Datasheet PDF
Datasheet PDF
Datasheet PDF
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PIN NUMBER
1 Gnd 3 VS
Preferred devices are Motorola recommended choices for future use and
best overall value. 2 +Vout 4 –Vout
NOTE: Pin 1 is noted by the notch in
REV 9 the lead.
OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic Symbol Min Typ Max Unit
Pressure Range(1) POP 0 — 10 kPa
Supply Voltage(2) VS — 10 16 Vdc
Supply Current Io — 6.0 — mAdc
Full Scale Span(3) VFSS 24 25 26 mV
Offset(4) Voff –1.0 — 1.0 mV
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Figure 2 shows the output characteristics of the This performance over temperature is achieved by having
MPX2010/MPXV2010G series at 25°C. The output is direct- both the shear stress strain gauge and the thin–film resistor
ly proportional to the differential pressure and is essentially a circuitry on the same silicon diaphragm. Each chip is dynam-
straight line. ically laser trimmed for precise span and offset calibration
The effects of temperature on full scale span and offset are and temperature compensation.
very small and are shown under Operating Characteristics.
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Figure 3 illustrates the differential/gauge die in the basic ating characteristics and internal reliability and qualification
chip carrier (Case 344). A silicone gel isolates the die surface tests are based on use of dry air as the pressure media. Me-
and wire bonds from the environment, while allowing the pres- dia other than dry air may have adverse effects on sensor
sure signal to be transmitted to the silicon diaphragm. performance and long term reliability. Contact the factory for
The MPX2010/MPXV2010G series pressure sensor oper- information regarding media compatibility in your application.
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NOTES
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