tps653853 q1
tps653853 q1
tps653853 q1
www.ti.com TPS653853-Q1
SLVSDC4B – DECEMBER 2016 – REVISED FEBRUARY 2021
SLVSDC4B – DECEMBER 2016 – REVISED FEBRUARY 2021
3 Description
The TPS653853-Q1 device is a multirail power supply designed to supply microcontrollers in safety relevant
applications, such as those found in the automotive industry. The device supports microcontrollers with dual-core
lockstep (LS) or loosely coupled architectures (LC).
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2021 Texas Instruments at the end of this data sheet addresses availability, warranty, changes, use in safety-critical
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Product Folder Links: TPS653853-Q1
TPS653853-Q1
SLVSDC4B – DECEMBER 2016 – REVISED FEBRUARY 2021 www.ti.com
The TPS653853-Q1 device integrates multiple supply rails to power the MCU, CAN or FlexRay, and external
sensors. A buck-boost converter with internal FETs converts the input battery voltage between 2.3 V and 36 V to
a 6-V preregulator output that supplies the other regulators. An integrated charge pump provides an overdrive
voltage for the internal regulators, and can also be used to drive an external NMOS FET as reverse battery
protection. The device supports wake-up from an ignition signal (IGN pin) or wake-up from a CAN transceiver or
other signal (CAN_WU pin).
The device has a steering-angle monitoring (SAM) unit that allows the ECU to indirectly capture the position of
the steering wheel through the motor-position sensors. A dedicated low-power mode allows this SAM unit to
operate even when the ECU is in sleep mode. Integrated SAM-switches allow passing-through of the Motor-
Position Sensor signals to the MCU during normal operation, or decoupling the MCU ADC inputs from the motor-
position sensor signals when the ECU is in sleep mode.
An independent voltage monitoring unit inside the device monitors undervoltage and overvoltage on all internal
supply rails and regulator outputs of the battery supply. Regulator current limits and temperature protections are
also implemented. The TPS653853-Q1 device features a question-answer watchdog, MCU error-signal monitor,
clock monitoring on internal oscillator, self-check on clock monitor, cyclic redundancy check (CRC) on non-
volatile memory and SPI communication, a diagnostic output pin allowing MCU to observe device internal analog
and digital signals, a reset circuit for the MCU (NRES pin) and a safing output (ENDRV pin) to disable external
power-stages on any detected system-failure. The device automatically runs a built-in self-test (BIST) at start up
and the MCU may re-run the BIST during system run time through software control if needed. A dedicated
DIAGNOSTIC state allows the MCU to check TPS653853-Q1 functionality.
The TPS653853-Q1 device also has an error reporting capability through the SPI register. The device has
separate status bits in the SPI register for each specific error on the system level or device level. When the
device detects a particular error condition, it sets the appropriate status bit and keeps this status bit set until the
MCU reads-out the SPI register in which this status bit was set. Based on which status bit was set, the MCU can
decide whether it must keep the system in a safe state or whether it can resume with the operation of the
system.
The TPS653853-Q1 device is available in a 48-pin HTSSOP PowerPAD™ IC package.
Device Information (1)
PART NUMBER PACKAGE BODY SIZE
TPS65853-Q1 HTSSOP (48) 12.50 mm × 6.10 mm
TPS65385xx-Q1 5V
CAN wakeup CAN Interface
Multirail Power Supply
Ignition
EN
FETs
3.3 V / 5 V DRVOFF
Voltage Monitor
ENDRV
6 × PWM
RESET
NRES
3 × HS M
Motor-Driver
(DRV320x)
Error Signal ERROR
Monitor
Dual-Core Lock-Step 3 × LS
Microcontroller
SPI
Watchdog
SPI
SPI
DIAG_OUT
DIAG_OUT
Steering Angle
Monitor
Sensor 1 Sensor 2
3.3 V / 5 V
3.3 V / 5 V
Table of Contents
1 Features............................................................................1 5.2 Receiving Notification of Documentation Updates......5
2 Applications..................................................................... 1 5.3 Support Resources..................................................... 5
3 Description.......................................................................1 5.4 Trademarks................................................................. 5
3.1 Typical Application Diagram........................................3 5.5 Electrostatic Discharge Caution..................................5
4 Revision History.............................................................. 4 5.6 Glossary......................................................................5
5 Device and Documentation Support..............................5 6 Mechanical, Packaging, and Orderable Information.... 5
5.1 Documentation Support.............................................. 5
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (November 2017) to Revision B (February 2021) Page
• Added the Functional Safety-Compliant status to the Features section. ........................................................... 1
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
5.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 7-Oct-2021
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
O3853QDCARQ1 NRND HTSSOP DCA 48 2000 RoHS & Green Call TI Level-3-260C-168 HR -40 to 125 O3853
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Jan-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Jan-2023
Width (mm)
H
W
Pack Materials-Page 2
GENERIC PACKAGE VIEW
DCA 48 HTSSOP - 1.2 mm max height
12.5 x 6.1, 0.5 mm pitch SMALL OUTLINE PACKAGE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224608/A
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