO-3
"B" 28.96
"C" 3.56
"F" 10.92
"G" 10.16
"H" 3.94
"I" 18.24
F DIA. A
D DIA. (4) B C DIA. (2)
4 Lead TO-3
18 E G
"B" 26.67 26.67
"C" 3.96 3.96
Dimensions "D" "E" 2.03 1.60 29.72 30.15
"F" 11.94 11.94
"G" 72 72
8 Lead TO-3
"B" 30.15
"C" 3.96
"F" 40
"G" 12.70
10 Lead Part Number TO-3 Suffix "A" -91 41.91
"B" 28.96
"C" 4.19
"F" 15.06
"G" 12.70
"H" 32.7
3 Lead TO-66
"B" 19.05
"C" 3.96
"F" 5.08
"G" 2.54
"H" 5.08
9 Lead TO-66
"B" 25.40
"C" 3.56
"F" 12.19
"G" 8.26
"H" 36
ORDERING
Power Module
"B" 12.19
"C" 4.19
B C - DIA. (2)
96
Hi-Flow 225 Configurations
Metric Measurements Hi-Flow 225U Tab Configurations

("B") MATERIAL
LINER -.500+.030 PSA STRIP LINER .080+.000 .040
A 38.10 35.00 31.75 25.40 17.78 12.70 7.62
Dimensions ( .015) B 38.10 35.00 31.75 25.40 17.78 12.70 7.62
C 63.50 60.40 57.15 50.80 43.18 38.10 50.80
Min. Pcs/Roll 5000 5000 5000 7500 10000 15000 22500
("B")
-145 -146 -147 -148
("A")
("A")
-149
("C")
Hi-Flow 225UT/565U/565UT Tab Configurations

.750+.063 COLORED PSA TAPE LINER .500+.030 MATERIAL ("B") .250+.125 LINER PSA STRIP CLEAR PSA TAPE .750+.063
A 41.91 38.10 34.93 31.75 25.40 17.78 12.70
Dimensions ( .015) B 41.91 38.10 34.93 31.75 25.40 17.78 12.70
C 67.31 63.50 60.33 57.15 50.80 43.18 38.10
Min. Pcs/Roll 3000 5000 5000 5000 7500 10000 15000
("B")
-153 -154 -155
("A")
("A")
-156
("C")
ORDERING
97
Sil-Pad Shield
Standard Configurations
P/N 09SPS01-002 (TO-220)
P/N 09SPS01-001 (TO-3)
P/N 09SPS01-009
P/N 09SPS01-011 (TO-5)
P/N 09SPS01-016 (TO-3)
P/N 09SPS01-017 (TO-66)
P/N 09SPS01-020 (DO-5)
P/N 09SPS01-023 (TO-3)
P/N 09SPS01-019 (DO-4)
ORDERING
Contact the factory for other configurations.
98
ORDERING
Notes
99
Notes
ORDERING
100
Bergquist Sil-Pad
SELECTION GUIDE
DOMESTIC AGENTS
For a complete list of Bergquist sales representatives in the U.S. contact The Bergquist Company: 1-800-347-4572.
INTERNATIONAL SALES OFFICES

CHINA
Tel: 86-21-6464-2206 Fax: 86-21-6464-2209
HONG KONG
Asian Headquarters Tel: 852-2690-9296 Fax: 852-2690-2344
SOUTH KOREA
Tel: 82-31-448-0382 Fax: 82-31-448-0383
GERMANY
Tel: 49-4101-803-230 Fax: 49-4101-803-100
THE NETHERLANDS
European Headquarters Tel: 31-35-5380684 Fax: 31-35-5380295
INTERNATIONAL AGENTS
AUSTRALIA AUSTRIA BELGIUM BRAZIL CANADA CHINA DENMARK FINLAND FRANCE HOLLAND HONG KONG ISRAEL ITALY JAPAN MALAYSIA MEXICO NEW ZEALAND NORWAY PORTUGAL RUSSIA SINGAPORE SPAIN SWEDEN SWITZERLAND TAIWAN THAILAND TURKEY
June 2011
Corporate Headquarters and Sales Office: 18930 West 78th Street Chanhassen, MN 55317 Toll Free: (800) 347-4572 Main: (952) 835-2322 Fax: (952) 835-0430 www.bergquistcompany.com Thermal Products Membrane Switches Touch Screens
SEL_SP_0611

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Thermally Conductive Interface Materials for Cooling Electronic Assemblies

World Leader in Thermal Management Through Technology, Innovation and Service

Bergquist Takes the Heat

World Class Operations Around the Globe

A Legacy of IndustryLeading Technology

Research and Development at the Speed of Change

GAP PAD TIC

HI--FLOW SIL-PAD BOND-PLY ORDERING

Thermal Properties and Testing

Thermal conductivity is an inherent or absolute property of the material.

Thermal resistance varies with thickness.

Test Methods ASTM D5470

Interface Material Selection Guide

Gap Pad Thermally Conductive Materials

Gap Pad Comparison Data

Conductivity, Hardness and General Overview

Frequently Asked Questions

Q: What are the upper processing temperature limits A:

Q: Why are wet out, compliance or conformability

A: The better a Gap Pad lays smooth "wets out" or conforms to a

Q: Is anything given off by the material

Q: Why does the data sheet describe the hardness rating

A: A reinforcement carrier is generally utilized in Bergquist Gap Pads

TYPICAL PROPERTIES OF GAP PAD VO

Typical Applications Include:

250 200 150 100 50 0 1 3 5 7 9 11 Thermal Resistance (C-in2/W) 13

Building a Part Number

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad VO Soft

TYPICAL PROPERTIES OF GAP PAD VO SOFT

Deflection (% strain) Thermal Impedance (C-in2/W) 0.040" (3)

Typical Applications Include:

Building a Part Number

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad VO Ultra Soft

Deflection (% strain) Thermal Impedance (C-in2/W) 0.040" (3)

Typical Applications Include:

250 200 150 100 50 0 1 2 3 4 5 6 7 8 9 Thermal Resistance (C-in2/W) 10

Building a Part Number

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad VO Ultimate

Deflection (% strain) Thermal Impedance (C-in2/W) 0.040" (3)

Telecommunications Power conversion Automotive LED lighting packages

Building a Part Number

0.020", 0.040", 0.060"

Gap Pad 1000SF

Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits

TYPICAL PROPERTIES OF GAP PAD 1000SF

Typical Applications Include:

Building a Part Number

125 100 75 50 25 0 0 1 2 3 4 Thermal Resistance (C-in2/W) 5

GP1000SF = Gap Pad 1000SF Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad HC1000

Gel-Like Modulus Gap Filling Material Features and Benefits

TYPICAL PROPERTIES OF GAP PAD HC1000

Typical Applications Include:

Building a Part Number

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad 1500