Ina 333
Ina 333
Ina 333
INA333
SBOS445C – JULY 2008 – REVISED DECEMBER 2015
Simplified Schematic
V+
2
VIN- RFI Filtered Inputs 150kW 150kW
A1
RFI Filtered Inputs
1
50kW
6
RG A3 VOUT
50kW
8
4
100kW
V- G=1+
RG
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
INA333
SBOS445C – JULY 2008 – REVISED DECEMBER 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes........................................ 13
2 Applications ........................................................... 1 8 Application and Implementation ........................ 14
3 Description ............................................................. 1 8.1 Application Information............................................ 14
4 Revision History..................................................... 2 8.2 Typical Application ................................................. 14
5 Pin Configuration and Functions ......................... 3 9 Power Supply Recommendations...................... 19
6 Specifications......................................................... 4 10 Layout................................................................... 20
6.1 Absolute Maximum Ratings ...................................... 4 10.1 Layout Guidelines ................................................. 20
6.2 ESD Ratings.............................................................. 4 10.2 Layout Example .................................................... 20
6.3 Recommended Operating Conditions....................... 4 11 Device and Documentation Support ................. 21
6.4 Thermal Information ................................................. 4 11.1 Device Support...................................................... 21
6.5 Electrical Characteristics........................................... 5 11.2 Documentation Support ........................................ 22
6.6 Typical Characteristics .............................................. 7 11.3 Trademarks ........................................................... 22
7 Detailed Description ............................................ 13 11.4 Electrostatic Discharge Caution ............................ 22
7.1 Overview ................................................................. 13 11.5 Glossary ................................................................ 23
7.2 Functional Block Diagram ....................................... 13 12 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................. 13 Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
DGK Package
8-Pin VSSOP DRG Package
Top View 8-Pin WSON
Top View
RG 1 8 RG
RG 1 8 RG
VIN- 2 7 V+ Exposed
VIN- 2 Thermal 7 V+
VIN+ 3 6 VOUT Die Pad
VIN+ 3 on 6 VOUT
V- 4 5 REF Underside
V- 4 5 REF
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
REF 5 I Reference input. This pin must be driven by low impedance or connected to ground.
RG 1, 8 — Gain setting pins. For gains greater than 1, place a gain resistor between pins 1 and 8.
V+ 7 — Positive supply
–
V 4 — Negative supply
VIN+ 3 I Positive input
VIN– 2 I Negative input
VOUT 6 O Output
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage 7 V
(2)
Analog input voltage (V–) – 0.3 (V+) + 0.3 V
Output short-circuit (3) Continuous
Operating temperature, TA –40 150 °C
Junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be
current limited to 10 mA or less.
(3) Short-circuit to ground.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
VS = 5.5V VS = 5.5V
Population
Population
-0.10
-0.09
-0.08
-0.07
-0.06
-0.05
-0.04
-0.03
-0.02
-0.01
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
10.0
-25.0
-22.5
-20.0
-17.5
-15.0
-12.5
-10.0
-7.5
-5.0
-2.5
0
2.5
5.0
7.5
12.5
15.0
17.5
20.0
22.5
25.0
Input Offset Voltage (mV) Input Voltage Offset Drift (mV/°C)
Figure 1. Input Offset Voltage Figure 2. Input Voltage Offset Drift (–40°C to 125°C)
VS = 5.5V VS = 5.5V
Population
Population
-0.50
-0.45
-0.40
-0.35
-0.30
-0.25
-0.20
-0.15
-0.10
-0.05
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
30.0
-75.0
-67.5
-60.0
-52.5
-45.0
-37.5
-30.0
-22.5
-15.0
-7.5
0
7.5
15.0
22.5
37.5
45.0
52.5
60.0
67.5
75.0
Figure 3. Output Offset Voltage Figure 4. Output Voltage Offset Drift (–40°C to 125°C)
0
Gain = 1
VS = 1.8V
-5
VS = 5V
Noise (1mV/div)
-10
VOS (mV)
-15
-20
-25
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Time (1s/div)
VCM (V)
100 100
Current Noise
Input Noise
10 10
2
2
(Output Noise)
Total Input-Referred Noise = (Input Noise) +
G
1 1
Time (1s/div) 0.1 1 10 100 1k 10k
Frequency (Hz)
VS = ±2.75V
G = 100
0.008
G = 10
-0.004
-0.008
-0.012
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Time (25ms/div)
VOUT (V)
Figure 11. Large-Signal Step Response Figure 12. Small-Signal Step Response
1000
Time (ms)
0.001%
100
0.01% 0.1%
10
Time (100ms/div) 1 10 100 1000
Gain (V/V)
Figure 13. Small-Signal Step Response Figure 14. Settling Time vs Gain
80
Gain = 1
Supply G = 1000
60
G = 100
VOUT 40
VOUT (50mV/div)
Supply (1V/div)
G = 10
Gain (dB)
20
G=1
0
-20
-40
-60
Time (50ms/div) 10 100 1k 10k 100k 1M
Frequency (Hz)
2
0
-2
-4
G = 100,
-6 G = 1000
-8
-10
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
100
Figure 17. Common-Mode Rejection Ratio Figure 18. Common-Mode Rejection Ratio vs Temperature
80 0
60
G=1 -1.0
40
G = 10
20 -2.0
0 2.5
10 100 1k 10k 100k -2.5 -2.0 -1.0 0 1.0 2.0 2.5
Frequency (Hz) Output Voltage (V)
Figure 19. Common-Mode Rejection Ratio vs Frequency Figure 20. Typical Common-Mode Range vs Output Voltage
5 0.9
VS = +5V VS = ±0.9V
VREF = 0 0.7 VREF = 0
Common-Mode Voltage (V)
0.3
3
0.1
All Gains All Gains
-0.1
2
-0.3
1 -0.5
-0.7
0 -0.9
0 1 2 3 4 5 -0.9 -0.7 -0.5 -0.3 -0.1 0.1 0.3 0.5 0.7 0.9
Output Voltage (V) Output Voltage (V)
Figure 21. Typical Common-Mode Range vs Output Voltage Figure 22. Typical Common-Mode Range vs Output Voltage
1.8 160
VS = +1.8V
1.6 VREF = 0 140
G = 1000
Common-Mode Voltage (V)
1.4 120
1.2
+PSRR (dB)
100
1.0 G = 100
All Gains 80
0.8
60
0.6
G = 10
40
0.4
G=1
0.2 20
0 0
0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 1 10 100 1k 10k 100k 1M
Output Voltage (V) Frequency (Hz)
Figure 23. Typical Common-Mode Range vs Output Voltage Figure 24. Positive Power-Supply Rejection Ratio
600
IB (pA)
80
G = 10
60 400
VS = ±0.9V VS = ±2.75V
40
G=1 200
20
0
0
-20 -200
0.1 1 10 100 1k 10k 100k 1M -50 -25 0 25 50 75 100 125 150
Frequency (Hz) Temperature (°C)
Figure 25. Negative Power-Supply Rejection Ratio Figure 26. Input Bias Current vs Temperature
200 250
180
200
160
140 150
| IB | (pA)
120
IOS (pA)
100
100 VS = ±2.75V
50
80
60 0
VS = 5V VS = ±0.9V
40
-50
20
VS = 1.8V
0 -100
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -50 -25 0 25 50 75 100 125 150
VCM (V) Temperature (°C)
Figure 27. Input Bias Current vs Common-Mode Voltage Figure 28. Input Offset Current vs Temperature
(V+) 80
(V+) - 0.25 VS = ±2.75V
(V+) - 0.50 VS = ±0.9V 70
(V+) - 0.75 VS = 5V
(V+) - 1.00 60
(V+) - 1.25
(V+) - 1.50 50
VOUT (V)
IQ (mA)
(V+) - 1.75
40
(V-) + 1.75 VS = 1.8V
(V-) + 1.50 30
(V-) + 1.25
(V-) + 1.00 20
(V-) + 0.75 +125°C
(V-) + 0.50 +25°C 10
(V-) + 0.25 -40°C
(V-) 0
0 10 20 30 40 50 60 -50 -25 0 25 50 75 100 125 150
IOUT (mA) Temperature (°C)
Figure 29. Output Voltage Swing vs Output Current Figure 30. Quiescent Current vs Temperature
70
VS = 5V
60
50
IQ (mA)
40
VS = 1.8V
30
20
10
0
0 1.0 2.0 3.0 4.0 5.0
VCM (V)
7 Detailed Description
7.1 Overview
The INA333 is a monolithic instrumentation amplifier (INA) based on the precision zero-drift OPA333 (operational
amplifier) core. The INA333 also integrates laser-trimmed resistors to ensure excellent common-mode rejection
and low gain error. The combination of the zero-drift amplifier core and the precision resistors allows this device
to achieve outstanding DC precision and makes the INA333 ideal for many 3.3-V and 5-V industrial applications.
V+
2
VIN- RFI Filtered Inputs 150kW 150kW
A1
RFI Filtered Inputs
1
50kW
6
RG A3 VOUT
50kW
8
4
100kW
V- G=1+
RG
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
0.1mF
2
VIN- RFI Filter 150kW 150kW
A1
RFI Filter VO = G ´ (VIN+ - VIN-)
1 100kW
50kW G=1+
RG
6
RG A3
50kW +
8 Load VO
-
RFI Filter 150kW 150kW
5
A2
VIN+ 3 Ref
RFI Filter
INA333
4 0.1mF
VIN-
RG INA333 VO
Ref
VIN+
(1) NC denotes no connection. When using the SPICE model, the simulation will not converge unless a
resistor is connected to the RG pins; use a very large resistor value.
8.2.2.2 Internal Offset Correction
The INA333 device internal operational amplifiers use an auto-calibration technique with a time-continuous 350-
kHz operational amplifier in the signal path. The amplifier is zero-corrected every 8 μs using a proprietary
technique. Upon power-up, the amplifier requires approximately 100 μs to achieve specified VOS accuracy. This
design has no aliasing or flicker noise.
VIN-
V+
RG INA333 VO
100mA
Ref 1/2 REF200
VIN+
100W
OPA333
±10mV 10kW
Adjustment Range
100W
100mA
1/2 REF200
V-
Microphone,
Hydrophone, INA333
etc.
47kW 47kW
Thermocouple INA333
10kW
INA333
With single-supply operation, VIN+ and VIN– must both be 0.1 V more than ground for linear operation. For
instance, the inverting input cannot be connected to ground to measure a voltage connected to the noninverting
input.
To show the issues affecting low voltage operation, consider the circuit in Figure 35. It shows the INA333 device
operating from a single 3-V supply. A resistor in series with the low side of the bridge assures that the bridge
output voltage is within the common-mode range of the amplifier inputs.
+3V 3V
2V - DV
RG INA333 VO
300W
Ref
2V + DV 1.5V
150W
(1)
R1
(1) R1 creates proper common-mode voltage, only for low-voltage operation—see Single-Supply Operation.
Figure 36. Large Signal Response Figure 37. Large-Signal Step Response
Figure 38. Small-Signal Step Response Figure 39. Small-Signal Step Response
10 Layout
Bypass
Capacitor
RG RG
V+
VIN- V-IN V+
V+IN VO VOUT
VIN+
V- Ref GND
Bypass
Capacitor
V- GND
NOTE
These files require that either the TINA software (from DesignSoft) or TINA-TI software be
installed. Download the free TINA-TI software from the TINA-TI folder.
VoA1
1/2 of matched
monolithic dual RELATED PRODUCTS
NPN transistors For monolithic logarithmic amplifiers (such as LOG112 or LOG114) see the link in footnote 1.
(example: MMDT3904)
Vout
2 _ 4 U1 INA333
3
2 RG V-
R3 14k
- R8 10k -
+ 1
Out
Input I 10n 1 + 4 V 8 Ref 6 +
+ VM1 RG V+ +
5 U5 OPA369 U1 OPA335
C1 1n
+ 5
Vref+
Vref+
3 7 Vdiff
VCC
Vref+
VCC
VCC
(example: MMDT3904)
VoA2
VCC
(1) The following link launches the TI logarithmic amplifiers web page: Logarithmic Amplifier Products Home Page
Figure 41. Low-Power Log Function Circuit for Portable Battery-Powered Systems
(Example Glucose Meter)
R1
2kW
RWa
EMU21 RTD3 3W
-
Pt100 RTD RWb U2
3W OPA333
+
VT+ RTD+ + 2 _ 4 U1 INA333
VT 25 3V
VT- RTD- RG V- VDIFF
1 MSP430
RGAIN PGA112
Mon+ Mon- Out
100kW 8 Ref 6
RG V+
RWc
RZERO + 5
4W 3
Temp (°C) 100W 7
+
(Volts = °C) V
VREF+
VRTD 3V
RWd
RTD Resistance 3W
(Volts = Ohms)
+ +
A IREF1 A IREF2
3V
VREF 3V
U1 REF3212 VREF VREF
Use BF861A S Use BF861A 3V
EN OUTF
In + T3 BF256A
OUTS + +
T1 BF256A +
GNDF GNDS OPA3331 OPA333 U3
3V
C7 - OPA333
470nF G -
V4 3
RSET2
RSET1
2.5kW
2.5kW
RWa, RWb, RWc, and RWd simulate wire resistance. These resistors are included to show the four-wire sense technique immunity to line
mismatches. This method assumes the use of a four-wire RTD.
Figure 42. Four-Wire, 3-V Conditioner for a PT100 RTD With Programmable Gain Acquisition System
To download a compressed file that contains the TINA-TI simulation file for this circuit, click the following link:
PT100 RTD.
11.3 Trademarks
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 12-Aug-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
INA333AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU | Level-2-260C-1 YEAR -40 to 125 I333
& no Sb/Br) CU NIPDAUAG
INA333AIDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 I333
& no Sb/Br)
INA333AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU | Level-2-260C-1 YEAR -40 to 125 I333
& no Sb/Br) CU NIPDAUAG
INA333AIDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 I333
& no Sb/Br)
INA333AIDRGR ACTIVE SON DRG 8 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 I333A
& no Sb/Br)
INA333AIDRGT ACTIVE SON DRG 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 I333A
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 12-Aug-2017
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2015
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2015
Pack Materials-Page 2
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