Freescale Semiconductor MPX5700

Technical Data Rev 8, 01/2007

Integrated Silicon Pressure Sensor

MPX5700
On-Chip Signal Conditioned,
SERIES
Temperature Compensated and
Calibrated
INTEGRATED
The MPX5700 series piezoresistive transducer is a state-of-the-art monolithic
PRESSURE SENSOR
silicon pressure sensor designed for a wide range of applications, but particularly
0 to 700 kPa (0 to 101.5 psi)
those employing a microcontroller or microprocessor with A/D inputs. This
15 to 700 kPa (2.18 to 101.5 psi)
patented, single element transducer combines advanced micromachining
0.2 to 4.7 V OUTPUT
techniques, thin-film metallization, and bipolar processing to provide an accurate,
high level analog output signal that is proportional to the applied pressure.

Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Available in Absolute, Differential and Gauge Configurations
MPX5700D
• Patented Silicon Shear Stress Strain Gauge
CASE 867-08
• Durable Epoxy Unibody Element

ORDERING INFORMATION

Device Case MPX Series

Options
Type Type Order Number Device Marking
Basic Differential 867 MPX5700D MPX5700D
Element
Absolute 867 MPX5700A MPX5700A MPX5700AP
CASE 867B-04
Ported Differential Dual Ports 867C MPX5700DP MPX5700DP
Elements
Gauge 867B MPX5700GP MPX5700GP
Gauge, Axial 867E MPX5700GS MPX5700D
Absolute 867B MPX5700AP MPX5700AP
MPX5700DP
Absolute, Axial 867E MPX5700AS MPX5700A
CASE 867C-05
Absolute, Axial PC Mount 867F MPX5700ASX MPX5700A

VS MPX5700AS
CASE 867E-03

Thin Film Gain Stage #2

Temperature and MPX5700ASX
Sensing Compensation Ground Vout CASE 867F-03
Element and Reference
Gain Stage #1 Shift Circuitry
PIN NUMBERS
1 Vout 4 N/C
2 GND 5 N/C
Pins 4, 5, and 6 are no connects
GND 3 VS 6 N/C
NOTE: Pins 4, 5, and 6 are internal device
connections. Do not connect to external
Figure 1. Fully Integrated Pressure Sensor Schematic circuitry or ground. Pin 1 is noted by the
notch in the lead.

© Freescale Semiconductor, Inc., 2007. All rights reserved.

Table 1. Maximum Ratings(1)

Parametrics Symbol Value Unit

(2)
Maximum Pressure (P2 ≤ 1 Atmosphere) P1max 2800 kPa
Storage Temperature Tstg –40 to +125 °C
Operating Temperature TA –40 to +125 °C

1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the
device.
2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa.

Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)

Characteristic Symbol Min Typ Max Unit

Pressure Range(1) Gauge, Differential: MPX5700D POP 0 — 700 kPa
Absolute: MPX5700A 15 — 700
Supply Voltage(2) VS 4.75 5.0 5.25 Vdc
Supply Current IO — 7.0 10 mAdc
Zero Pressure Offset(3) Gauge, Differential (0 to 85°C) Voff 0.088 0.2 0.313 Vdc
Absolute (0 to 85°C) 0.184 — 0.409
Full Scale Output(4) (0 to 85°C) VFSO 4.587 4.7 4.813 Vdc
Full Scale Span(5) (0 to 85°C) VFSS — 4.5 — Vdc
Accuracy(6) (0 to 85°C) — — — ±2.5 %VFSS
Sensitivity V/P — 6.4 —- mV/kPa
(7)
Response Time tR — 1.0 —- ms
Output Source Current at Full Scale Output IO+ — 0.1 —- mAdc
Warm-Up Time(8) — — 20 —- ms

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at
the minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential
pressure applied.
• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from
the minimum or maximum rated pressure, at 25°C.
• TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C,
relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.

Table 3. Mechanical Characteristics

Characteristics Typ Unit

Weight, Basic Element (Case 867) 4.0 grams

MPX5700
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2 Freescale Semiconductor
 ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 3 illustrates both the Differential/Gauge and the performance and long-term reliability. Contact the factory for
Absolute Sensing Chip in the basic chip carrier (Case 867). information regarding media compatibility in your application.
A fluorosilicone gel isolates the die surface and wire bonds Figure 2 shows the sensor output signal relative to
from the environment, while allowing the pressure signal to pressure input. Typical, minimum, and maximum output
be transmitted to the sensor diaphragm. (For use of the curves are shown for operation over a temperature range of
MPX5700D in a high-pressure cyclic application, consult the 0° to 85°C using the decoupling circuit shown in Figure 4. The
factory.) output will saturate outside of the specified pressure range.
The MPX5700 series pressure sensor operating Figure 4 shows the recommended decoupling circuit for
characteristics, and internal reliability and qualification tests interfacing the output of the integrated sensor to the A/D input
are based on use of dry air as the pressure media. Media, of a microprocessor or microcontroller. Proper decoupling of
other than dry air, may have adverse effects on sensor the power supply is recommended.

5.0
Transfer Function:
4.5
Vout = VS*(0.0012858*P+0.04) ± Error
4.0 VS = 5.0 Vdc
3.5 Temperature = 0 to 85°C
Typical
3.0
Output (V)

2.5
Maximum Minimum
2.0
1.5
1.0
0.5
0
0 100 200 300 400 500 600 700 800
Differential Pressure (kPa)
Figure 2. Output versus Pressure Differential

Fluoro Silicone Stainless Steel Fluoro Silicone Stainless Steel

Die Coat Metal Cover Die Coat Metal Cover
Die Die

Wire Bond P1 Wire Bond P1

Lead Frame RTV Die Lead Frame RTV Die

P2 Bond P2 Bond
Epoxy Case Epoxy Case
DIFFERENTIAL/GAUGE ELEMENT ABSOLUTE ELEMENT

Figure 3. Cross-Sectional Diagrams (not to scale)

+5 V

Vout Output
Vs

IPS

1.0 µF 0.01 µF GND 470 pF

Figure 4. Recommended Power Supply Decoupling and Output Filtering

(For additional output filtering, please refer to Application Note AN1646)

MPX5700
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Freescale Semiconductor 3
 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor pressure sensor is designed to operate with positive
as the Pressure (P1) side and the Vacuum (P2) side. The differential pressure applied, P1 > P2.
Pressure (P1) side is the side containing fluoro silicone gel The Pressure (P1) side may be identified by using the
which protects the die from harsh media. The Freescale MPX table below:

Pressure (P1)
Part Number Case Type
Side Identifier
MPX5700D, MPX5700A 867 Stainless Steel Cap
MPX5700DP 867C Side with Part Marking
MPX5700GP, MPX5700AP 867B Side with Port Attached
MPX5700GS, MPX5700AS 867E Side with Port Attached
MPX5700ASX 867F Side with Port Attached

MPX5700
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4 Freescale Semiconductor
 PACKAGE DIMENSIONS

C
NOTES:
R 1. DIMENSIONING AND TOLERANCING PER
POSITIVE PRESSURE ANSI Y14.5M, 1982.
(P1) 2. CONTROLLING DIMENSION: INCH.
M 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
B 16.00 (0.630).
-A-
INCHES MILLIMETERS
N DIM MIN MAX MIN MAX
PIN 1
L A 0.595 0.630 15.11 16.00
1 2 3 4 5 6
SEATING B 0.514 0.534 13.06 13.56
PLANE -T- C 0.200 0.220 5.08 5.59
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
J G G 0.100 BSC 2.54 BSC
S F J 0.014 0.016 0.36 0.40
D 6 PL L 0.695 0.725 17.65 18.42
0.136 (0.005) M T A M M 30˚ NOM 30˚ NOM
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
S 0.090 0.105 2.29 2.66
STYLE 1: STYLE 2: STYLE 3:
PIN 1. VOUT PIN 1. OPEN PIN 1. OPEN
2. GROUND 2. GROUND 2. GROUND
3. VCC 3. -VOUT 3. +VOUT
4. V1 4. VSUPPLY 4. +VSUPPLY
5. V2 5. +VOUT 5. -VOUT
6. VEX 6. OPEN 6. OPEN

CASE 867-08
ISSUE N
BASIC ELEMENT

NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
P 2. CONTROLLING DIMENSION: INCH.
-A-
0.25 (0.010) M T Q M
INCHES MILLIMETERS
U DIM MIN MAX MIN MAX
X A 1.145 1.175 29.08 29.85
W L
R B 0.685 0.715 17.40 18.16
V C 0.405 0.435 10.29 11.05
PORT #1 D 0.027 0.033 0.68 0.84
POSITIVE PORT #2 VACUUM (P2)
PRESSURE F 0.048 0.064 1.22 1.63
PORT #1 POSITIVE
(P1) N PRESSURE (P1) G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.41
-Q- K 0.695 0.725 17.65 18.42
PORT #2 L 0.290 0.300 7.37 7.62
VACUUM
(P2) N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
B Q 0.153 0.159 3.89 4.04
PIN 1 R 0.063 0.083 1.60 2.11
S 0.220 0.240 5.59 6.10
K U 0.910 BSC 23.11 BSC
1 2 3 4 5 6
V 0.182 0.194 4.62 4.93
C W 0.310 0.330 7.87 8.38
S X 0.248 0.278 6.30 7.06
SEATING SEATING
-T- -T- PLANE
PLANE G D 6 PL STYLE 1:
J PIN 1. VOUT
F 0.13 (0.005) M A M 2. GROUND
3. VCC
4. V1
5. V2
6. VEX

CASE 867C-05
ISSUE F
PRESSURE AND VACUUM SIDES PORTED (DP)

MPX5700
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Freescale Semiconductor 5
 PACKAGE DIMENSIONS

PAGE 1 OF 2

CASE 867B-04
ISSUE G
PRESSURE SIDE PORTED (AP, GP)

MPX5700
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6 Freescale Semiconductor
 PACKAGE DIMENSIONS

PAGE 2 OF 2

CASE 867B-04
ISSUE G
PRESSURE SIDE PORTED (AP, GP)

MPX5700
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Freescale Semiconductor 7
 PACKAGE DIMENSIONS

NOTES:
C A 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.690 0.720 17.53 18.28
-B- V B 0.245 0.255 6.22 6.48
PIN 1 C 0.780 0.820 19.81 20.82
D 0.027 0.033 0.69 0.84
E 0.178 0.186 4.52 4.72
F 0.048 0.064 1.22 1.63
PORT #1 6 5 4 3 2 1 G 0.100 BSC 2.54 BSC
POSITIVE J 0.014 0.016 0.36 0.41
PRESSURE
(P1) K K 0.345 0.375 8.76 9.53
S N 0.300 0.310 7.62 7.87
S 0.220 0.240 5.59 6.10
V 0.182 0.194 4.62 4.93
J G
N E F STYLE 1:
D 6 PL PIN 1. VOUT
2. GROUND
-T- 0.13 (0.005) M T B M 3. VCC
4. V1
5. V2
6. VEX

CASE 867E-03
ISSUE D
PRESSURE SIDE PORTED (AS, GS)

-T- NOTES:
C A 1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
E U -Q- 2. CONTROLLING DIMENSION: INCH.

INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 1.080 1.120 27.43 28.45
B 0.740 0.760 18.80 19.30
C 0.630 0.650 16.00 16.51
N D 0.027 0.033 0.68 0.84
V B E 0.160 0.180 4.06 4.57
F 0.048 0.064 1.22 1.63
R G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.41
PORT #1 PIN 1 K 0.220 0.240 5.59 6.10
POSITIVE N 0.070 0.080 1.78 2.03
PRESSURE -P-
(P1) P 0.150 0.160 3.81 4.06
0.25 (0.010) M T Q M 6 5 4 3 2 1
Q 0.150 0.160 3.81 4.06
S R 0.440 0.460 11.18 11.68
S 0.695 0.725 17.65 18.42
K U 0.840 0.860 21.34 21.84
V 0.182 0.194 4.62 4.93
J D 6 PL
G STYLE 1:
0.13 (0.005) M T P S Q S PIN 1. VOUT
2. GROUND
F 3. VCC
4. V1
5. V2
6. VEX

CASE 867F-03
ISSUE D
PRESSURE SIDE AXIAL PORT (ASX)

MPX5700
Sensors
8 Freescale Semiconductor
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MPX5700
Rev. 8
01/2007