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SEMICONDUCTOR TECHNICAL DATA by MPX4115A/D

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PRESSURE SENSOR
Motorola’s MPX4115A/MPXA4115A series sensor integrates on–chip, bipolar op amp 15 to 115 kPa (2.2 to 16.7 psi)
circuitry and thin film resistor networks to provide a high output signal and temperature 0.2 to 4.8 Volts Output
compensation. The small form factor and high reliability of on–chip integration make the
Motorola pressure sensor a logical and economical choice for the system designer.
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The MPX4115A/MPXA4115A series piezoresistive transducer is a state–of–the–art,

monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced UNIBODY PACKAGE
micromachining techniques, thin film metallization, and bipolar semiconductor processing to
provide an accurate, high level analog output signal that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure
sensor chip.
Features
• 1.5% Maximum Error over 0° to 85°C
MPX4115A
• Ideally suited for Microprocessor or Microcontroller– CASE 867
Based Systems
• Temperature Compensated from –40° to +125°C
• Durable Epoxy Unibody Element or Thermoplastic
(PPS) Surface Mount Package
Application Examples SMALL OUTLINE PACKAGE
• Aviation Altimeters
• Industrial Controls
• Engine Control
• Weather Stations and Weather Reporting Devices
MPX4115AP
*' MPXA4115A6U CASE 867B
CASE 482

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MPXA4115AC6U MPX4115AS
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1 N/C 5 N/C 1 Vout 4 N/C
Figure 1. Fully Integrated Pressure Sensor 2 VS 6 N/C 2 Gnd 5 N/C
Schematic 3 Gnd 7 N/C 3 VS 6 N/C
4 Vout 8 N/C NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
NOTE: Pins 1, 5, 6, 7, and 8 are
to external circuitry or ground. Pin 1
internal device connections. Do not
is noted by the notch in the lead.
connect to external circuitry or
ground. Pin 1 is noted by the notch in
REV 4 the lead.

Motorola Sensor Device Data

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MAXIMUM RATINGS(NOTE)
Parametrics Units
Maximum Pressure (P1
P2) Pmax 400 kPa
Storage Temperature Tstg –40° to +125° °C
Operating Temperature TA –40° to +125° °C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.

OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1
P2. Decoupling circuit shown in Figure 3
required to meet Electrical Specifications.)
Characteristic Symbol Min Typ Max Unit
Pressure Range POP 15 — 115 kPa
Supply Voltage(1) VS 4.85 5.1 5.35 Vdc
Supply Current Io — 7.0 10 mAdc
Minimum Pressure Offset(2) (0 to 85°C) Voff 0.135 0.204 0.273 Vdc
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@ VS = 5.1 Volts
Full Scale Output(3) (0 to 85°C) VFSO 4.725 4.794 4.863 Vdc
@ VS = 5.1 Volts
Full Scale Span(4) (0 to 85°C) VFSS 4.521 4.590 4.659 Vdc
@ VS = 5.1 Volts
Accuracy(5) (0 to 85°C) — — — ±1.5 %VFSS
Sensitivity V/P — 45.9 — mV/kPa
Response Time(6) tR — 1.0 — ms
Output Source Current at Full Scale Output Io+ — 0.1 — mAdc
Warm–Up Time(7) — — 20 — ms
Offset Stability(8) — — ±
0.5 — %VFSS
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
• Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential
pressure applied.
• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25°C.
• TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.

MECHANICAL CHARACTERISTICS
Characteristics Typ Unit
Weight, Basic Element (Case 867) 4.0 grams
Weight, Small Outline Package (Case 482) 1.5 grams

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Figure 2. Cross Sectional Diagram SOP Figure 3. Recommended power supply decoupling
(not to scale) and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
Freescale Semiconductor, Inc...

Figure 2 illustrates the absolute sensing chip in the basic Figure 3 shows the recommended decoupling circuit for
chip carrier (Case 482). interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.


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Figure 4. Output versus Absolute Pressure

Figure 4 shows the sensor output signal relative to pres- MPX4115A/MPXA4115A series pressure sensor operating
sure input. Typical minimum and maximum output curves characteristics, internal reliability and qualification tests are
are shown for operation over 0 to 85°C temperature range. based on use of dry air as the pressure media. Media other
The output will saturate outside of the rated pressure range. than dry air may have adverse effects on sensor perfor-
A fluorosilicone gel isolates the die surface and wire mance and long–term reliability. Contact the factory for
bonds from the environment, while allowing the pressure information regarding media compatibility in your application.
signal to be transmitted to the silicon diaphragm. The

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Transfer Function (MPX4115A, MPXA4115A)
Nominal Transfer Value: Vout = VS x (0.009 x P – 0.095)
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.1 ± 0.25 Vdc

Temperature Error Band

MPX4115A, MPXA4115A Series

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NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C

Pressure Error Band

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ORDERING INFORMATION — UNIBODY PACKAGE

Device Type Options Case No. MPX Series Order No. Marking
Basic Element Absolute, Element Only 867 MPX4115A MPX4115A
Ported Elements Absolute, Ported 867B MPX4115AP MPX4115AP
Absolute, Stove Pipe Port 867E MPX4115AS MPX4115A

ORDERING INFORMATION — SMALL OUTLINE PACKAGE

Device Type Options Case No. MPX Series Order No. Packing Options Marking
Basic Element Absolute, Element Only 482 MPXA4115A6U Rails MPXA4115A
Absolute, Element Only 482 MPXA4115A6T1 Tape and Reel MPXA4115A
Ported Element Absolute, Axial Port 482A MPXA4115AC6U Rails MPXA4115A
Absolute, Axial Port 482A MPXA4115AC6T1 Tape and Reel MPXA4115A

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INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total fottprint, the packages will self–align when subjected to a
design. The footprint for the surface mount packages must solder reflow process. It is always recommended to design
be the correct size to ensure proper solder connection inter- boards with a solder mask layer to avoid bridging and short-
face between the board and the package. With the correct ing between solder pads.

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SMALL OUTLINE PACKAGE DIMENSIONS

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UNIBODY PACKAGE DIMENSIONS

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PRESSURE SIDE PORTED (AP, GP)

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UNIBODY PACKAGE DIMENSIONS—CONTINUED

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