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Lecture 36

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15 views18 pages

Lecture 36

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Thanushsaran S
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VLSI DESIGN FLOW: RTL TO

GDS

Lecture 36
Basic Concepts for Physical Design - II
Sneh Saurabh
Electronics and Communications
Engineering
IIIT Delhi
Lecture Plan

▪ Signal Integrity

▪ Antenna Effect

▪ Library Exchange Format (LEF) files

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


Signal Integrity

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


Effects of Coupling of Interconnects
Impact of coupling capacitance among interconnects
▪ Voltage in one interconnect can impact the voltage in the other
▪ Can create signal integrity problems in a circuit

Signal Integrity Issues

Dynamic Delay Variations Functional Issues

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


Signal Integrity
Dynamic Delay
Variations

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


What is base delay?
Consider the portion of a circuit
▪ Let us assume A is the victim
➢ The signal line at which we observe the signal
integrity issue is known as the victim line
▪ Assume gate G1 (driver of the victim net A) makes a
0→1 transition at the output.
➢ The driver G1 provides charge for the ground
capacitor CG to change from 0 to VDD.

Case1: B is held constant to 0


▪ G1 needs to provide a charge for the coupling ▪ The delay computed by assuming
capacitance Cc to change from 0 to VDD. aggressors are held to constant
▪ Hence, G1 needs to charge CG + Cc. logic is known as base delay.
▪ The base delay is same whether
Case2: B is held constant to 1 aggressor is at 0 or 1
▪ Initially charge on Cc is -VDD and finally 0
▪ Base delay is obtained by
▪ Hence, G1 needs to charge CG + Cc. ignoring SI effects
VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh
How is dynamic delay variations created?
▪ Assume gate G1 (driver of the victim net A)
makes a 0→1 transition at the output.

Case1: B also makes a 0→1 transition while A


was transitioning:
▪ Voltage across Cc is 0 V, both initially and
finally.
▪ Hence, less charge needs to be provided by
G1 for charging Cc
▪ Delay of G1 will decrease.

▪ This effect is modeled as negative


incremental delay over base delay

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


How is dynamic delay variations created?
▪ Assume gate G1 (driver of the victim net A)
makes a 0→1 transition at the output.

Case2: B makes a 1→0 transition while A was


transitioning:
▪ Voltage across Cc is -VDD initially and +VDD
finally.
▪ Hence, in effect, 2Cc needs to be charged by
G1
▪ Delay of G1 will increase.

▪ This effect is modeled as positive


incremental delay over base delay

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


Signal Integrity

Noise or Glitches

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


What is a Glitch?
▪ A glitch can occur in a victim net held at constant logic value due to a transition in the
aggressor net.
▪ Glitches are also known as crosstalk noises

Depending on the value of the victim net and the


type of transition at the aggressor nets, four
types of glitches are possible:
a. Logic 0 has a rise glitch,
b. Logic 0 has an undershoot
c. Logic 1 has a fall glitch
d. Logic 1 has an overshoot.

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


How are Glitches Created?
Consider the portion of a circuit
▪ Let us assume A is the victim
▪ Assume that A is at a steady state of 𝑉𝐷𝐷 [logic 1]
▪ Assume that line B is also at the steady state of 𝑉𝐷𝐷 [logic 1]
▪ Voltage across the coupling capacitor 𝐶𝐶 is 0 V.

▪ Assume that the neighboring line B makes a quick transition


from 𝑉𝐷𝐷 to 0 V
▪ The coupling capacitor 𝐶𝐶 now gets charged to +𝑉𝐷𝐷 due to
voltage difference in lines A and B
▪ The driver of the line A will supply this charge, and it will
cause a temporary dip in the voltage of the line A

▪ Similarly, when the aggressor (line B) makes a 0 to 𝑉𝐷𝐷


transition, there can be a bump in the voltage of the victim
(line A) that was held at logic 0

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


On what factors the magnitude of glitches depend?
Slew of the aggressor net
➢ Glitch increases when the aggressor
transitions quickly.
Coupling capacitance between the aggressor and
the victim net:
➢ Glitch increases with the increase in the
coupling capacitance.

Ground capacitance of the victim net


➢ Glitch decreases as the ground capacitance
of the victim increases.

Strength of the driver of the victim net


➢ Glitch decreases as the strength of the
driver of the victim net increases.

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


When does Glitches Cause Functional Problems?
▪ If the magnitude of the glitch is above a threshold, it can propagate to a sequential circuit
element.
▪ Consequently, a wrong value can get latched (0 instead of 1 or 1 instead of 0), leading to a
circuit failure.

▪ If the magnitude of the glitch is above a threshold, on clock/reset/control signal, a spurious


transition can get triggered in a sequential element.

▪ Need to propagate glitches

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


Basic Concepts for
Physical Design

Antenna Effect

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


Antenna Effect: Cause

▪ During fabrication before addition of Metal-2, long Metal-1 connected to the gate can
become charged and can destroy the gate

▪ Antenna Ratio: ratio of the conductor area to the gate oxide area

▪ High Antenna Ratio implies greater chance of damage


➢ Antenna Rules defined to allow Antenna Ratio to be within limits
➢ Design Goal: Fix Antenna DRC violations by keeping Antenna Ratio small
VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh
Basic Concepts for
Physical Design

Library Exchange
Format (LEF)

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


Library Exchange Format (2)
▪ LEF file generally divided into two files Technology LEF files:
▪ Information about the available layers and
vias, their properties.
▪ Sheet resistance and capacitance per unit
square for various layers
▪ Placement and routing design rules
▪ Antenna rules

Cell Library LEF files:


▪ Abstract information of the cell layout
relevant to the physical design,
➢ Cell boundary, list of pins and their
locations, and obstructions to
placement and routing.

VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh


References
▪ J. M. Rabaey, A. Chandrakasan, and B. Nikolic. “Digital integrated circuit design: A Design
Perspective”, Prentice Hall, 2nd ed., 2002.

▪ J. Bhasker and R. Chadha. “Static Timing Analysis for Nanometer Designs: A Practical Approach”.
Springer Science & Business Media, 2009.

▪ S. Saurabh, “Introduction to VLSI Design Flow”. Cambridge: Cambridge University Press, 2023.

inprotected.com VLSI Design Flow: RTL to GDS NPTEL 2023 S. Saurabh

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