Data Sheet: TDA3618JR
Data Sheet: TDA3618JR
Data Sheet: TDA3618JR
DATA SHEET
TDA3618JR
Multiple voltage regulator with
switch and ignition buffers
Preliminary specification 2001 Jun 07
Supersedes data of 1999 Sep 01
File under Integrated Circuits, IC01
Philips Semiconductors Preliminary specification
2001 Jun 07 2
Philips Semiconductors Preliminary specification
ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TDA3618JR DBS17P plastic DIL-bent-SIL (special bent) power package; SOT475-1
17 leads (lead length 12 mm)
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Philips Semiconductors Preliminary specification
BLOCK DIAGRAM
11 TEMPERATURE
ENSW & LOAD DUMP
PROTECTION
BACK-UP SWITCH 16
BU
BACK-UP CONTROL
15
REGULATOR 2 REG2
3
REGULATOR 3 REG3
&
4
EN3
TDA3618JR
2
REGULATOR 1 REG1
&
10
EN1
12
HOLD
1
& 9
RES
13
CRES
5 8
IGN2IN IGNITION BUFFER IGN2OUT
7
IGN1OUT
6 INVERTER
IGN1IN
14
MGR928
GND
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Philips Semiconductors Preliminary specification
PINNING
BU 16
SW 17
MGR929
2001 Jun 07 5
Philips Semiconductors Preliminary specification
FUNCTIONAL DESCRIPTION The hold output is enabled (LOW) at low battery voltages.
This indicates that it is not possible to get regulator 1 into
The TDA3618JR is a multiple output voltage regulator with
regulation when switching it on. The hold function includes
a power switch, intended for use in car radios with or
hysteresis to avoid oscillations when the regulator voltage
without a microcontroller. Because of the low-voltage
crosses the hold threshold. Pin HOLD also becomes LOW
operation of the car radio, low-voltage drop regulators are
when the switch is in foldback protection mode; see Fig.4
used in the TDA3618JR.
for a timing diagram. The hold circuit block diagram is
Regulator 2 switches on when the backup voltage given in Fig.3.
exceeds 6.5 V for the first time and switches off again
The power switch can also be controlled by means of a
when the output voltage of regulator 2 falls below 1.9 V
separate enable input (pin ENSW).
(this is far below an engine start). When regulator 2 is
switched on and its output voltage is within its voltage All output pins are fully protected. The regulators are
range, the reset output is enabled to generate a reset to protected against load dump (regulators 1 and 3 switch off
the microcontroller. The reset cycle can be extended by an at supply voltages >18 V) and short-circuit (foldback
external capacitor at pin CRES. The start-up feature is current protection).
built-in to secure a smooth start-up of the microcontroller
The switch contains a current protection. However, this
at first connection, without uncontrolled switching of
protection is delayed at short-circuit by the reset delay
regulator 2 during the start-up sequence.
capacitor. During this time, the output current is limited to
The charge of the backup capacitor can be used to supply a peak value of at least 3 A and continuous current of 2 A
regulator 2 for a short period when the supply drops to 0 V (VP 18 V).
(the time depends on the value of the storage capacitor).
In the normal situation, the voltage on the reset delay
The output stages of regulators 1 and 3 have an extremely capacitor is approximately 3.5 V (depending on
low noise behaviour and good stability. These regulators temperature). The switch output is approximately
are stabilized by using small output capacitors. VP 0.4 V. At operational temperature, the switch can
deliver at least 3 A. At high temperature, the switch can
When both regulator 2 and the supply voltage (VP > 4.5 V)
deliver approximately 2 A. During an overload condition or
are available, regulators 1 and 3 can be operated by
short-circuit (VSW < VP 3.7 V), the voltage on the reset
means of enable inputs (pins EN1 and EN3 respectively).
delay capacitor rises 0.6 V above the voltage of
Pin HOLD is normally HIGH and is active LOW. Pin HOLD regulator 2. This rise time depends on the capacitor
is connected to an open-collector NPN transistor and must connected to pin CRES. During this time, the switch can
have an external pull-up resistor to operate. The hold deliver more than 3 A. The charge current of the reset
output is controlled by a low voltage detection circuit delay capacitor is typically 4 A and the voltage swing
which, when activated, pulls the warning output LOW approximately 1.5 V. When regulator 2 is out of regulation
(enabled). The detection outputs of the regulators are and generates a reset, the switch can only deliver 2 A and
connected to an OR gate inside the IC such that the hold will go into the foldback protection without delay. At supply
output is activated (goes LOW) when the regulator voltages >17 V, the switch is clamped at 16 V maximum
voltages of regulator 1 and/or regulator 3 are out of (to avoid externally connected circuits being damaged by
regulation for any reason. Each regulator enable input an overvoltage) and the switch will switch off at load dump.
controls its own detection circuit, such that if a regulator is
Interfacing with the microcontroller (simple full or semi
disabled or switched off, the detection circuit for that
on/off logic applications) can be realized with two
regulator is disabled.
independent ignition Schmitt triggers and ignition output
The hold circuit is also controlled by the temperature and buffers (one open-collector and one push-pull output).
load dump protection. Activating the temperature or load Ignition 1 output is inverted.
dump protection causes a hold (LOW) during the time the
The timing diagrams are shown in Figs 4 and 5.
protection is activated. When all regulators are switched
off, pin HOLD is controlled by the battery line (pin VP),
temperature protection and load dump protection.
2001 Jun 07 6
Philips Semiconductors Preliminary specification
&
out of
regulation
enable detector
10 OR
EN1
REGULATOR 1
output stage 3
REG3
OR
12
HOLD
out of
buffer
regulation
enable detector
TEMPERATURE V16
4
EN3 PROTECTION LOAD DUMP FOLDBACK
REGULATOR 3 >150 C MODE
MGL792
2001 Jun 07 7
Philips Semiconductors Preliminary specification
VP 7.0 V
4.5 V
50 V
ignition 1 3.25 V
input
1.1 V
100 V
ignition 1 5.0 V
output
0.2 V
load dump
VP
50 V
ignition 2 2.2 V
input 2.0 V
100 V
5.0 V
ignition 2
output 0.2 V
VP
enable >1.8 V
regulator 3 <1.3 V
enable >1.8 V
regulator 1 <1.3 V
regulator 3
regulator 1
temperature active
protection
150 C passive
HIGH
HOLD
LOW
2001 Jun 07 8
Philips Semiconductors Preliminary specification
VP
6.5 V
VBU 5.4 V
5.0 V
regulator 2 1.9 V
0V
reset 5.0 V
delay 3.0 V
capacitor 0V
5.0 V
reset
load dump
18 V
10.4 V
VP 7.0 V
4.0 V
enable >1.8 V
regulator 1 <1.3 V
9V
regulator 1
0V
enable >1.8 V
regulator 3 <1.3 V
5.0 V
regulator 3
0V
load dump
16.9 V
VP 7.0 V
4.0 V
enable >1.8 V
power
switch <1.3 V
16 V
power
switch
output
0V
MGK610
Power switch behaviour
2001 Jun 07 9
Philips Semiconductors Preliminary specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VP supply voltage operating 18 V
reverse polarity; non-operating 18 V
jump start; t 10 minutes 30 V
load dump protection; t 50 ms; tr 2.5 ms 50 V
Ptot total power dissipation 62 W
Tstg storage temperature non-operating 55 +150 C
Tamb ambient temperature operating 40 +85 C
Tj junction temperature operating 40 +150 C
THERMAL CHARACTERISTICS
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Philips Semiconductors Preliminary specification
CHARACTERISTICS
VP = 14.4 V; Tamb = 25 C; see Fig.8; unless otherwise specified.
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Philips Semiconductors Preliminary specification
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Philips Semiconductors Preliminary specification
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Philips Semiconductors Preliminary specification
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Philips Semiconductors Preliminary specification
6. The delay time depends on the value of the capacitor connected to pin CRES:
C 3
t d ( RES ) = ------- ( V OREG2 ) 3.5 ) = C ( 375 10 ) [s]
I ch
7. The drop-out voltage of regulators 1, 2 and 3 is measured between pins VP and REGn.
8. At current limit, Ilim is held constant (see Fig.6 for the behaviour of Ilim).
9. The foldback current protection limits the dissipated power at short-circuit (see Fig.6).
10. The drop-out voltage is measured between pins BU and REG2.
11. The drop-out voltage of the power switch is measured between pins VP and SW.
12. The maximum output current of the power switch is limited to 1.8 A when the supply voltage exceeds 18 V.
A test-mode is built-in. The delay time of the power switch is disabled when a voltage of VP + 1 V is applied to the
switch-enable input.
13. At short-circuit, Isc of the power switch is held constant to a lower value than the continuous current after a delay of
at least 10 ms. A test-mode is built-in. The delay time of the switch is disabled when a voltage of VP + 1 V is applied
to the switch-enable input.
14. VIGN1OUT = LOW for VIGN1IN > 1.2 V or VEN1 > 1.3 V or VEN3 > 1.3 V or VENSW > 1.3 V.
2001 Jun 07 15
Philips Semiconductors Preliminary specification
9.0
5.0
a. Regulator 1. b. Regulator 2.
handbook, halfpage
VO(REG3)
(V)
MGL599
5.0
Isc Ilim
IREG3 (A)
c. Regulator 3.
VSW
(V)
VP 3.3
not
generates delayed delayed
hold
2VBE
1 >1.8 >3
ISW (A)
2001 Jun 07 16
Philips Semiconductors Preliminary specification
EN1 REG1 10 V
10 2
VEN1 C4 RL(REG1)
10 F
10 k
EN3 REG3 5V
4 3
VEN3 C5 RL(REG3)
10 F
5 k
TDA3618JR
CRES
13 R2
C7 10 k
RES
47 nF 9
C6
1 F
R3
BU 10 k
16 HOLD
VBU 12
C8
R4
IGN1IN 10 k
R5 IGN1OUT
6 7
10 k C9
VIGN1
1 nF
R6 IGN2IN IGN2OUT
5 8
10 k C10
VIGN2 14
1 nF
ground
MGR932
2001 Jun 07 17
Philips Semiconductors Preliminary specification
Application information The two examples show how an output capacitor value is
selected.
NOISE
Table 1 Noise figures Example 1
NOISE FIGURE (V)(1) Regulators 1 and 3 are stabilized with an electrolytic
REGULATOR output capacitor of 220 F (ESR = 0.15 ).
Co = 10 F Co = 47 F Co = 100 F At Tamb = 30 C the capacitor value is decreased to
1 170 130 110 73 F and the ESR is increased to 1.1 . The regulator will
2 180 120 100 remain stable at Tamb = 30 C (see Fig.9).
3 100 70 65
Example 2
Note Regulator 2 is stabilized with a 10 F electrolytic capacitor
1. Measured at a bandwidth of 200 kHz. (ESR = 3 ). At Tamb = 30 C the capacitor value is
decreased to 3 F and the ESR is increased to 23.1 .
The noise on the supply line depends on the value of the The regulator will be unstable at Tamb = 30 C (see
supply capacitor and is caused by a current noise (output Fig.10).
noise of the regulators is translated into a current noise by
means of the output capacitors). When a high frequency Solution
capacitor of 220 nF in parallel with an electrolytic capacitor To avoid problems with stability at low temperatures, the
of 100 F is connected directly to pins 1 and 14 (supply use of tantalum capacitors is recommended. Use a
and ground), the noise is minimal. tantalum capacitor of 10 F or a larger electrolytic
capacitor.
STABILITY
The regulators are stabilized with the externally connected
output capacitors. The output capacitors can be selected
using the graphs of Figs 9 and 10. When an electrolytic
capacitor is used, the temperature behaviour of this output
capacitor can cause oscillations at a low temperature.
maximum ESR 8
10
stable region
6
5 stable region 4
2 minimum ESR
0 0
0.1 1 10 100 0.22 1 10 100
C (F) C (F)
Fig.9 Curve for selecting the value of output Fig.10 Curve for selecting the value of output
capacitor for regulators 1 and 3. capacitor for regulator 2.
2001 Jun 07 18
Philips Semiconductors Preliminary specification
PACKAGE OUTLINE
DBS17P: plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm) SOT475-1
non-concave
Dh
x
D
Eh
d A2
j E
L3
L Q
1 17
Z e1 w M c v M
bp
e m e2
0 5 10 mm
scale
17.0 4.6 0.75 0.48 24.0 20.0 12.2 6 3.4 12.4 2.4 2.1 2.00
mm 10 2.54 1.27 5.08 4.3 0.8 0.4 0.03
15.5 4.4 0.60 0.38 23.6 19.6 11.8 3.1 11.0 1.6 1.8 1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
97-05-20
SOT475-1
99-12-17
2001 Jun 07 19
Philips Semiconductors Preliminary specification
SOLDERING The total contact time of successive solder waves must not
exceed 5 seconds.
Introduction to soldering through-hole mount
packages The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
This text gives a brief insight to wave, dip and manual
specified maximum storage temperature (Tstg(max)). If the
soldering. A more in-depth account of soldering ICs can be
printed-circuit board has been pre-heated, forced cooling
found in our Data Handbook IC26; Integrated Circuit
may be necessary immediately after soldering to keep the
Packages (document order number 9398 652 90011).
temperature within the permissible limit.
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit Manual soldering
board.
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
Soldering by dipping or by solder wave
2 mm above it. If the temperature of the soldering iron bit
The maximum permissible temperature of the solder is is less than 300 C it may remain in contact for up to
260 C; solder at this temperature must not be in contact 10 seconds. If the bit temperature is between
with the joints for more than 5 seconds. 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING WAVE
DBS, DIP, HDIP, SDIP, SIL suitable suitable(1)
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2001 Jun 07 20
Philips Semiconductors Preliminary specification
PRODUCT
DATA SHEET STATUS(1) DEFINITIONS
STATUS(2)
Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS DISCLAIMERS
Short-form specification The data in a short-form Life support applications These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes, without notice, in the
Characteristics sections of the specification is not implied. products, including circuits, standard cells, and/or
Exposure to limiting values for extended periods may software, described or contained herein in order to
affect device reliability. improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
Application information Applications that are
the use of any of these products, conveys no licence or title
described herein for any of these products are for
under any patent, copyright, or mask work right to these
illustrative purposes only. Philips Semiconductors make
products, and makes no representations or warranties that
no representation or warranty that such applications will be
these products are free from patent, copyright, or mask
suitable for the specified use without further testing or
work right infringement, unless otherwise specified.
modification.
2001 Jun 07 21
Philips Semiconductors Preliminary specification
NOTES
2001 Jun 07 22
Philips Semiconductors Preliminary specification
NOTES
2001 Jun 07 23
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Printed in The Netherlands 753503/03/pp24 Date of release: 2001 Jun 07 Document order number: 9397 750 08026